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    Method for manufacturing laminated circuit board
    24.
    发明授权
    Method for manufacturing laminated circuit board 有权
    叠层电路板的制造方法

    公开(公告)号：US09079382B2

    公开(公告)日：2015-07-14

    申请号：US12922253

    申请日：2009-03-25

    Applicant: Tom Marttila

    Inventor： Tom Marttila

    IPC: H05K3/02 ,  B32B38/10 ,  G08B13/24 ,  H05K3/04 ,  B32B37/12 ,  H05K1/03 ,  H05K3/38 ,  H05K3/40

    CPC classification number: H05K1/115 ,  B32B37/1292 ,  B32B38/10 ,  B32B2310/0843 ,  B32B2457/08 ,  G08B13/244 ,  H05K1/0366 ,  H05K1/0386 ,  H05K3/027 ,  H05K3/046 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0284 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0522 ,  H05K2203/1388 ,  H05K2203/1394 ,  H05K2203/1545 ,  Y10T29/49156

    Abstract: A method for manufacturing a circuit board featuring conductive patterns, said method comprising the following steps of: i) affixing a conductive layer, such as a metal foil (3), to a substrate material (1) selectively, such that a part of the conductive layer, such as the metal foil (3), comprising desired areas (3a) for the final product and narrow areas (3c) between the final product's conducting areas, is affixed to the substrate material (1) by means of a bond (2), and removal-intended more extensive areas (3b) of the conductive layer, for example the metal foil (3), are left substantially unattached to the substrate material in such a way that the removable area (3b) is in attachment with the substrate material (1) by not more than its edge portion to be patterned in a subsequent step ii) and possibly by sites which preclude a release of the removable areas prior to a step iii); ii) patterning, by a removal of material, the conductive layer, such as the metal foil (3), from narrow gaps between the desired conducting areas (3a), and from an outer periphery of the area (3b) removable in a solid state, for establishing conductor patterns; iii) removing the removable areas (3b), not affixed to the substrate material (1), from the conductive layer, such as the metal foil (3), in a solid state after the conductive layer's edge area, which was removed from the removable area's outer periphery during the course of step ii), no longer holds the removable areas (3b) attached by their edges to the substrate material.

    Abstract translation: 一种制造具有导电图案的电路板的方法，所述方法包括以下步骤：i）选择性地将诸如金属箔（3）的导电层固定到基底材料（1）上，使得部分 导电层，例如金属箔（3），其包含用于最终产品的所需区域（3a）和最终产品的导电区域之间的狭窄区域（3c），通过粘合剂（1）固定到基底材料（1） 导电层，例如金属箔（3）的移除目的更广泛的区域（3b）基本上不附着于基底材料，使得可移除区域（3b）与 基底材料（1）不超过其后续步骤ii）中待图案化的边缘部分，并且可能通过在步骤iii）之前排除可释放区域的释放的部位; ii）通过从所需导电区域（3a）之间的狭窄间隙和从固体可移除的区域（3b）的外周边去除导电层（例如金属箔（3））的图案， 状态，用于建立导体图案; iii）在导电层的边缘区域从固体状态除去导电层的边缘区域之后，从导电层（例如金属箔（3））上去除不附着于基底材料（1）的可移除区域（3b） 在步骤ii）的过程中，可移除区域的外围不再将其边缘附着的可移除区域（3b）保持在衬底材料上。

    Electronic Circuit
    27.
    发明申请
    Electronic Circuit 失效
    电子电路

    公开(公告)号：US20120184326A1

    公开(公告)日：2012-07-19

    申请号：US13387421

    申请日：2010-06-17

    Applicant: Richard Asterland

    Inventor： Richard Asterland

    IPC: H05K1/18 ,  H04W88/02

    CPC classification number: H05K1/0216 ,  H05K1/0366 ,  H05K3/4688 ,  H05K2201/0284 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/10689

    Abstract: Electronic circuits (1, 101) are disclosed. The electronic circuits comprise a first and a second integrated circuit (10a, 110a, 10b, 110b) and a printed circuit board (PCB) (15, 115). The PCB comprises dielectric layers (30a-c, 130) of polymer-based materials having different dissipation factors arranged in accordance with various embodiments for suppressing noise.

    Abstract translation: 公开了电子电路（1,101）。 电子电路包括第一和第二集成电路（10a，110a，10b，110b）和印刷电路板（PCB）（15,115）。 PCB包括根据用于抑制噪声的各种实施例布置的具有不同耗散因数的基于聚合物的材料的介电层（30a-c，130）。

    METHOD FOR APPLYING A METAL ON PAPER
    29.
    发明申请
    METHOD FOR APPLYING A METAL ON PAPER 审中-公开
    在纸上应用金属的方法

    公开(公告)号：US20090297840A1

    公开(公告)日：2009-12-03

    申请号：US12296663

    申请日：2007-04-10

    Applicant: Karl-Gunnar Larsson ,  Anders Hult

    Inventor： Karl-Gunnar Larsson ,  Anders Hult

    IPC: B32B15/12 ,  B05D1/38 ,  H05H1/00 ,  B05D5/00

    CPC classification number: D21H19/02 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/31 ,  C23C18/40 ,  C23C26/00 ,  D21H19/08 ,  D21H23/30 ,  H05K1/03 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0284 ,  H05K2203/095 ,  Y10T428/265 ,  Y10T428/31703

    Abstract: There is disclosed a method for applying a first metal on paper, which method comprises the steps a) producing polymers on the surface of said paper, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7, b) reducing said ions to the second metal and c) depositing said first metal on the reduced ions of said second metal. The invention further comprises objects manufactured according to the method. Advantages of the present invention include improved adhesion of the metal coating, possibility to coat many difficult materials. The process is suitable for large-scale and continuous production and it will reduce the waste of metal. Circuits manufactured according to the invention display improved signal integrity. Also there is the possibility to manufacture circuits which are built up sequentially with several layers of conductors in distinct patterns. It is also possible to manufacture of circuits with a very small line width.

    Abstract translation: 公开了一种在纸上施加第一金属的方法，该方法包括以下步骤：a）在所述纸的表面上制备聚合物，所述聚合物包含羧基和至少一种第二金属的吸附离子，所述离子被吸附在 b）将所述离子还原成第二金属，和c）将所述第一金属沉积在所述第二金属的还原离子上。 本发明还包括根据该方法制造的物体。 本发明的优点包括改善金属涂层的附着力，可能涂覆许多困难的材料。 该工艺适合大规模连续生产，减少金属的浪费。 根据本发明制造的电路显示改进的信号完整性。 还有可能制造电路，其顺序地以不同图案的几层导体构成。 也可以制造线宽非常小的电路。

    Flexible substrate and manufacturing method thereof
    30.
    发明申请
    Flexible substrate and manufacturing method thereof 审中-公开
    柔性基板及其制造方法

    公开(公告)号：US20090202843A1

    公开(公告)日：2009-08-13

    申请号：US12378074

    申请日：2009-02-11

    Applicant: Yoshiaki Oku

    Inventor： Yoshiaki Oku

    IPC: B32B17/08 ,  B05D1/18 ,  B32B23/04

    CPC classification number: H05K1/0306 ,  H05K1/0393 ,  H05K2201/0108 ,  H05K2201/0251 ,  H05K2201/0284 ,  Y10T428/31634

    Abstract: A flexible substrate of an aspect of the present invention includes a substrate made of cellulose-based nanofibers and low-melting-point glass deposited inside the substrate by impregnation. A flexible substrate of another aspect of the present invention includes a substrate made of cellulose-based nanofibers and low-melting-point glass joined to one of principal surfaces of the substrate. A glass transition temperature of the low-melting-point glass is equal to or below 300° C. The flexible substrate is optically transparent.

    Abstract translation: 本发明的一个方面的柔性基板包括由基于纤维素的纳米纤维制成的基板和通过浸渍沉积在基板内的低熔点玻璃。 本发明的另一方面的柔性基板包括由基板上的一个主表面连接的基于纤维素的纳米纤维和低熔点玻璃制成的基板。 低熔点玻璃的玻璃化转变温度等于或低于300℃。柔性基板是光学透明的。

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