公开(公告)号：US07872875B2

公开(公告)日：2011-01-18

申请号：US11867277

申请日：2007-10-04

Applicant: Tsuyoshi So ,  Yoshinori Uzuka ,  Osamu Aizawa ,  Hideo Kubo

Inventor： Tsuyoshi So ,  Yoshinori Uzuka ,  Osamu Aizawa ,  Hideo Kubo

IPC: H05K7/20

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/303 ,  H05K2201/0308 ,  H05K2201/2036 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49144

Abstract: An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.

Abstract translation: 具有由可热熔接合材料制成的安装端子的电子部件安装在安装板上。 结构部件用于在加热和熔化可热熔接合材料的过程中将高度调节构件移动到电子部件下方的位置，以便保持电子部件和安装板之间的预定距离。

公开(公告)号：US07745013B2

公开(公告)日：2010-06-29

申请号：US11323218

申请日：2005-12-30

Applicant: Heeman Choe ,  Daewoong Suh

Inventor： Heeman Choe ,  Daewoong Suh

IPC: B32B5/18 ,  B23K35/02 ,  B23K35/14 ,  B23K35/22 ,  H05K3/34

CPC classification number: B23K35/025 ,  B23K35/22 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0116 ,  H05K2201/0308 ,  Y02P70/613 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479

Abstract: A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.

Abstract translation: 在集成电路封装的基板上形成发泡焊料或纳米多孔焊料。 泡沫焊料表现出低的模量，抗冲击和动态载荷下的开裂。 泡沫焊料用作集成电路器件和外部结构之间的通信的焊料凸块。

公开(公告)号：US20080158843A1

公开(公告)日：2008-07-03

申请号：US11867277

申请日：2007-10-04

Applicant: Tsuyoshi SO ,  Yoshinori UZUKA ,  Osamu AIZAWA ,  Hideo KUBO

Inventor： Tsuyoshi SO ,  Yoshinori UZUKA ,  Osamu AIZAWA ,  Hideo KUBO

IPC: H05K7/06 ,  H05K3/34

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/303 ,  H05K2201/0308 ,  H05K2201/2036 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49144

Abstract: An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.

Abstract translation: 具有由可热熔接合材料制成的安装端子的电子部件安装在安装板上。 结构部件用于在加热和熔化可热熔接合材料的过程中将高度调节构件移动到电子部件下方的位置，以便保持电子部件和安装板之间的预定距离。

公开(公告)号：US07371673B2

公开(公告)日：2008-05-13

申请号：US11130662

申请日：2005-05-17

Applicant: Akira Matsunami

Inventor： Akira Matsunami

IPC: H01L21/44

CPC classification number: H01L21/4846 ,  H01L23/49816 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0308 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613

Abstract: A technique for attaching solder balls of a BGA to a PCB. In one example embodiment, this is accomplished by applying solder paste onto at least one of a plurality of contact pads on a PCB. At least one of a plurality of solder balls of an IC device are then onto the at least one of the plurality of contact pads on the PCB. The temperature is then increased to reflow the solder paste. The IC device is then pulled away from the PCB as a function of a geometric shape of the IC device and held in a new position upon reflowing the solder paste to transform the at least one of the plurality of solder balls and the reflowed solder paste into a high shear strength solder joint structure. The reflow temperature is then lowered to room temperature to attach the high shear strength solder joint structure to the at least one of the plurality of lands on the PCB.

Abstract translation: 一种用于将BGA焊球附着到PCB上的技术。 在一个示例性实施例中，这通过将焊膏施加到PCB上的多个接触焊盘中的至少一个来实现。 然后，IC器件的多个焊球中的至少一个焊接到PCB上的多个接触焊盘中的至少一个上。 然后升高温度以回流焊膏。 然后将IC器件作为IC器件的几何形状的函数从PCB中拉出，并且在回流焊膏时保持在新的位置，以将多个焊球和回流的焊膏中的至少一个变换为 高剪切强度焊点结构。 然后将回流温度降低至室温，以将高剪切强度焊点结构附着到PCB上的多个焊盘中的至少一个。

公开(公告)号：US20070054513A1

公开(公告)日：2007-03-08

申请号：US11554485

申请日：2006-10-30

Applicant: Gaetan Mathieu ,  Benjamin Eldridge ,  Stuart Wenzel

Inventor： Gaetan Mathieu ,  Benjamin Eldridge ,  Stuart Wenzel

IPC: H01R12/00

CPC classification number: H01L24/13 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0308 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract translation: 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。

公开(公告)号：US07127811B2

公开(公告)日：2006-10-31

申请号：US10651821

申请日：2003-08-29

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: H05K3/02

CPC classification number: H01L24/13 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0308 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract translation: 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。

公开(公告)号：US20180243972A1

公开(公告)日：2018-08-30

申请号：US15963890

申请日：2018-04-26

Applicant: The Boeing Company

Inventor： Jeffery L. Marcoe ,  Sahrudine Apdalhaliem ,  Moushumi Shome

IPC: B29C61/06 ,  B64C3/48 ,  B29C70/30 ,  B29C70/88 ,  B64C3/52 ,  F03G7/06 ,  H05K1/16 ,  B32B15/08 ,  B29B11/16 ,  H05K1/05 ,  B29K267/00 ,  B29K71/00 ,  B29C53/82 ,  B29L31/30 ,  B64C3/44 ,  B64C3/54 ,  B64C27/72

CPC classification number: B29C61/0625 ,  B29B11/16 ,  B29C53/822 ,  B29C70/222 ,  B29C70/30 ,  B29C70/32 ,  B29C70/88 ,  B29K2071/00 ,  B29K2267/00 ,  B29L2031/3085 ,  B32B15/08 ,  B32B2250/02 ,  B32B2605/18 ,  B64C3/48 ,  B64C3/52 ,  B64C2003/445 ,  B64C2003/543 ,  B64C2027/7288 ,  F03G7/065 ,  H05K1/056 ,  H05K1/165 ,  H05K2201/0129 ,  H05K2201/0308 ,  Y02T50/34 ,  Y02T50/43

Abstract: Systems and processes that integrate thermoplastic and shape memory alloy materials to form an adaptive composite structure capable of changing its shape. For example, the adaptive composite structure may be designed to serve as a multifunctional adaptive wing flight control surface. Other applications for such adaptive composite structures include in variable area fan nozzles, winglets, fairings, elevators, rudders, or other aircraft components having an aerodynamic surface whose shape is preferably controllable. The material systems can be integrated by means of overbraiding (interwoven) with tows of both thermoplastic and shape memory alloy materials or separate layers of each material can be consolidated (e.g., using induction heating) to make a flight control surface that does not require separate actuation.

公开(公告)号：US09635764B2

公开(公告)日：2017-04-25

申请号：US14866648

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Shipeng Qiu ,  Shawna Liff ,  Kayleen L Helms ,  Joshua D Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K1/14 ,  H05K3/36 ,  H05K3/22 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/189 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/036 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/22 ,  H05K3/303 ,  H05K3/326 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0308 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/057 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2203/10 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194

Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

公开(公告)号：US20170094799A1

公开(公告)日：2017-03-30

申请号：US14866648

申请日：2015-09-25

Applicant: Shipeng Qiu ,  Shawna Liff ,  Kayleen L. Helms ,  Joshua D. Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

Inventor： Shipeng Qiu ,  Shawna Liff ,  Kayleen L. Helms ,  Joshua D. Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/22 ,  H05K3/30 ,  H05K1/02 ,  H05K3/36

CPC classification number: H05K1/189 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/036 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/22 ,  H05K3/303 ,  H05K3/326 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0308 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/057 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2203/10 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194

Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

公开(公告)号：US20160197053A1

公开(公告)日：2016-07-07

申请号：US15069435

申请日：2016-03-14

Applicant: International Business Machines Corporation

Inventor： Eric V. Kline ,  Arvind K. Sinha

IPC: H01L23/00 ,  B23K1/018

CPC classification number: H01L24/17 ,  B23K1/0016 ,  B23K1/018 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/16227 ,  H01L2224/1713 ,  H05K1/11 ,  H05K3/225 ,  H05K13/0486 ,  H05K2201/0308 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/1115 ,  H05K2203/176

Abstract: Embodiments relate to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

Abstract translation: 实施例涉及一种用于返回BGA封装的方法和装置。 存储器形状材料被放置在与封装的多个焊接点相邻的位置。 对材料施加刺激，刺激导致材料从非刺激形状变成刺激形状。 这种刺激导致材料的膨胀。 随着材料膨胀，它在BGA封装和相邻定位的载体上施加张力，导致两个部件分离，同时减轻相邻定位部件的侧向热量。