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公开(公告)号:US20240124640A1
公开(公告)日:2024-04-18
申请号:US18276352
申请日:2022-09-28
Applicant: LG Chem, Ltd.
Inventor: Jeong Hyun Lee , Yang Gu Kang
CPC classification number: C08G18/4277 , C08G18/0838 , C08K3/22 , C08K5/11 , C08K2003/2227 , C08K2201/003
Abstract: A resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity is provided. Also, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. A product comprising the curable composition or the cured body thereof is also provided.
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公开(公告)号:US11958074B2
公开(公告)日:2024-04-16
申请号:US17424308
申请日:2019-12-18
Applicant: KANSAI PAINT CO., LTD. , NISSAN MOTOR CO., LTD.
Inventor: Tatsuo Ohnuki , Kenichi Umezawa , Junpei Suzuki , Tomoyuki Okamoto , Chie Michiura , Takamitsu Ono , Yoshiaki Tomiyama
IPC: B05D7/26 , B05D7/00 , B05D7/02 , B05D7/14 , C08F212/08 , C08F220/14 , C08F220/18 , C08F220/56 , C08G18/62 , C08G18/77 , C08G18/79 , C08K3/013 , C08K3/36 , C08K9/06
CPC classification number: B05D7/572 , B05D7/02 , B05D7/14 , C08F212/08 , C08F220/14 , C08F220/1802 , C08F220/1804 , C08F220/56 , C08G18/6254 , C08G18/775 , C08G18/798 , C08K3/013 , C08K3/36 , C08K9/06 , B05D2201/02 , B05D2202/00 , B05D2401/20 , B05D2425/01 , B05D2425/02 , B05D2425/03 , B05D2451/00 , B05D2502/00 , B05D2503/00 , B05D2508/00 , B05D2601/22 , C08K2201/003 , C08K2201/011
Abstract: A method includes a step of applying an aqueous 2-package type first colored paint to form an uncured first colored coating film; a step of applying an aqueous 1-package type second colored paint to form an uncured second colored coating film; a step of applying a solvent-based 2-package type clear paint to form an uncured clear coating film; and a step of heating the uncured first colored coating film, the uncured second colored coating film and the uncured clear coating film to 75 to 100° C. to simultaneously cure these films. The solvent-based 2-package type clear paint contains a hydroxyl group-containing acrylic resin and a polyisocyanate compound in a ratio of 1.5 to 2.0 equivalents of isocyanate groups in the polyisocyanate compound relative to 1 equivalent of hydroxyl groups in the hydroxyl group-containing acrylic resin.
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公开(公告)号:US20240110037A1
公开(公告)日:2024-04-04
申请号:US17959492
申请日:2022-10-04
Applicant: Wildcard IP Holdings, LLC
Inventor: Joel T. Charlton
CPC classification number: C08K3/26 , C08J5/043 , C08K7/14 , C08J2375/06 , C08J2375/08 , C08K2003/265 , C08K2201/003 , C08K2201/014
Abstract: A building material consists essentially of 65% by weight to 75% by weight calcium carbonate, wherein the calcium carbonate has a particle size distribution having a first mode having a median particle diameter from 10 micrometers to 25 micrometers and a second mode having median particle diameter from 40 micrometers to 80 micrometers; 25% by weight to 35% by weight polyurethane form by reaction of (i) one or more isocyanates selected from the group consisting of diisocyanates, polyisocyanates and mixtures thereof and (ii) one or more polyols, wherein the one or more polyols is free of Mannich polyols; and 2% by weight to 10% by weight glass fiber material.
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公开(公告)号:US20240084080A1
公开(公告)日:2024-03-14
申请号:US18260623
申请日:2022-01-20
Applicant: BOREALIS AG
Inventor: Jingbo Wang , Markus Gahleitner , Klaus Bernreitner , Pauli Leskinen , Georg Grestenberger , Thomas Lummerstorfer
CPC classification number: C08J5/043 , C08F4/65927 , C08F10/06 , C08K7/14 , C08L23/12 , C08L23/16 , C08J2323/12 , C08J2323/16 , C08K2201/003 , C08K2201/004 , C08L2205/02 , C08L2205/22 , C08L2207/02 , C08L2207/066 , C08L2314/06
Abstract: The present invention is directed to a fiber reinforced composition (C) comprising a heterophasic polypropylene composition (HECO), fibers (F) and an adhesion promoter (AP) as well as an article comprising said fiber reinforced composition (C).
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公开(公告)号:US20240076492A1
公开(公告)日:2024-03-07
申请号:US18207976
申请日:2023-06-09
Applicant: HYUNDAI MOTOR COMPANY , KIA CORPORATION , KOLON PLASTICS, INC.
Inventor: Mingyun Chung , Seonghyeon Myeong
CPC classification number: C08L77/10 , C08K3/04 , C08K3/36 , C08K7/14 , C08K2201/003 , C08L2205/03
Abstract: A polyamide resin composition for a striker cap of a strut system includes 40 to 60 wt % of a polyamide 6 resin, 10 to 20 wt % of glass fiber, 20 to 30 wt % of an ethylene-based copolymer, and 5 to 10 wt % of a polyolefin resin to obtain excellent impact strength, high heat deflection temperature, and reduced bothersome noise.
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公开(公告)号:US11905371B2
公开(公告)日:2024-02-20
申请号:US16976701
申请日:2019-08-14
Applicant: LG CHEM, LTD.
Inventor: Kiho Ahn , Jongsung Park , Sang Woo Kim
CPC classification number: C08G73/026 , C08K3/04 , C08K3/30 , C08K5/3417 , C08K7/06 , C08K2003/3009 , C08K2201/003 , C08L27/18
Abstract: The present invention relates to a low friction resin composite comprising a binder comprising phthalonitrile-based resin, and three or more kinds of fillers dispersed in the binder.
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公开(公告)号:US20240034874A1
公开(公告)日:2024-02-01
申请号:US18466987
申请日:2023-09-14
Applicant: Ajinomoto Co., Inc.
Inventor: Shu IKEHIRA
CPC classification number: C08L63/00 , C08J5/18 , C08K3/013 , C08K5/0025 , H05K1/0326 , C08K2201/003
Abstract: A resin sheet including a support and a resin composition layer formed on the support, in which the resin composition layer contains (A) an epoxy resin, (B) an organic solvent, (C) an inorganic filler, and (D) a stress relaxing material, in which a content of an aromatic solvent having a boiling point of lower than 120° C. in the (B) component is in the range of 0 to 9% by mass relative to 100% by mass of total of the (B) component, can suppress an irregularity after lamination and a warpage after curing.
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公开(公告)号:US11884793B2
公开(公告)日:2024-01-30
申请号:US17074709
申请日:2020-10-20
Applicant: The Procter & Gamble Company
Inventor: Ping Wang , Liang Yang , Ruizhi Pei , Shuo Song , Fang Chen , Zihui Xu
IPC: C08K3/08 , C08K7/00 , C08J3/22 , C08J5/18 , B29C45/00 , B29K505/00 , B29K101/12 , B29K105/16
CPC classification number: C08K3/08 , B29C45/0013 , C08J3/226 , C08J5/18 , C08K7/00 , B29K2101/12 , B29K2105/16 , B29K2505/00 , C08J2323/12 , C08K2003/0812 , C08K2201/003 , C08K2201/004 , C08K2201/016
Abstract: The present invention relates to a molded article with a metallic appearance and a process for making the same. Particularly, the present invention relates to a molded article having a part that comprises a layer with a sandwich structure.
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公开(公告)号:US11814521B2
公开(公告)日:2023-11-14
申请号:US17357690
申请日:2021-06-24
Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
Inventor: Atsushi Sakamoto , Isao Iida
CPC classification number: C08L83/04 , C08K3/013 , C08K3/28 , C08L83/06 , C08G77/12 , C08G77/20 , C08K2003/282 , C08K2201/001 , C08K2201/003 , C08L2203/206 , C08L83/04 , C08L83/00 , C08L83/00 , C08K5/56 , C08K3/22
Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.
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公开(公告)号:US11814517B2
公开(公告)日:2023-11-14
申请号:US16849119
申请日:2020-04-15
Applicant: EMS-PATENT AG
Inventor: Etienne Aepli
CPC classification number: C08L77/00 , C08K7/14 , C08K2201/003 , C08K2201/014
Abstract: Polyamide moulding composition consisting of the following components
(A) 28.0-64.9 wt % of at least one polyamide,
(B) 15.0-40.0 wt % of glass fibres,
(C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 μm,
(D) 0.1-2.0 wt % of heat stabilizer,
(E) 0-5.0 wt % of additives
with the proviso that the sum of components (B) and (C) is in the range of 35.0 to 65.0 wt %, based on the sum of components (A) to (E), and the sum of components (A) to (E) makes 100 wt %.
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