公开(公告)号：US20180053981A1

公开(公告)日：2018-02-22

申请号：US15630101

申请日：2017-06-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bum-hee BAE ,  Young-kun KWON

IPC: H01P3/08 ,  H01B7/08 ,  H01P11/00 ,  H01B13/00

CPC classification number: H01P3/08 ,  H01B7/0807 ,  H01B7/0823 ,  H01B13/0036 ,  H01P3/085 ,  H01P5/028 ,  H01P11/003 ,  H05K1/0218 ,  H05K1/0245 ,  H05K1/148 ,  H05K2201/058 ,  H05K2201/0715

Abstract: A flexible flat cable and a manufacturing method thereof are provided. The flexible flat cable includes a plurality of ground parts comprising a conductive material disposed at intervals, a plurality of signal transmission parts comprising a conductive material disposed between the plurality of ground parts, an outer skin covering the signal transmission parts and the ground parts, and a conductive adhesive layer disposed between the ground parts and the signal transmission parts and the outer skin part, the signal transmission part comprising an insulating member and a strip line disposed within the insulating member and the ground part comprising a ground member having the same cross section as the strip line and a conductive adhesive block coupled to the ground member with the conductive adhesive layer.

公开(公告)号：US09900988B1

公开(公告)日：2018-02-20

申请号：US14249540

申请日：2014-04-10

Applicant: Nien-Hua Chao ,  John A. Dispenza ,  Mario DeAngelis

Inventor： Nien-Hua Chao ,  John A. Dispenza ,  Mario DeAngelis

IPC: H05K1/18 ,  H05K3/00 ,  H01L21/56 ,  B29C51/16 ,  B29L31/34

CPC classification number: H01L21/565 ,  B29C33/3842 ,  B29C51/16 ,  B29C2791/006 ,  B29L2031/3406 ,  B29L2031/3425 ,  H01L2924/0002 ,  H05K3/0014 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00

Abstract: A protective layering process that encapsulates and protects printed circuit board assemblies with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold, which are derived from modified data from a 3 dimensional scan of the printed circuit board assembly, and which applies close-forming, encapsulating polymer layers, electrically non-conductive layers, EMI shielding layers, and/or thermal management layers to the electronic components and circuit board assemblies. Polymer layers and protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets/layers can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces, and from internal and external EMI and to manage thermal dissipation. Multiple, nesting layers, each with different protective properties, can be formed and applied.

公开(公告)号：US09888619B2

公开(公告)日：2018-02-06

申请号：US14414514

申请日：2013-06-05

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Yusuke Haruna ,  Sirou Yamauchi ,  Hiroshi Tajima ,  Kenji Kamino

IPC: H05K9/00 ,  H05K1/02 ,  B32B7/12 ,  B32B15/04 ,  B32B15/20

CPC classification number: H05K9/0088 ,  B32B7/12 ,  B32B15/04 ,  B32B15/20 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/00 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0296 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0707 ,  H05K2201/0715 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.

公开(公告)号：US09872626B2

公开(公告)日：2018-01-23

申请号：US14934783

申请日：2015-11-06

Applicant: Welch Allyn, Inc.

Inventor： Paul Delucia ,  Alan S. Knieriem ,  David M. Babson ,  David M. Fallat

IPC: A61B5/022 ,  A61B5/021 ,  H05K1/02 ,  A61B5/0205 ,  A61B5/00 ,  H02J1/00 ,  H02J7/00 ,  G02F1/1333 ,  H05K1/18 ,  A61B5/0235 ,  A61B50/13

CPC classification number: A61B5/02233 ,  A61B5/002 ,  A61B5/02055 ,  A61B5/02141 ,  A61B5/0235 ,  A61B5/7405 ,  A61B5/742 ,  A61B50/13 ,  A61B2560/0204 ,  A61B2562/12 ,  A61B2562/166 ,  G02F1/133308 ,  G02F2001/13332 ,  G02F2001/133325 ,  H02J1/00 ,  H02J7/0054 ,  H05K1/0216 ,  H05K1/0296 ,  H05K1/183 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/1003

Abstract: A printed circuit board assembly includes a printed circuit board and a ferrite. The printed circuit board has a substantially planar top surface and a substantially planar bottom surface. The ferrite has an annular cross section that defines a channel. The ferrite is positioned on the printed circuit board such that a portion of the plurality of traces passes through the channel.

公开(公告)号：US09867280B2

公开(公告)日：2018-01-09

申请号：US15227398

申请日：2016-08-03

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Masahiro Watanabe ,  Hiroshi Tajima

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K1/0218 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/09 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0715 ,  H05K2201/1028 ,  H05K2201/2009

Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of the base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick.

公开(公告)号：US20170305346A1

公开(公告)日：2017-10-26

申请号：US15520371

申请日：2015-10-20

Applicant: CONNAUGHT ELECTRONICS LTD.

Inventor： Martin Oliver COLEMAN

IPC: B60R1/00 ,  H01R13/66 ,  H04N5/225 ,  H05K1/14 ,  H05K1/02 ,  H01R13/658

CPC classification number: B60R1/00 ,  H01R13/658 ,  H01R13/66 ,  H01R13/6625 ,  H01R2201/26 ,  H04N5/225 ,  H04N5/2257 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/10121

Abstract: The invention relates to a camera (2) for a motor vehicle (1), which includes a printed circuit board (16), on which a current connector (29) and a communication bus connector (30) and a video interface connector (31) each for connecting to the motor vehicle (1) are disposed, wherein the video interface connector (31) is connected to a capacitor (25) and a parallel-to-serial converter (26), wherein the video interface connector (31) and/or the capacitor (25) and/or the parallel-to-serial converter (26) are surrounded by a device (32) shielding electromagnetic radiation.

公开(公告)号：US09756718B2

公开(公告)日：2017-09-05

申请号：US14160962

申请日：2014-01-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuji Kataoka ,  Koichi Kanryo

IPC: H05K1/02 ,  H05K3/28 ,  H01L23/00

CPC classification number: H05K1/0216 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/0715 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A module board includes a base substrate. Electronic components are mounted on a first principal surface of the base substrate. The mounted electronic components are sealed by a sealing resin containing an SiO2 filler. A top surface and side surfaces of the sealing resin are covered with a shield layer containing a carbon filler, which is flat powder, as a conductive component. A terminal electrode is formed on a second principal surface of the base substrate that is disposed opposite to the first principal surface of the base substrate.

公开(公告)号：US09736924B2

公开(公告)日：2017-08-15

申请号：US14770118

申请日：2014-02-25

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Masahiro Watanabe ,  Hiroshi Tajima

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K1/09

CPC classification number: H05K1/0218 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/09 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0715 ,  H05K2201/1028 ,  H05K2201/2009

Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick.

公开(公告)号：US20170213636A1

公开(公告)日：2017-07-27

申请号：US15483679

申请日：2017-04-10

Applicant: General Electric Company

Inventor： Alan Carroll Lovell ,  Mark Eugene Shepard ,  Andrew David McArthur ,  Qin Chen ,  Todd David Greenleaf

IPC: H01F27/28 ,  H05K1/16 ,  H01F41/02 ,  H05K3/46 ,  H01F27/24 ,  H01F41/04 ,  H05K1/02 ,  H05K1/14

CPC classification number: H01F27/2885 ,  H01F17/0013 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/0206 ,  H01F41/043 ,  H01F41/32 ,  H01F2017/008 ,  H01F2027/2809 ,  H01F2027/2819 ,  H05K1/0224 ,  H05K1/0254 ,  H05K1/0256 ,  H05K1/144 ,  H05K1/165 ,  H05K3/46 ,  H05K2201/0715 ,  H05K2201/09672 ,  H05K2201/098 ,  Y10T29/4902 ,  Y10T29/49073

Abstract: A device includes a printed circuit board (PCB). The device may also include a high voltage coil disposed on the PCB and a low voltage coil disposed on the PCB. Further, a conductive shield forms a three-dimensional enclosure around the high voltage coil and confines an electric field generated by the device to the PCB.

公开(公告)号：US20170208710A1

公开(公告)日：2017-07-20

申请号：US15409260

申请日：2017-01-18

Applicant: Apple Inc.

Inventor： Albert Wang ,  Paul A. Martinez

IPC: H05K9/00 ,  H05K3/30 ,  G06F1/16 ,  G06F1/26 ,  H05K1/18

CPC classification number: G06F1/1613 ,  G06F1/1656 ,  G06F1/1658 ,  G06F1/182 ,  G06F1/183 ,  H01R43/205 ,  H05K2201/0715 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10636 ,  Y02P70/611

Abstract: The present disclosure relates to shield frames that reduce electromagnetic interference in electrical devices. The shield frames may be formed by coupling a shield frame lid to a ground connection of the circuit board through terminations in electrical components. The terminations in these electrical components thus may act both as a ground termination for the component as well as a ground connection for the shield frame. The components may be disposed in the perimeter of the circuit board to establish, with or without additional conductive posts, sections of the shield frame wall.