Abstract:
An exemplary PCI interface card includes a printed circuit board having a plurality of testing points arranged thereon, and a connecting portion configured to engage in a PCI connector of a motherboard. The connecting portion protrudes from the printed circuit board, and has a plurality of golden fingers disposed thereon. Some of the golden fingers configured to respectively connect with contacts of the PCI connector, which are set to connect with a south bridge chip of the motherboard to transmit address and data signals, are respectively electronically connected to the testing points of the printed circuit board.
Abstract:
A printed circuit board on which multiple component-dedicated alignment line indicators including parallel lines may be used to facilitate the evaluation and segregation process during the production of printed circuit board assemblies based on the alignment characteristics of mounted disk drive electrical components with respect to these parallel lines. Each electrical component defines a perimeter with edges defining a first and second lateral distances and corners defining a diagonal distance. The alignment line indicators include first and second inner line segments spaced apart a first inner spacing at least the first lateral distance and less than the diagonal distance. The alignment line indicators include third and fourth inner line segments spaced apart at least the second lateral distance and less than the diagonal distance. The alignment line indicators include first and second outer line segments spaced apart more than the first inner spacing and less than the diagonal distance.
Abstract:
The invention discloses an identifiable flexible printed circuit board (PCB) and a method of fabricating the same. The identifiable flexible PCB includes a flexible substrate, a conductive layer, and a printing ink layer. First, the conductive layer is formed over a surface of the flexible substrate. Second, the printing ink layer is formed on the surface of the flexible substrate by coating, exposing, and developing to uncover parts of the conductive layer. Also, at least one identifiable area is formed on the printing ink layer and one can easily and correctly identify the cartridge with the flexible PCB.
Abstract:
Information regarding electrical components and their use is provided with a foldable information sheet having instructions thereon. The sheet has apertures which fit over the electrical components and information is printed on the sheet in proximity to the electrical component or components to which it applies. A portion of the information sheet may be adhered to a planar surface on which the components are mounted and non-adhered portions of the information sheet may be folded over the components.
Abstract:
A communication system is provided that includes both an electromagnetic (“EM”) communication device and an optical communication device including at least a machine readable symbol where at least a portion of the EM communication device and at least a portion of the machine readable symbol are formed from the same material. This material may be, for example, a conductable ink or a conductable foil. If desired, the EM communication device may include an antenna where at least a portion of the antenna includes at least a portion of the machine readable symbol.
Abstract:
A wireless suspension design is described that can be used in varying types of drive designs. In one embodiment, a flex circuit is provided with at least two indicia to indicate where the flex circuit is to be bent when attaching it to a head stack assembly.
Abstract:
An assembly comprises a substrate, such as a printed circuit board, with an electrically insulating layer provided thereon. The electrically insulating layer defines at least one opening, said opening being formed in a shape of an indicium relating to an aspect of the assembly.
Abstract:
The present invention relates to an electronic apparatus provided with a wiring board mounted with an electronic part having a plurality of leads on its four sides, the mounting direction of which is hard to be decided, which indicates an indication symbol corresponding to a part symbol indicated on the electronic part in a predetermined direction on the wiring board and thereby indicates the mounting direction of the mounted electronic part in a visually easily recognizable manner. An indication symbol 31 is indicated by silk printing in the same direction as that of a part symbol 21 indicated on an electronic part 20 in the vicinity of the electronic part 20 mounted on a wiring board 30 and if the part symbol 21 and the symbol of the indication symbol 31 are mounted in the same direction, the electronic part 20 is decided to be mounted correctly.
Abstract:
To provide a semiconductor package mounting method, with excellent work efficiency, wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.
Abstract:
An operation-related information display method includes storing information for identifying a printed-wiring board and information related to the printed-wiring board, identifying the printed-wiring board, obtaining information related to the printed-wiring board corresponding to the identified printed-wiring board, and when voluntary information is designated in the obtained information related to the printed-wiring board, displaying the designated information.