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公开(公告)号：US20170291984A1
公开(公告)日：2017-10-12
申请号：US15516967
申请日：2015-10-23
Applicant: NITTO DENKO CORPORATION
Inventor： Tomoyuki HIRAYAMA
CPC classification number: C08G59/186 , C08G59/226 , C08G59/68 , C08L63/00 , G02B6/12 , G03F7/0043 , G03F7/038 , G03F7/0385 , H01L51/0034 , H01L51/0097 , H05K1/0274 , H05K1/118 , H05K2201/0108 , H05K2203/0514 , H05K2203/0525
Abstract: Disclosed is a photosensitive resin composition for an optical waveguide containing a resin component and a photoacid generator. In the photosensitive resin composition, the resin component is constituted of an epoxy resin component containing both an aromatic epoxy resin and an aliphatic epoxy resin, and the content of the aromatic epoxy resin is 55 wt. % or more and less than 80 wt. % of the entirety of the epoxy resin component and the content of the aliphatic epoxy resin is more than 20 wt. % and 45 wt. % or less of the entirety of the epoxy resin component. Accordingly, for example, when a core layer of an optical waveguide is formed using the disclosed photosensitive resin composition for an optical waveguide, a core layer of an optical waveguide having satisfactorily low tackiness and high transparency while maintaining satisfactory roll-to-roll compatibility and a high resolution patterning property can be formed.
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公开(公告)号：US20170287884A1
公开(公告)日：2017-10-05
申请号：US15626883
申请日：2017-06-19
Applicant: ROHM CO., LTD.
Inventor： Takayuki ISHIHARA , Satohiro KIGOSHI
CPC classification number: H01L25/13 , F21K9/20 , F21K9/68 , F21K9/69 , F21V5/04 , F21V7/0091 , F21V23/005 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L33/38 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H05K1/0274 , H05K1/181 , H05K3/284 , H05K2201/0108 , H05K2201/10106 , H05K2203/049 , H01L2924/00014
Abstract: An LED lighting apparatus includes an LED substrate, a LED chip, a sealing resin member, and a reflecting face. The LED substrate has a main surface. The LED chip is mounted on the main surface of the LED substrate. The sealing resin member is made of a material that transmits light from the LED chip. The sealing resin member covers the LED chip. The sealing resin member has a shape bulging in the direction in which the main surface faces. The reflecting face surrounds the sealing resin member.
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公开(公告)号：US20170265307A1
公开(公告)日：2017-09-14
申请号：US15529253
申请日：2015-11-12
Applicant: Flexbright Oy
Inventor： Pekka MAKKONEN , Kimmo KERÄNEN
CPC classification number: H05K1/189 , F21Y2107/60 , F21Y2107/70 , F21Y2113/10 , F21Y2113/13 , F21Y2115/10 , H01L27/32 , H01L2924/0002 , H05B33/0842 , H05B33/0863 , H05B37/0245 , H05K1/0274 , H05K1/0298 , H05K2201/0108 , H05K2201/09709 , H05K2201/10106 , H01L2924/00
Abstract: A flexible and illuminating multilayer structure wherein the flexible and illuminating multilayer structure has at least two flexible foils laminated together. Each foil has a flexible electrically conductive pattern layer and LED units distributed over the foil, the LED units being electrically contacted with the contact pattern. The LED units of a foil are positioned between positions of the LED units of the other foils. At least one foil of the multilayer structure, towards which at least one of the LED units is configured to radiate light, is transparent to the light. Brightness of the LED units is at least foil-specifically controllable with operational electric power fed to the foils through the contact pattern. The LED units of at least one foil are of a different tone or color or are controlled to output a different tone or color than the LED units of at least one other foil.
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24.发明授权公开(公告)号：US09754698B2
公开(公告)日：2017-09-05
申请号：US14523205
申请日：2014-10-24
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Dong Myeong Shin , Young Kwon Koo , Oh Hyeon Hwang , Kyoung Ku Kang , Do Young Kim , Dae Seob Shim
CPC classification number: H01B1/22 , H01B13/30 , H05K1/097 , H05K2201/0108 , H05K2201/026 , Y10T428/31678
Abstract: A transparent conductor, a method for preparing the same, and an optical display including the same, the transparent conductor including a base layer; and a conductive layer on the base layer, the conductive layer including metal nanowires and a matrix, wherein the transparent conductor has a transmissive b* value of about 1.5 or less, and the matrix is prepared from a matrix composition including a tri-functional monomer and one of a penta-functional monomer or a hexa-functional monomer a base layer; and a conductive layer formed on the base layer and including metal nanowires and a matrix, wherein the transparent conductor has a transmissive b* value of about 1.5 or less, and the matrix is formed of a composition including a penta- or hexa-functional monomer and a tri-functional monomer.
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公开(公告)号：US09752764B2
公开(公告)日：2017-09-05
申请号：US14315343
申请日：2014-06-26
Inventor： MaoJun Cao , Hui Chen , Wei Tan
IPC: F21V23/00 , H05K1/00 , H01L25/16 , H01L33/50 , H05K1/02 , H05K1/03 , F21Y101/00 , F21Y103/33 , F21Y115/10 , H05K1/18 , H05K3/34
CPC classification number: F21V23/005 , F21Y2101/00 , F21Y2103/33 , F21Y2115/10 , H01L25/167 , H01L33/502 , H01L2924/0002 , H05K1/00 , H05K1/0274 , H05K1/0306 , H05K1/181 , H05K3/3463 , H05K2201/0108 , H05K2201/10106 , H01L2924/00
Abstract: A wide-angle emitting LED driven by built-in power and an assembling method are provided. The wide-angle emitting LED includes a transparent substrate, at least one light-emitting chip, and a driving circuit component. The front of the transparent substrate is provided with a printed circuit where a portion of an upper surface of the transparent substrate is provided with a plurality of conductive bonding pads. Each of the at least one light-emitting chip is bonded on the front of the transparent substrate, and the at least one light-emitting chip is electrically connected to the conductive bonding pads by metal wires. In addition, the driving circuit component is bonded with the transparent substrate and the conductive bonding pads and is electrically connected to the conductive bonding pads by metal wires.
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Patent Agency Ranking
公开(公告)号：US09750131B2
公开(公告)日：2017-08-29
申请号：US14774593
申请日：2014-07-30
Applicant: LG CHEM, LTD.
Inventor： Jiehyun Seong , Jinmi Jung , Yong Goo Son , Seung Heon Lee , Song Ho Jang , Bu Gon Shin , Ji Young Hwang
IPC: H05K1/00 , H05K1/02 , H01L51/00 , H01L51/10 , H01L51/44 , H01L51/52 , H05K1/03 , H05K1/09 , H05K3/06
CPC classification number: H05K1/0274 , H01L51/0023 , H01L51/105 , H01L51/442 , H01L51/445 , H01L51/5212 , H05K1/0306 , H05K1/09 , H05K3/06 , H05K2201/0108 , H05K2201/0302 , H05K2201/0326 , H05K2201/0329 , H05K2201/09681 , Y02E10/549 , Y02P70/521
Abstract: Provided are a transparent conductive laminate, a transparent electrode including the transparent conductive laminate, and a manufacturing method for the transparent conductive laminate.
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公开(公告)号：US09748514B2
公开(公告)日：2017-08-29
申请号：US14896314
申请日：2014-06-06
Applicant: Würth Elektronik Gmbh & Co. KG
Inventor： Jan Kostelnik , Jürgen Wolf
IPC: H01L51/00 , H01L51/52 , H01L31/02 , H01L31/0203 , H01L31/048 , H01L33/56 , H01L33/62 , H01L23/00 , H05K1/02 , H05K1/14 , H05K1/18 , H01L31/05 , H01L31/18 , H01L51/56 , H05K3/46
CPC classification number: H01L51/5237 , H01L24/19 , H01L31/02005 , H01L31/02008 , H01L31/0203 , H01L31/048 , H01L31/05 , H01L31/1884 , H01L33/56 , H01L33/62 , H01L51/0022 , H01L51/5203 , H01L51/524 , H01L51/56 , H01L2251/5369 , H01L2924/12044 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H05K1/0274 , H05K1/144 , H05K1/185 , H05K3/4644 , H05K2201/0108 , H05K2201/10106 , H05K2201/10121 , Y02E10/50 , H01L2924/00
Abstract: The invention relates to a method for producing an optical module, comprising the following steps: a) providing a chip having an optical element integrated in the chip, wherein the optical element bas a first electrode and a second electrode, and wherein the chip has a first connection contact for the first electrode and a second connection contact for the second electrode, such that an operating voltage for the optical element can be applied between the first connection contact and the second connection contact, and wherein the chip has an optically active side, which is designed to emit and/or to receive radiation; b) connecting the chip to a film, such that the film completely covers the optically active side of the chip, wherein the film is a film made from acrylate, polyarylate, or polyurethane, wherein the film, at least in the region located above the optically active side, is transparent to radiation which. when operating voltage is applied, can be emitted or received by the optical element; c) contacting the first connection contact of the chip by means of a conducting track arranged on the film and contacting the second connection contact by means of an additional conducting track.
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公开(公告)号：US20170205910A1
公开(公告)日：2017-07-20
申请号：US15325415
申请日：2016-01-26
Inventor： Bo LIU , Long XIA , Qinghua JIANG , Xiaohe LI
CPC classification number: G06F3/044 , C23C14/086 , C23C14/5873 , G02F1/13338 , G02F1/133514 , G06F3/0412 , G06F3/0416 , G06F2203/04103 , G06F2203/04107 , H01L27/323 , H05K1/0274 , H05K2201/0108
Abstract: The touch display panel comprises an array substrate, a color film substrate a touch electrode layer located at a side of the color film substrate away from the array substrate, and a transparent electrically conductive layer between the color film substrate and the touch electrode layer and insulated from the touch electrode layer. The transparent electrically conductive layer comprises a first area and a second area, a thickness of the transparent electrically conductive layer in the first area is greater than a thickness of the transparent electrically conductive layer in the second area, the transparent electrically conductive layer is suitable for being electrically connected to ground. A projection area of the touch electrode layer on the color film substrate overlaps with a projection area of the transparent electrically conductive layer located in the second area on the color film substrate.
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公开(公告)号：US20170164485A1
公开(公告)日：2017-06-08
申请号：US15346096
申请日：2016-11-08
Applicant: LG Display Co., Ltd.
Inventor： Jin-Hyun JUNG , BuYeol LEE
CPC classification number: H05K5/0017 , G02F1/13452 , G02F2203/01 , H01L51/52 , H01L51/5237 , H05K1/0274 , H05K1/14 , H05K1/144 , H05K3/363 , H05K2201/0108 , H05K2201/041 , H05K2201/056 , H05K2201/10128 , H05K2201/10681
Abstract: Disclosed is a display device for realizing a transparent image. The display device includes a display panel, a source printed circuit board (PCB) on which a signal line is mounted, a control PCB on which a timing controller is mounted, and a circuit film connected to the display panel at one side of the circuit film and connected to the source PCB at another side. The source PCB and the control PCB are disposed to overlap each other.
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公开(公告)号：US09666337B2
公开(公告)日：2017-05-30
申请号：US14486775
申请日：2014-09-15
Applicant: Sinovia Technologies
Inventor： Whitney Gaynor , George Burkhard
IPC: H01B13/00 , B82Y10/00 , B82Y40/00 , G03F7/00 , G03F7/004 , G03F7/16 , G06F3/041 , H01B1/22 , H01L51/44 , B82Y20/00
CPC classification number: G06F3/041 , B05D3/007 , B82Y10/00 , B82Y20/00 , B82Y40/00 , G03F1/24 , G03F7/0002 , G03F7/0047 , G03F7/038 , G03F7/0388 , G03F7/161 , G06F3/044 , G06F2203/04103 , H01B1/22 , H01B5/14 , H01B13/0013 , H01L51/444 , H01L51/5203 , H05K1/0271 , H05K1/0274 , H05K1/036 , H05K1/09 , H05K3/103 , H05K2201/0108 , H05K2201/0137 , H05K2203/10 , Y10T428/24355 , Y10T442/188 , Y10T442/191
Abstract: A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of nanowires of an inorganic material. The nanowires are, in isolated form, characterized by a first conductivity stability temperature. Further, the plurality of nanowires is embedded within at least a region of the layer of cross-linked polymer, where the region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film having a second conductivity stability temperature that is greater than the first conductivity stability temperature.
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