公开(公告)号：US20180149855A1

公开(公告)日：2018-05-31

申请号：US15568770

申请日：2016-04-22

Applicant: The University of British Columbia

Inventor： Keng C. CHOU ,  Reza TAFTEH

IPC: G02B21/26 ,  G06T7/70 ,  G01N21/64 ,  G02B21/16 ,  G02B21/24 ,  G02B21/36 ,  G02B27/32 ,  G02B21/34

CPC classification number: G02B21/26 ,  G01N21/6458 ,  G01N2021/6463 ,  G01N2201/063 ,  G02B3/14 ,  G02B21/06 ,  G02B21/16 ,  G02B21/241 ,  G02B21/244 ,  G02B21/34 ,  G02B21/361 ,  G02B21/367 ,  G02B27/0075 ,  G02B27/32 ,  G06T7/70 ,  G06T2207/10056 ,  G06T2207/10064 ,  G06T2207/30204

Abstract: Methods and apparatus for deep microscopic super resolution imaging use two independent and variable focal planes. Movements of fiducial markers imaged using one focal plane are monitored and used to provide real-time or near real-time correction for sample drift. A second focal plane may be used to collect light for super-resolution imaging of a sample. A prototype embodiment has produced low drift when imaging many microns deeper than the fiducial markers.

公开(公告)号：US09921148B2

公开(公告)日：2018-03-20

申请号：US14786144

申请日：2014-04-20

Applicant: MOBILEODT LTD

Inventor： David Levitz ,  Ariel Beery

IPC: G01J4/00 ,  G01N21/21 ,  G01N21/956

CPC classification number: G01N21/21 ,  G01N21/956 ,  G01N2201/063

Abstract: A polarized light imaging apparatus is provided. In an embodiment, the apparatus comprises a light source for producing light beams; an illumination optic coupled to the light source for guiding the light beams towards the sample; a linear polarizer coupled to the illumination optic and configured to produce a linearly polarized light towards the sample respective of the light beams; a TIR birefringent polarizing prism (BPP) coupled to the sample to maximize a refraction difference between ordinary waves and extraordinary waves of light returning from the sample; and a detection optic unit coupled to the non-TIR BPP for guiding the light waves returning from the sample towards a single polarization sensitive sensor element (SE), the SE is configured to capture at least one frame of the sample respective of the light waves returning from the superficial single-scattering layer of the sample apart from the deeper diffuse layer.

公开(公告)号：US09829441B2

公开(公告)日：2017-11-28

申请号：US15023112

申请日：2014-11-27

Applicant: NEXTIN, INC. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Hoon Park ,  Segal Ram

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95 ,  H01L21/66

CPC classification number: G01N21/8851 ,  G01N21/8806 ,  G01N21/9501 ,  G01N2021/8887 ,  G01N2201/063 ,  H01L22/12

Abstract: ProA wafer image inspection apparatus for inspecting defects of a semiconductor wafer comprises: a lighting portion for generating light; a lens portion for obtaining a wafer image, which is reflected after the light has been reflected onto a wafer to be inspected, and delivering the wafer image by lighting same in one direction; a dividing optical element for dividing the wafer image delivered from the lens portion; an image detection portion comprising a plurality of image-capturing elements, which are installed so that images which have passed through the lens portion and the dividing optical element are respectively formed on different focus positions; and an image processing portion for combining the images on different focus positions captured by the plurality of image pick-up elements to form a TSOM image, and comparing the TSOM image with a TSOM image of a normal semiconductor apparatus part to determine whether an object is defective.

公开(公告)号：US09739600B1

公开(公告)日：2017-08-22

申请号：US15184034

申请日：2016-06-16

Applicant: FOGALE NANOTECH

Inventor： Gilles Fresquet ,  Alain Courteville ,  Philippe Gastaldo

IPC: G01N21/00 ,  G01B11/22 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01B11/022 ,  G01B11/0608 ,  G01B11/22 ,  G01B11/245 ,  G01B2210/50 ,  G01B2210/56 ,  G01J3/0208 ,  G01J3/0218 ,  G01J3/18 ,  G01J3/453 ,  G01N21/8851 ,  G01N21/956 ,  G01N2201/063 ,  G01N2201/0833 ,  G01N2201/105 ,  G02B21/0064 ,  H01L22/12

Abstract: A confocal chromatic device for inspecting the surface of an object such as a wafer, including a plurality of optical measurement channels with collection apertures arranged for collecting the light reflected by the object through a chromatic lens at a plurality of measurement points, the plurality of optical measurement channels including optical measurement channels with an intensity detector for measuring a total intensity of the collected light. A method is also provided for inspecting the surface of an object such as a wafer including tridimensional structures.

公开(公告)号：US09606062B2

公开(公告)日：2017-03-28

申请号：US14374928

申请日：2013-09-02

Applicant: INDIAN INSTITUTE OF SCIENCE

Inventor： Siva Umapathy ,  Sanchita Sil ,  John Kiran

IPC: G01J3/44 ,  G01N21/65 ,  G01N21/51 ,  G01N33/22

CPC classification number: G01N21/65 ,  G01N21/51 ,  G01N33/227 ,  G01N2201/06113 ,  G01N2201/063

Abstract: The invention provides a method for detection of hazardous chemicals in a non-metallic container. The method comprises of irradiating the sample at a predefined location with an electromagnetic radiation of specific wavelength; selectively capturing a certain component of the scattered electromagnetic radiation to obtain a plurality of profiles; and filtering the profiles to obtain a signature specific to at least one hazardous chemical present in the container. The invention provides a system for obtaining a signature specific to the hazardous chemicals in the container.

公开(公告)号：US20170016817A1

公开(公告)日：2017-01-19

申请号：US14799894

申请日：2015-07-15

Applicant: International Business Machines Corporation

Inventor： Tymon Barwicz ,  William M. Green ,  Yves C. Martin ,  Jason S. Orcutt ,  Lionel Tombez

IPC: G01N21/39 ,  G01N21/3504

CPC classification number: G01N21/39 ,  G01J3/0218 ,  G01J3/0256 ,  G01J3/42 ,  G01J2003/423 ,  G01N21/3504 ,  G01N21/552 ,  G01N2021/399 ,  G01N2201/06113 ,  G01N2201/063 ,  G01N2201/08 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/122 ,  G02B2006/12138 ,  G02B2006/1215

Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.

Abstract translation: 描述了在衬底上制造气体传感器的方法和制造在包括光学和电子部件的衬底上的气体传感器。 该方法包括制造激光器以在波导内的波长范围上输出光，制造分离器以将由激光器输出的光分成参考波导和检测波导，制造参考单元以容纳参考波导和 参考气体 参考波导的输出耦合到第一光学检测器，并且检测波导的输出耦合到第二光学检测器以识别或定量环境气体。

公开(公告)号：US20170003230A1

公开(公告)日：2017-01-05

申请号：US15023112

申请日：2014-11-27

Applicant: NEXTIN, INC. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Hoon PARK ,  Segal RAM

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N21/8806 ,  G01N21/9501 ,  G01N2021/8887 ,  G01N2201/063 ,  H01L22/12

Abstract: ProA wafer image inspection apparatus for inspecting defects of a semiconductor wafer comprises: a lighting portion for generating light; a lens portion for obtaining a wafer image, which is reflected after the light has been reflected onto a wafer to be inspected, and delivering the wafer image by lighting same in one direction; a dividing optical element for dividing the wafer image delivered from the lens portion; an image detection portion comprising a plurality of image-capturing elements, which are installed so that images which have passed through the lens portion and the dividing optical element are respectively formed on different focus positions; and an image processing portion for combining the images on different focus positions captured by the plurality of image pick-up elements to form a TSOM image, and comparing the TSOM image with a TSOM image of a normal semiconductor apparatus part to determine whether an object is defective.

Abstract translation: 用于检查半导体晶片的缺陷的ProA晶片图像检查装置包括：用于产生光的照明部分; 用于获得晶片图像的透镜部分，其在光已经被反射到要检查的晶片上之后被反射，并且通过沿一个方向照亮晶片图像来传送晶片图像; 用于分割从透镜部分传送的晶片图像的分割光学元件; 图像检测部分包括多个图像捕获元件，其被安装成使得已经通过透镜部分和分割光学元件的图像分别形成在不同的聚焦位置; 以及图像处理部分，用于组合由多个摄像元件捕获的不同对焦位置上的图像，以形成TSOM图像，并将TSOM图像与正常半导体装置部分的TSOM图像进行比较，以确定对象是否为 有缺陷

公开(公告)号：US20150276618A1

公开(公告)日：2015-10-01

申请号：US14666942

申请日：2015-03-24

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Ankit Jain ,  Michael Lennek

IPC: G01N21/93 ,  H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8877 ,  G01N2201/063 ,  G01N2201/12 ,  H01L22/20

Abstract: Methods and systems for generating defect samples are provided. One method includes identifying a set of defects detected on a wafer having the most diversity in values of at least one defect attribute and generating different tiles for different defects in the set. The tiles define a portion of all values for the at least one attribute of all defects detected on the wafer that are closer to the values for the at least one attribute of their corresponding defects than the values for the at least one attribute of other defects. In addition, the method includes separating the defects on the wafer into sample bins corresponding to the different tiles based on their values of the at least one attribute, randomly selecting defect(s) from each of two or more of the sample bins, and creating a defect sample for the wafer that includes the randomly selected defects.

Abstract translation: 提供了生成缺陷样本的方法和系统。 一种方法包括识别在具有至少一个缺陷属性值的多样性最大的晶片上检测到的一组缺陷，并为该组中的不同缺陷生成不同的瓦片。 瓦片定义了在晶片上检测到的所有缺陷的至少一个属性的所有值的一部分，其比其它缺陷的至少一个属性的值更接近于其相应缺陷的至少一个属性的值。 另外，该方法包括：基于它们的至少一个属性值，从两个或多个样本仓中的每一个中随机选择缺陷，将晶片上的缺陷分离成与不同瓦片对应的样品仓，并创建 用于晶片的缺陷样品，其包括随机选择的缺陷。

公开(公告)号：US20150177161A1

公开(公告)日：2015-06-25

申请号：US14416752

申请日：2013-07-03

Applicant: Hitachi High - Technologies Corporation

Inventor： Takahiro Jingu

IPC: G01N21/95 ,  G01N21/01 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/01 ,  G01N21/88 ,  G01N21/94 ,  G01N2201/063 ,  H01L21/67288

Abstract: In an inspection apparatus, inspection is carried out by linearly moving a wafer while rotating the wafer with respect to light. In a case where the wafer is rotated, the velocity of flow of air in outer regions of the wafer is increased, and there is a possibility that the flow of the air in the outer regions cause particles contained in an atmosphere in the vicinity of the wafer to be adhered to the wafer. In a case where such particles are adhered to the wafer, the particles are also detected as a defect, and therefore yields and cleanliness in a semiconductor production process cannot be correctly evaluated. Therefore, it is desirable that adhesion of the particles contained in the atmosphere in the vicinity of the wafer to the wafer be reduced as much as possible. Further, it is expected that, when, for example, rotation speed of the wafer is increased or a diameter of the wafer is increased, such particles are adhered further remarkably. This point has not been satisfactorily considered in the conventional arts. The invention has a feature that a conductor such as a draft to outer regions is supplied from above a substrate while the substrate is being rotated and the supplied conductor is exhausted on outside of the substrate.

Abstract translation: 在检查装置中，通过在使晶片相对于光线旋转的同时线性移动晶片来进行检查。 在晶片旋转的情况下，晶片的外部区域的空气流速度增加，存在外部空气的流动使得包含在气氛附近的空气中的颗粒的可能性 晶片被粘附到晶片上。 在这样的颗粒粘附到晶片的情况下，也将颗粒作为缺陷进行检测，因此不能正确地评价半导体制造工序的产率和清洁度。 因此，尽可能地减少包含在晶片附近的气氛中的颗粒与晶片的粘附。 此外，例如，当例如晶片的旋转速度增加或晶片的直径增加时，这种颗粒进一步显着地粘附。 这一点在传统技术中没有被令人满意地考虑。 本发明的特征在于，在基板旋转的同时从基板的上方向外部区域供电等导体，并且将供给的导体排出到基板的外部。

公开(公告)号：US08953156B2

公开(公告)日：2015-02-10

申请号：US13510300

申请日：2010-11-12

Applicant: Yuko Otani ,  Takehiro Tachizaki ,  Masahiro Watanabe ,  Shunichi Matsumoto

Inventor： Yuko Otani ,  Takehiro Tachizaki ,  Masahiro Watanabe ,  Shunichi Matsumoto

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/21 ,  G01N21/956 ,  G01N21/88

CPC classification number: G01N21/8806 ,  G01N21/21 ,  G01N21/47 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95607 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/8848 ,  G01N2201/06113 ,  G01N2201/063

Abstract: The disclosed device, which, using an electron microscope or the like, minutely observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, can reliably insert a defect to be observed into the field of an electron microscope or the like, and can be a device of a smaller scale. The electron microscope, which observes defects detected by an optical appearance-inspecting device or by an optical defect-inspecting device, has a configuration wherein an optical microscope that re-detects defects is incorporated, and a spatial filter and a distribution polarization element are inserted at the pupil plane when making dark-field observations using this optical microscope. The electron microscope, which observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, has a configuration wherein an optical microscope that re-detects defects is incorporated, and a distribution filter is inserted at the pupil plane when making dark-field observations using this optical microscope.