公开(公告)号：US09462996B2

公开(公告)日：2016-10-11

申请号：US14549364

申请日：2014-11-20

Applicant: SAMSUNG MEDISON CO., LTD.

Inventor： Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

IPC: H05K1/00 ,  A61B8/00 ,  B06B1/06 ,  H05K3/30 ,  H05K1/18

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 探头包括换能器，具有经由面对面接触而与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。

公开(公告)号：US09401533B2

公开(公告)日：2016-07-26

申请号：US14807925

申请日：2015-07-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato

IPC: H01P3/08 ,  H05K1/02

CPC classification number: H01P3/08 ,  H01P3/085 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727

Abstract: A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings.

公开(公告)号：US09349683B2

公开(公告)日：2016-05-24

申请号：US14714234

申请日：2015-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Min Jung ,  Jeong-Kyu Ha

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/48

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  G02F1/13458 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/86 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/83104 ,  H01L2224/83862 ,  H01L2224/86203 ,  H01L2924/00014 ,  H05K1/028 ,  H05K1/112 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/09227 ,  H05K2201/10128 ,  H05K2201/10674 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A chip-on-film package comprises a film substrate comprising upper and lower surfaces, and a side having a bending part. A first output interconnection formed on the upper surface of the film substrate extends from a semiconductor chip disposed on the upper surface toward the bending part. A second output interconnection includes an upper output interconnection formed on the upper surface of the film substrate, and a lower output interconnection formed on the lower surface and extending onto the bending part. An input interconnection includes an upper input interconnection formed on the upper surface of the film substrate and a lower input interconnection formed on the lower surface and extending away from the bending part. Through-vias are formed to pass through the film substrate and electrically connect the upper output interconnection to the lower output interconnection, and the upper input interconnection to the lower input interconnection.

Abstract translation: 片上胶卷包装包括一个包括上表面和下表面的薄膜基材和一个具有弯曲部分的一面。 形成在薄膜基板的上表面上的第一输出互连件从设置在上表面上的半导体芯片朝向弯曲部分延伸。 第二输出互连包括形成在薄膜基板的上表面上的上输出互连和形成在下表面上并延伸到弯曲部上的下输出互连。 输入互连包括形成在薄膜基板的上表面上的上输入互连和形成在下表面上并且远离弯曲部延伸的下输入互连。 通孔形成为通过薄膜基板并将上部输出互连电连接到下部输出互连，并将上部输入互连电连接到下部输入互连。

公开(公告)号：US20160049356A1

公开(公告)日：2016-02-18

申请号：US14714234

申请日：2015-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Min JUNG ,  Jeong-Kyu HA

IPC: H01L23/498 ,  H01L25/065

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  G02F1/13458 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/86 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/83104 ,  H01L2224/83862 ,  H01L2224/86203 ,  H01L2924/00014 ,  H05K1/028 ,  H05K1/112 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/09227 ,  H05K2201/10128 ,  H05K2201/10674 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A chip-on-film package comprises a film substrate comprising upper and lower surfaces, and a side having a bending part. A first output interconnection formed on the upper surface of the film substrate extends from a semiconductor chip disposed on the upper surface toward the bending part. A second output interconnection includes an upper output interconnection formed on the upper surface of the film substrate, and a lower output interconnection formed on the lower surface and extending onto the bending part. An input interconnection includes an upper input interconnection formed on the upper surface of the film substrate and a lower input interconnection formed on the lower surface and extending away from the bending part. Through-vias are formed to pass through the film substrate and electrically connect the upper output interconnection to the lower output interconnection, and the upper input interconnection to the lower input interconnection.

Abstract translation: 片上胶卷包装包括一个包括上表面和下表面的薄膜基材和一个具有弯曲部分的一面。 形成在薄膜基板的上表面上的第一输出互连件从设置在上表面上的半导体芯片朝向弯曲部分延伸。 第二输出互连包括形成在薄膜基板的上表面上的上输出互连和形成在下表面上并延伸到弯曲部上的下输出互连。 输入互连包括形成在薄膜基板的上表面上的上输入互连和形成在下表面上并且远离弯曲部延伸的下输入互连。 通孔形成为通过薄膜基板并将上部输出互连电连接到下部输出互连，并将上部输入互连电连接到下部输入互连。

公开(公告)号：US20160037623A1

公开(公告)日：2016-02-04

申请号：US13573309

申请日：2012-09-07

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18

CPC classification number: H05K1/148 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/24137 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/0203 ,  H05K1/0283 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/445 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09745 ,  H05K2203/1469

Abstract: A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.

Abstract translation: 一种由高导热部分组成的刚性柔性电路，所述部分具有设置成使其触点与导热部分的表面基本平面的部件，并且其中触头直接与迹线互连而不使用焊料并进一步具有 导热部分通过柔性电路部分彼此互连。

公开(公告)号：US09210810B2

公开(公告)日：2015-12-08

申请号：US13547985

申请日：2012-07-12

Applicant: Michael Hack ,  Emory Krall ,  Ruiqing Ma

Inventor： Michael Hack ,  Emory Krall ,  Ruiqing Ma

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/10128 ,  Y10T29/4913

Abstract: Systems and methods for the design and fabrication of flexible devices, including high-performance large-area OLEDs, narrow border display panels and lighting panels are provided. Various described fabrication- and design-processes may be used to provide the necessary electrical drive to lighting and display panels. Electrical drive may be provided to one or more row- and column-signals by patterning conductive elements near the panel edge. The electrical elements may further be folded over a region near the panel edge back on itself, such that electrical traces may route around the display edge. This may allow the display active area to be substantially the same area as its viewing area, and furthermore may allow pixels go substantially all the way to the edge of the viewing area.

Abstract translation: 提供了用于设计和制造柔性装置的系统和方法，包括高性能大面积OLED，窄边框显示面板和照明面板。 可以使用各种描述的制造和设计过程来为照明和显示面板提供必要的电驱动。 可以通过在面板边缘附近图案化导电元件来将电驱动器提供给一个或多个行和列信号。 电气元件还可以在面板边缘附近折叠在其自身上，使得电迹线可以围绕显示边缘绕过。 这可以允许显示有效区域与其观看区域基本相同的区域，并且还可以允许像素基本上一直到观看区域的边缘。

公开(公告)号：US09195358B1

公开(公告)日：2015-11-24

申请号：US14289920

申请日：2014-05-29

Applicant: Ronald Steven Cok ,  Thomas Nathaniel Tombs

Inventor： Ronald Steven Cok ,  Thomas Nathaniel Tombs

IPC: H01L23/48 ,  H01L23/14 ,  G06F3/044

CPC classification number: G06F3/044 ,  G06F1/1643 ,  G06F1/1652 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/148 ,  H05K1/189 ,  H05K3/1275 ,  H05K2201/055 ,  H05K2201/10128 ,  H05K2203/1545

Abstract: A folded micro-wire substrate structure includes a transparent folded flexible substrate having a first side and a second side opposed to the first side. The flexible substrate has a first portion and a second portion adjacent to the first portion of the flexible substrate. The flexible substrate has at least a first fold between the first and second portions so that the first portion is aligned with the second portion in a perpendicular direction. One or more electrical conductors is located in or on the flexible substrate, at least one electrical component is located on or in the flexible substrate in the first portion. At least one optical element is located on or in the flexible substrate in the second portion located so that the optical element directs light to or from the electrical component.

Abstract translation: 折叠的微线基板结构包括具有第一侧和与第一侧相对的第二侧的透明折叠柔性基板。 柔性基板具有与柔性基板的第一部分相邻的第一部分和第二部分。 柔性基板在第一和第二部分之间具有至少第一折叠，使得第一部分在垂直方向上与第二部分对齐。 一个或多个电导体位于柔性基底中或柔性基底上，至少一个电部件位于第一部分中的柔性基底上或柔性基底上。 至少一个光学元件位于第二部分中的柔性基板上或柔性基板中，所述第二部分被定位成使得光学元件将光引导到电子部件或从电子部件引导光。

公开(公告)号：US20150305136A1

公开(公告)日：2015-10-22

申请号：US14439322

申请日：2013-10-28

Applicant: FUJIKURA LTD.

Inventor： Yasuyuki Tachikawa

IPC: H05K1/02

CPC classification number: H05K1/02 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/208 ,  H05K1/0281 ,  H05K3/28 ,  H05K2201/055

Abstract: Provided is a printed circuit board which is used in a bent state, including: a substrate; a first conductive layer which is formed on the substrate; a first insulation layer which is formed on the substrate so as to cover the first conductive layer; and a second conductive layer which is formed on the first insulation layer, wherein on the assumption that the Youngs modulus of the first insulation layer is indicated by Ei1 and the fracture elongation of the second conductive layer is indicated by Bc2, the following equations (I) and (II) are satisfied. 10 MPa

Abstract translation: 提供一种在弯曲状态下使用的印刷电路板，包括：基板; 形成在所述基板上的第一导电层; 第一绝缘层，其形成在所述基板上以覆盖所述第一导电层; 以及形成在所述第一绝缘层上的第二导电层，其中，假定所述第一绝缘层的杨氏模量由Ei1表示，并且所述第二导电层的断裂伸长率由Bc2表示，则以下等式 ）和（II）。 10MPa

公开(公告)号：US20150255655A1

公开(公告)日：2015-09-10

申请号：US14638781

申请日：2015-03-04

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Koji Mori ,  Takashi Iwasaki ,  Youichi Nagai ,  Yoshiya Abiko ,  Rui Mikami ,  Kenji Saito ,  Makoto Inagaki

IPC: H01L31/05 ,  H05K1/02

CPC classification number: H01L31/0504 ,  H01L31/0201 ,  H01L31/0508 ,  H01L31/0512 ,  H01L31/052 ,  H01L31/0543 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/055 ,  H05K2201/10143 ,  Y02E10/52

Abstract: A flexible printed wiring board includes a first strip-shaped member and a second strip-shaped member each including a conductive part and an insulating part covering the conductive part; and a first connecting member including a conductive part and an insulating part covering the conductive part, the first connecting member connecting a first end of the first strip-shaped member and a first end of the second strip-shaped member to each other. The conductive parts of the first strip-shaped member, the second strip-shaped member, and the first connecting member are continuous with each other. The first strip-shaped member and the second strip-shaped member are capable of being linearly arranged when the first connecting member is bent and the first end of the first strip-shaped member and the first end of the second strip-shaped member face each other.

Abstract translation: 柔性印刷布线板包括第一条形部件和第二条形部件，​​每个部件包括导电部分和覆盖导电部分的绝缘部分; 以及第一连接构件，其包括导电部和覆盖所述导电部的绝缘部，所述第一连接构件将所述第一带状构件的第一端和所述第二带状构件的第一端彼此连接。 第一带状构件，第二带状构件和第一连接构件的导电部分彼此连续。 当第一连接构件被弯曲并且第一条形构件的第一端和第二条形构件的第一端分别面对时，第一条形构件和第二条形构件能够线性地布置 其他。

公开(公告)号：US09130251B2

公开(公告)日：2015-09-08

申请号：US14262989

申请日：2014-04-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato

IPC: H03H7/38 ,  H01P3/08 ,  H05K1/02

CPC classification number: H01P3/08 ,  H01P3/085 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727

Abstract: A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings.

Abstract translation: 扁平电缆包括介质元件组件，其包括彼此层叠的多个电介质层，设置在电介质元件组件中的线性信号线，设置在相对于信号线的层叠方向的一侧上的第一接地导体， 沿着信号线布置的多个第一开口以及设置在相对于信号线的层叠方向的另一侧的第二接地导体，并且包括沿信号线布置的多个第二开口。 第一接地导体在层叠方向比信号线远离第二接地导体。 第一开口大于第二开口。