公开(公告)号：US12043695B2

公开(公告)日：2024-07-23

申请号：US16972199

申请日：2019-06-05

Applicant: BASF SE

Inventor： Frank Thielbeer ,  Christian Koenig ,  Heinz-Dieter Lutter ,  Amir Doroodian ,  Udo Hadick

IPC: C08G18/38 ,  C08G18/42 ,  C08K3/34 ,  C08G101/00

CPC classification number: C08G18/4238 ,  C08G18/3895 ,  C08K3/34 ,  C08G2101/00 ,  C08K2201/005

Abstract: A process for preparing a dispersion of inorganic oxide particles in polyester polyol by mechanically mixing of the inorganic oxide particles at a temperature of more than 160° C. with a polyester polyol having an acid number in the range of from 0.05 to 1.5.

公开(公告)号：US20240239978A1

公开(公告)日：2024-07-18

申请号：US18559237

申请日：2022-05-04

Applicant: TORAY ADVANCED MATERIALS KOREA INC.

Inventor： Min Gi HONG ,  Young Ho KIM

IPC: C08J5/18 ,  B29C48/00 ,  B29C48/08 ,  B29C55/00 ,  B29C55/14 ,  B29C55/18 ,  B29K67/00 ,  B29K105/16 ,  B29K509/00 ,  C08K3/36 ,  H01M50/414 ,  H01M50/434 ,  H01M50/446 ,  H01M50/489

CPC classification number: C08J5/18 ,  C08K3/36 ,  H01M50/414 ,  H01M50/434 ,  H01M50/446 ,  H01M50/489 ,  B29C48/0018 ,  B29C48/08 ,  B29C55/005 ,  B29C55/14 ,  B29C55/18 ,  B29K2067/003 ,  B29K2105/16 ,  B29K2509/00 ,  C08J2367/02 ,  C08K2201/005

Abstract: A biaxially oriented polyester film according to the present invention is a biaxially oriented polyester film comprising inorganic particles and a polyester resin, wherein the hardness of a roll obtained by slitting a master roll on which the biaxially oriented polyester film is wound and then by being rewound thereon at a winding tension of 6.5 kg/m to 8.5 kg/m, a winding surface pressure of 35 kg/m to 50 kg/m and a winding rate of 300 m/min to 350 m/min, is 90 to 95 points. The biaxially oriented polyester film prevents the roll from forming wrinkles over time in a roll wound state, and therefore when used as an interlayer of a secondary battery separator, can prevent wrinkles from transferring onto the separator.

公开(公告)号：US12037508B2

公开(公告)日：2024-07-16

申请号：US17874848

申请日：2022-07-27

Applicant: Waymo LLC

Inventor： John T. Simpson

IPC: C09D127/12 ,  B05D1/00 ,  B05D3/14 ,  B05D5/08 ,  B05D7/00 ,  B05D7/24 ,  C03C17/00 ,  C03C17/34 ,  C08K3/36 ,  C08K7/22 ,  C08K9/04 ,  C08K9/08 ,  C08L27/12 ,  C09D7/20 ,  C09D7/62

CPC classification number: C09D127/12 ,  B05D1/005 ,  B05D3/142 ,  B05D5/083 ,  B05D7/24 ,  B05D7/50 ,  C03C17/007 ,  C03C17/3405 ,  C08L27/12 ,  C09D7/20 ,  C09D7/62 ,  B05D2203/35 ,  B05D2350/30 ,  B05D2350/60 ,  B05D2401/10 ,  B05D2506/10 ,  B05D2601/22 ,  C03C2217/445 ,  C03C2217/478 ,  C03C2217/76 ,  C08K3/36 ,  C08K7/22 ,  C08K9/04 ,  C08K9/08 ,  C08K2201/005 ,  C08L2312/08

Abstract: A composition that is easily applied, clear, well-bonded, and superhydrophobic is disclosed. In one aspect, the composition includes a hydrophobic fluorinated solvent, a binder comprising a hydrophobic fluorinated polymer, and hydrophobic fumed silica nanoparticles. Also disclosed is a structure including a substrate coated with the composition, as well as a method for making the composition and a method of coating a substrate with the composition.

公开(公告)号：US20240234653A9

公开(公告)日：2024-07-11

申请号：US18492977

申请日：2023-10-24

Applicant: Lextar Electronics Corporation

Inventor： Deng Kong SOH ,  Wen Wan TAI ,  Yu-Chun LEE

IPC: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C09K11/02 ,  H01L33/58

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C09K11/025 ,  H01L33/58 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2201/005 ,  C08K2201/011

Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(η0)/log(η28 )) of the logarithm of the viscosity ((log(η0)) of the composite encapsulation material at the shear rate of 1×10−3 s−1 to the logarithm of the viscosity (log(η∞)) of the composite encapsulation material at the shear rate of 1×102 s−1 is 1.1-2.5.

公开(公告)号：US12032121B2

公开(公告)日：2024-07-09

申请号：US17567257

申请日：2022-01-03

Applicant: BenQ Materials Corporation

Inventor： Che-Yu Ying ,  Yu-Wei Tu ,  Kuo-Hsuan Yu

IPC: G02B1/111 ,  C08J5/18 ,  C08K3/36 ,  C08K5/5419 ,  C08L33/10 ,  C08L83/08 ,  G02B5/02

CPC classification number: G02B1/111 ,  C08J5/18 ,  C08K3/36 ,  C08K5/5419 ,  C08L33/10 ,  C08L83/08 ,  G02B5/0294 ,  C08K2201/005 ,  C08K2201/011 ,  C08L2203/16 ,  C08L2203/20

Abstract: A high-haze anti-glare film is disclosed. The high-haze anti-glare film comprises a transparent substrate and an anti-glare layer on the substrate. The anti-glare layer comprises acrylate binder resin and amorphous silica microparticles. The total haze (Ht) of the anti-glare film is more than 20%, and the total haze is the sum of the surface haze (Hs) and the inner haze (Hi) of the anti-glare film, and the inner haze (Hi) and the total haze (Ht) satisfy the relation 0.01

公开(公告)号：US20240218217A1

公开(公告)日：2024-07-04

申请号：US18525254

申请日：2023-11-30

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Jinchao DONG ,  Naidong SHE ,  Yanhua ZHANG ,  Junqi TANG

IPC: C09J163/00 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C09J7/30

CPC classification number: C09J163/00 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C09J7/30 ,  C08K2201/005 ,  C08L2203/30 ,  C09J2400/10 ,  C09J2463/00 ,  C09J2467/005 ,  C09J2479/08

Abstract: Thermosetting resin composition and insulating adhesive film. The thermosetting resin composition comprises 30-70 parts of epoxy resin, 5-500 parts of a modified spherical silica powder, and 30-70 parts of a curing agent; the modified spherical silica powder comprises an amino-modified spherical silica powder with a D50 particle size of 0.1-2.0 μm and a coefficient of variation of ≥35% in particle size distribution. By using modified spherical silica powder in epoxy resin system and controlling its D50 particle size and coefficient of variation in particle size distribution, the resin composition can reduce melt viscosity of high-filling system and achieve a low melt viscosity in an insulating adhesive film conducive to the filling of fine circuits. The resin composition for preparation of a build-up adhesive FC-BGA film of a high-filling system has strong bite-etching resistance, low surface roughness after Desmear treatment, high adhesive force with electroless copper and low dielectric loss.

公开(公告)号：US12024605B2

公开(公告)日：2024-07-02

申请号：US17433978

申请日：2021-04-20

Applicant: SK MICROWORKS CO., LTD. ,  SK MICROWORKS SOLUTIONS CO., LTD.

Inventor： Sang Hun Choi ,  Dae Seong Oh ,  Han Jun Kim ,  Sun Hwan Kim ,  Jin Woo Lee ,  Heung Sik Kim ,  Jung Hee Ki ,  Yun Hee Seo

IPC: C08J5/18 ,  C08K3/30 ,  G02B1/14

CPC classification number: C08J5/18 ,  C08K3/30 ,  G02B1/14 ,  C08J2377/06 ,  C08K2003/3045 ,  C08K2201/005 ,  C08K2201/011

Abstract: The embodiments relate to a polyamide-based composite film with excellent curl characteristics, mechanical characteristics, and optical characteristics. The polyamide-based composite film comprises a base film comprising a polyamide-based polymer and a functional layer disposed on the base film, wherein when the polyamide-based composite film is placed on a surface light source such that the base film is in contact with the surface light source, light is irradiated from the surface light source, and the luminance value measured in the normal direction of the surface light source is 100%, the luminance value measured in the direction of 50° from the normal direction of the surface light source is 25% or more.

公开(公告)号：US20240209196A1

公开(公告)日：2024-06-27

申请号：US18171404

申请日：2023-02-20

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chin-Shang HSU ,  Pang-Hung LIU ,  Nien-Tsu LEE ,  Chien-Wei LU

IPC: C08L23/08 ,  B09B3/35 ,  B29B17/02 ,  B29B17/04 ,  C08J3/20 ,  C08J5/18 ,  C08K3/08

CPC classification number: C08L23/0853 ,  B09B3/35 ,  B29B17/02 ,  B29B17/04 ,  C08J3/203 ,  C08J5/18 ,  C08K3/08 ,  C08J2323/08 ,  C08J2427/12 ,  C08J2467/02 ,  C08K2003/023 ,  C08K2201/001 ,  C08K2201/005 ,  C08L2201/04 ,  C08L2205/03

Abstract: A method of forming an antistatic plastic includes providing a mixture containing 10 parts by weight of crystalline silicon particles, 1 to 30 parts by weight of an encapsulant, and 0.5 to 25 parts by weight of a backsheet material. The mixture is compounded to form an antistatic plastic, wherein the encapsulant is different from the backsheet material.

公开(公告)号：US20240199931A1

公开(公告)日：2024-06-20

申请号：US18555980

申请日：2021-06-16

Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC ,  ROHM AND HAAS ELECTRONIC MATERIALS (SHANGHAI) LTD.

Inventor： HUIDE D. ZHU ,  MATTHEW FELDPAUSCH ,  WEIGUO SHAO ,  TYLER AUVIL ,  LIRONG ZHOU ,  DANIEL SOPHIEA ,  ANDREAS LUTZ

IPC: C09J175/08 ,  C08G18/12 ,  C08G18/20 ,  C08G18/24 ,  C08G18/40 ,  C08G18/42 ,  C08G18/48 ,  C08G18/72 ,  C08G18/75 ,  C08G18/76 ,  C08K3/22 ,  C08K5/3492 ,  C08K5/5313 ,  C09J9/00

CPC classification number: C09J175/08 ,  C08G18/12 ,  C08G18/2081 ,  C08G18/244 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4812 ,  C08G18/4825 ,  C08G18/4829 ,  C08G18/721 ,  C08G18/755 ,  C08G18/7671 ,  C09J9/00 ,  C08K2003/2227 ,  C08K5/34928 ,  C08K5/5313 ,  C08K2201/005

Abstract: Provided herein is a one-component polyurethane adhesive composition showing good mechanical characteristics, non-sag performance, product storage stability, as well as flame-retardancy.

公开(公告)号：US12015156B2

公开(公告)日：2024-06-18

申请号：US17987605

申请日：2022-11-15

Applicant: UCHICAGO ARGONNE, LLC

Inventor： Lu Zhang ,  Zhangxing Shi ,  Andrew Jansen ,  Stephen Trask

IPC: H01B1/22 ,  C08K3/02 ,  C08K3/04 ,  C09D1/00 ,  C09D7/20 ,  C09D7/40 ,  H01M4/04 ,  H01M4/134 ,  H01M4/1395 ,  H01M4/38 ,  H01M4/60 ,  H01M4/62 ,  H01M10/0525 ,  H01M4/02

CPC classification number: H01M4/622 ,  C08K3/02 ,  C08K3/04 ,  C09D1/00 ,  C09D7/20 ,  C09D7/67 ,  H01B1/22 ,  H01M4/0404 ,  H01M4/0471 ,  H01M4/134 ,  H01M4/1395 ,  H01M4/386 ,  H01M10/0525 ,  C08K2003/023 ,  C08K2201/005 ,  C08K2201/011 ,  H01M2004/027 ,  H01M2220/20

Abstract: An silicon-containing electrode is formed by coating a silicon-containing slurry onto a conductive current collector. The slurry comprises a binder solution comprising a poly(carboxylic acid) binder dissolved in a mixed solvent system comprising an amide solvent of Formula I, as described herein, and a second solvent which can be water and/or an organic solvent. The binder preferably comprises poly(acrylic acid). The mixed solvent system comprises about 10 to about 99 vol % of the amide solvent of Formula I. The binder solution is utilized as a solvent for a slurry of silicon-containing particles for preparing the silicon-containing electrode. The slurries comprising the mixed solvent system have higher viscosity and are more stable than slurries containing the same concentrations of silicon particles, carbon particles, and binder in water as the sole solvent.