公开(公告)号：US08971055B2

公开(公告)日：2015-03-03

申请号：US12336058

申请日：2008-12-16

Applicant: Randall James Gass ,  Rodney Powell ,  Nick Campbell ,  Timothy John Luksetich ,  Roger Wolf ,  Jerry Scheel

Inventor： Randall James Gass ,  Rodney Powell ,  Nick Campbell ,  Timothy John Luksetich ,  Roger Wolf ,  Jerry Scheel

IPC: H05K7/00 ,  H01H71/12 ,  H05K3/46 ,  H01H1/58 ,  H01H71/08 ,  H05K1/18

CPC classification number: H01H71/123 ,  H01H71/125 ,  H01H2001/5816 ,  H01H2071/086 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A circuit breaker includes a housing, a rigid circuit board, and a flexible circuit board. The rigid circuit board is enclosed within the housing and has a main surface for supporting an electronic component. The flexible circuit board has a first end that is directly attached to an edge of the rigid circuit board.

Abstract translation: 断路器包括壳体，刚性电路板和柔性电路板。 刚性电路板被封装在壳体内并具有用于支撑电子部件的主表面。 柔性电路板具有直接附接到刚性电路板的边缘的第一端。

公开(公告)号：US20140331494A1

公开(公告)日：2014-11-13

申请号：US14362873

申请日：2012-12-03

Applicant: AT&S Austria Technologie & Systemtechnik Aktiegese llschaft

Inventor： Markus Leitgeb ,  Gerald Weidinger ,  Gerhard Schmid ,  Ljubomir Mareljic

IPC: H05K3/46

CPC classification number: H05K3/4697 ,  H05K3/0044 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2203/0191 ,  H05K2203/0264 ,  Y10T29/49156

Abstract: The invention relates to a method for producing a circuit board (1) involving the removal of a subregion (6) thereof. In said method, at least two layers or plies (2, 3, 4, 5) of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply (4) of the circuit board (1) by providing or applying an adhesion-preventing material (7), and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, once the peripheral zones (8) have been separated or entirely cut off, an outer surface (9) of the subregion (6) to be removed is coupled or connected to an external element (11), and the subregion (6) to be removed is separated from the adjacent ply (4) of the circuit board (1) by lifting or displacing the external element (11), thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in an easy and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids (14) in such a circuit board (1).

Abstract translation: 本发明涉及一种用于制造涉及去除其子区域（6）的电路板（1）的方法。 在所述方法中，电路板（1）的至少两个层或层（2,3,4,5）互连，防止要移除的子区域（6）与相邻的层（4）相连接 通过设置或施加防粘连材料（7）的电路板（1）和要去除的子区域（6）的周边区域（8）与电路板（1）的邻接区域分离。 根据本发明，一旦外围区域（8）已被分离或完全切断，要移除的子区域（6）的外表面（9）被连接或连接到外部元件（11），并且该子区域 （6）通过提升或移动外部元件（11）与电路板（1）的相邻层（4）分离，从而可以去除要从电路中移除的子区域（6） 板（1）在一个容易和可靠，如果必要的自动化方式。 还公开了这种用于制造多层电路板（1）的方法，特别是在这种电路板（1）中产生空隙（14）的方法。

公开(公告)号：US08884166B2

公开(公告)日：2014-11-11

申请号：US13644888

申请日：2012-10-04

Applicant: Fujikura Ltd.

Inventor： Yuji Inatani

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K3/4697 ,  H05K3/4611 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49144

Abstract: A multi-layer circuit board having a connector portion of an inner layer substrate being exposed, the multi-layer circuit board comprising: an inner layer substrate in which an inner layer circuit is formed, the inner layer circuit including the connector portion; and an outer layer substrate having an outer layer circuit formed on an insulating layer and having a region corresponding to the connector portion peeled off, an inner layer circuit side of the inner layer substrate and an insulating layer side of the outer layer substrate being adhered to one another via an adhesive layer so as to face one another, and a conductor layer other than the connector portion of the inner layer circuit being adhered to the outer layer substrate directly by the adhesive layer.

Abstract translation: 一种具有内层基板的连接部分露出的多层电路板，所述多层电路板包括：形成有内层电路的内层基板，所述内层电路包括所述连接器部分; 以及外层基板，其具有形成在绝缘层上并且具有与所述连接器部分剥离的区域相对应的区域的外层电路，所述内层基板的内层电路侧和所述外层基板的绝缘层侧被粘附到 通过粘合剂层彼此面对，并且除了内层电路的连接器部分之外的导体层直接通过粘合剂层粘附到外层基板。

公开(公告)号：US20140216802A1

公开(公告)日：2014-08-07

申请号：US13761172

申请日：2013-02-07

Applicant: Yu-Ru Chang ,  Yu-Fang Hsia ,  Ling-Chih Chou

Inventor： Yu-Ru Chang ,  Yu-Fang Hsia ,  Ling-Chih Chou

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0298 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/60 ,  H01L2924/0002 ,  H05K1/0286 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/22 ,  H05K3/4694 ,  H05K2201/09127 ,  H05K2201/09972 ,  H05K2203/0228 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the invention can achieve multiple substrate functions without impacting the customer's PCB or system board design and provide cost effective and fast cycle time for engineering development phase.

Abstract translation: 本发明公开了一种封装基板布局设计，以实现用于工程开发和验证的多个基板功能。 衬底布局包含连接到封装衬底上的多个电源/接地区域的连接结构。 通过封装基板上切割线的不同组合，本发明可以实现多种基板功能，而不会影响客户的PCB或系统板设计，并为工程开发阶段提供成本效益和快速的周期时间。

公开(公告)号：US20140216792A1

公开(公告)日：2014-08-07

申请号：US14232977

申请日：2012-07-12

Applicant: Simon Sebanz ,  Hannes Voraberger ,  Richard McConnell ,  Luis Chau

Inventor： Simon Sebanz ,  Hannes Voraberger ,  Richard McConnell ,  Luis Chau

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K3/4611 ,  H05K3/4673 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/056 ,  H05K2201/09127 ,  H05K2203/1461 ,  Y10T29/49155

Abstract: A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps: providing a layer of rigid insulating material removing at least one area of the rigid insulating material inserting a flexible insulating material into the removed or cut-out area(s) of the rigid insulating material covering the rigid and flexible insulating material with a layer of conductive material on at least one surface building up at least one further layer of the rigid-flex printed circuit board at least on the rigid part(s) of the insulating material, wherein the at least one further layer of the rigid-flex printed circuit board is partly overlapping the flexible area(s) of the insulating material. Furthermore a rigid-flex printed circuit board or sub-assembly thereof is provided.

Abstract translation: 制造刚柔柔性印刷电路板或其子组件的方法包括以下步骤：提供刚性绝缘材料层，去除刚性绝缘材料的至少一个区域，将柔性绝缘材料插入去除或切割的， 所述刚性绝缘材料的外部区域覆盖所述刚性和柔性绝缘材料，所述绝缘材料在至少一个表面上至少形成刚性柔性印刷电路板的至少另一层的刚性部分上的导电材料层（ s），其中刚性柔性印刷电路板的至少一个另外的层部分地与绝缘材料的柔性区域重叠。 此外，提供了刚性柔性印刷电路板或其子组件。

公开(公告)号：US20140138130A1

公开(公告)日：2014-05-22

申请号：US13740286

申请日：2013-01-14

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Cheng-Jui Chang ,  Ming-Hao Wu

IPC: H05K1/11 ,  H05K1/09 ,  H05K13/04

CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15333 ,  H01L2924/37001 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/09127 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on. The second dielectric-layer is disposed on the first dielectric-layer and covers the laser-resistant metallic-pattern, the second dielectric-layer includes a component-disposing cavity corresponding to the projection area, penetrating through the second dielectric-layer and communicated with the openings to expose the pads.

Abstract translation: 提供了具有部件配置区域的基板结构及其工艺。 具有部件配置区域的基板结构包括芯层，第一介电层，耐激光金属图案和第二介电层。 芯层包括第一表面，部件布置区域和设置在第一表面上并且包括多个焊盘的图案化金属层，并且焊盘位于部件布置区域内。 第一介电层设置在芯层上并且包括多个开口以分别暴露焊盘。 激光抵抗金属图案设置在第一电介质层上并且包围第一电介质层的投影区域，其中元件布置区域正交地投影在其上。 第二电介质层设置在第一电介质层上并覆盖耐激光金属图案，第二介电层包括与投影区域对应的部件设置腔，穿透第二介电层并与 露出垫的开口。

公开(公告)号：US20140083744A1

公开(公告)日：2014-03-27

申请号：US13949237

申请日：2013-07-24

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： WEN-HUNG HU

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H01L21/4857 ,  H01L23/13 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09127 ,  H01L2924/00

Abstract: A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.

Abstract translation: 印刷电路板包括依次布置的第一迹线层，第一介电层，第二迹线层，第二介电层，第三迹线层，第三介电层和第四迹线层。 在从第四迹线层延伸到第二介电层的印刷电路板中限定空腔。 第二电介质层的一部分暴露在空腔中。 与第二电介质层组合的第四迹线层的表面和与第一介电层结合的第二迹线层的表面都被粗糙化以增加粘合强度。

公开(公告)号：US08647926B2

公开(公告)日：2014-02-11

申请号：US12923081

申请日：2010-08-31

Applicant: Joon-Sik Shin ,  Nobuyuki Ikeguchi ,  Keungjin Sohn ,  Joung Gul Ryu ,  Sang-Youp Lee ,  Jung-Hwan Park ,  Ho-Sik Park

Inventor： Joon-Sik Shin ,  Nobuyuki Ikeguchi ,  Keungjin Sohn ,  Joung Gul Ryu ,  Sang-Youp Lee ,  Jung-Hwan Park ,  Ho-Sik Park

IPC: H01L21/00

CPC classification number: H01L23/145 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/068 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2201/10674 ,  H01L2224/05599

Abstract: A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.

Abstract translation: 制造半导体塑料封装的方法可以包括：提供包括至少一个焊盘并且具有9ppm /℃或更低的热膨胀系数的芯板; 在芯板上堆叠堆积绝缘层; 通过去除所述积层绝缘层的一部分使得所述垫暴露于外部而形成开口; 并将半导体芯片放置在开口中并将半导体芯片与焊盘电连接。 该方法可以用于在半导体芯片和电路板之间的连接中提供更高的可靠性。

公开(公告)号：US08610580B2

公开(公告)日：2013-12-17

申请号：US13449237

申请日：2012-04-17

Applicant: Paul Elizondo ,  John Azevedo

Inventor： Paul Elizondo ,  John Azevedo

IPC: G08B13/14

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A breakaway RFID tag is configured such that it includes part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

Abstract translation: 分离的RFID标签被配置为使得其包括印刷电路板组件（PCB）的一部分。 因此，分离的RFID标签可以用于在通过制造过程迁移时跟踪PCB。 在一个实施例中，RFID标签可以首先组装，然后用于跟踪PCB，因为它被填充有部件并且被安装到更大的组件中并且最终进入终端设备。 一旦PCB被安装到更大的组件或终端设备中，分离的RFID标签被配置成使得它可以被分解并且附接到较大组件或终端设备的外部。

公开(公告)号：US20130318786A1

公开(公告)日：2013-12-05

申请号：US13963463

申请日：2013-08-09

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hidehiro NAKAMURA

IPC: H05K13/00

CPC classification number: H05K13/00 ,  G01D1/00 ,  G01D15/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2203/061 ,  H05K2203/167

Abstract: A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

Abstract translation: 一种制造凹形连接器基板的方法包括：准备具有将板状连接器引导到连接位置和切割部分的引导/保持区域的引导基板的步骤; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。