公开(公告)号：US20150349623A1

公开(公告)日：2015-12-03

申请号：US14527363

申请日：2014-10-29

Applicant: Hyundai Motor Company

Inventor： Ki Jong Lee ,  Tae Hwan Chung ,  Kang Ho Jeong

IPC: H02M1/088 ,  H02M7/539

CPC classification number: H02M1/088 ,  H02M1/08 ,  H02M7/003 ,  H02M7/539 ,  H05K1/0262 ,  H05K2201/09972 ,  H05K2201/10166 ,  Y10T307/297

Abstract: An inverter gate board divided into a low-voltage region and a high-voltage region includes a plurality of drive circuits surface-mounted between the low-voltage region and the high-voltage region, each having a single main power source (SMPS) controller, and a plurality of transformers surface-mounted between the low-voltage region and the high-voltage region so as to supply a transformed voltage to each of the plurality of drive circuits, respectively.

Abstract translation: 分为低电压区域和高电压区域的逆变器栅极板包括表面安装在低电压区域和高压区域之间的多个驱动电路，每个具有单个主电源（SMPS）控制器 以及表面安装在低电压区域和高电压区域之间的多个变压器，以便分别向多个驱动电路中的每一个提供变换电压。

公开(公告)号：US09204531B2

公开(公告)日：2015-12-01

申请号：US13495372

申请日：2012-06-13

Applicant: Don A. Gilliland ,  Dennis J. Wurth

Inventor： Don A. Gilliland ,  Dennis J. Wurth

IPC: H05K1/16 ,  H05K1/11 ,  H05K1/14 ,  H05K7/00 ,  H01R13/66 ,  H05K1/02

CPC classification number: H05K1/0231 ,  H05K1/0233 ,  H05K1/11 ,  H05K2201/086 ,  H05K2201/09972 ,  Y10T29/49155

Abstract: Methods and structures are provided for implementing feed-through and domain isolation using ferrite and containment barriers. A vertical isolator is provided between a first domain and a second domain on a printed circuit board with signals passing between the first domain and the second domain. The vertical isolator is placed over a domain separation gap between the first and second domains in the printed circuit board, the vertical isolator having a vertical isolation barrier between a first vertical plate coupled to the first domain and a second vertical plate coupled to the second domain. The vertical isolation barrier is formed of a unitary ferrite block or a non-conductive magnetic absorber material. A plurality of capacitance feed-through plates and a dielectric material are provided within the vertical isolator.

Abstract translation: 提供了方法和结构，用于实施使用铁素体和遏制屏障的馈通和区域隔离。 垂直隔离器设置在印刷电路板上的第一域和第二域之间，信号通过第一域与第二域之间。 垂直隔离器放置在印刷电路板中的第一和第二畴之间的畴分离间隙上，垂直隔离器在耦合到第一域的第一垂直板和耦合到第二域的第二垂直板之间具有垂直隔离屏障 。 垂直隔离屏障由单一铁氧体块或非导电磁性吸收材料形成。 在垂直隔离器内提供多个电容馈通板和电介质材料。

公开(公告)号：US09203320B2

公开(公告)日：2015-12-01

申请号：US13532080

申请日：2012-06-25

Applicant: Pierre Sardat ,  Bruno Hadjelis ,  Hubert Lescot

Inventor： Pierre Sardat ,  Bruno Hadjelis ,  Hubert Lescot

IPC: H03K19/0175 ,  H02M3/02 ,  H02M3/335 ,  H02M7/00 ,  H05K1/02

CPC classification number: H02M3/33523 ,  H02M7/003 ,  H05K1/0227 ,  H05K1/0262 ,  H05K2201/09972

Abstract: This printed circuit board (12) comprising: a first portion (20) having first electronic components (22) of which the earth electrode is on a first voltage source (14); a second portion (24) having second electronic components (26) of which the earth electrode is on a second voltage source (16); a switched-mode power supply circuit (34) of which one input is connected to the first portion (20) and of which at least one output is connected to the second portion (24), is characterized in that it comprises modification means (36) for modifying a switching frequency of the switched-mode power supply circuit (34) depending on data values (32) to be transmitted between the first portion (20) and the second portion (24), the said data being able to take at least two distinct values.

Abstract translation: 该印刷电路板（12）包括：具有第一电子部件（22）的第一部分（20），其中接地电极在第一电压源（14）上; 具有第二电子部件（26）的第二部分（24），其中接地电极位于第二电压源（16）上; 一个开关模式电源电路（34），其一个输入端连接到第一部分（20），其中至少一个输出端连接到第二部分（24），其特征在于它包括修改装置（36） ），用于根据要在第一部分（20）和第二部分（24）之间传输的数据值（32）来修改开关模式电源电路（34）的开关频率，所述数据能够接收 至少两个不同的值。

公开(公告)号：US20150334820A1

公开(公告)日：2015-11-19

申请号：US14810920

申请日：2015-07-28

Applicant: Yazaki Corporation

Inventor： Masashi Suzuki

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H05K1/0201 ,  H05K1/0207 ,  H05K1/181 ,  H05K2201/09972

Abstract: A heatsink-less electronic unit includes a metal coreless electronic substrate, a heatsink-less microcomputer and various semiconductor relays. The heatsink-less microcomputer and the various semiconductor relays are mounted on the metal coreless electronic substrate. The heatsink-less microcomputer is arranged on the metal coreless electronic substrate. Among from the various semiconductor relays, one which may reach highest temperature is separated at a longest distance from a location where the heatsink-less microcomputer is arranged, and the various semiconductor relays are arranged separately from one another.

Abstract translation: 无散热电子单元包括金属无芯电子基板，无散热微型计算机和各种半导体继电器。 无电镀微机和各种半导体继电器安装在金属无芯电子基板上。 该无散热微型计算机设置在无金属无芯电子基板上。 在各种半导体继电器中，可以达到最高温度的半导体继电器与布置有无散热微型计算机的位置最远的距离分离，并且各种半导体继电器彼此分开布置。

公开(公告)号：US20150271911A1

公开(公告)日：2015-09-24

申请号：US14308463

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng CHEN ,  Shankar S. PENNATHUR

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/30 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K1/0216 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/18 ,  H05K3/284 ,  H05K3/30 ,  H05K9/00 ,  H05K9/0081 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2203/1322 ,  Y10T29/49146

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Abstract translation: 公开了一种封装在系统级封装中的便携式电子设备。 便携式电子设备可以包括基板和安装在基板上并包括在一个或多个子系统中的多个部件。 通过在部件之间设置绝缘层，在子系统之间形成窄沟槽，以及在绝缘层上沉积多层薄膜堆叠的一层或多层并填充沟槽，可以减少或消除子系统之间或外部源之间的干扰。 在一些实例中，多层薄膜堆叠可以包括粘附层，屏蔽层，保护层和化妆品层。 在一些实例中，多层薄膜堆叠可以包括多功能层，例如保护和化妆品层。

公开(公告)号：US20150245493A1

公开(公告)日：2015-08-27

申请号：US14632279

申请日：2015-02-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masayuki HIGASHI

IPC: H05K3/00 ,  H05K3/30

CPC classification number: H05K13/08 ,  H05K3/34 ,  H05K13/085 ,  H05K13/0853 ,  H05K2201/09972 ,  H05K2203/1476 ,  Y10T29/49137 ,  Y10T29/53174

Abstract: A component mounting system makes a mounting head to which a component holder is attached perform component mounting operation including upward and downward movement operation with respect to a board and mounts a component on the board. A mounting apparatus repeats reciprocating mounting operations in which the component holder is moved in a mounting order relative to a reference line extending in a first direction being the board conveyance direction such that that the component holder is advanced over the board in a second direction orthogonal to the first direction and then a held high-height component is mounted and thereafter the component holder is retracted from the board in the second direction. The mounting order is set in order in which a mounting coordinate of the high-height component is larger in the second direction relative to the reference line.

Abstract translation: 部件安装系统使得安装有部件保持器的安装头执行组件安装操作，其包括相对于板的向上和向下移动操作，并将部件安装在板上。 安装装置重复往复安装操作，其中部件保持器相对于沿着板传送方向的第一方向延伸的参考线以安装顺序移动，使得部件保持器在与第一方向垂直的第二方向上前进到板上 安装第一方向，然后安装保持的高高度部件，此后部件保持器在第二方向上从板退回。 按照顺序设置安装顺序，其中高高度部件的安装坐标相对于参考线在第二方向上较大。

公开(公告)号：US20150245492A1

公开(公告)日：2015-08-27

申请号：US14626085

申请日：2015-02-19

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka SHIMABE ,  Toshiki Furutani ,  Shunsuke Sakai

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H01L23/5389 ,  H01L21/4857 ,  H01L21/568 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2924/153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09972 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions.

Abstract translation: 具有内置电子部件的多层布线基板包括具有绝缘材料并具有多个开口部的基板，形成在基板的表面上的具有开口部的第一导体层，使得基板在开口部内部具有开口部 第一导体层的一部分，位于基板的开口部的多个电子部件和形成在基板上的绝缘层，使得绝缘层形成在电子部件上和第一导体层上。 开口部形成在基板上，使得开口部分包括两个开口部分，并且基板具有形成在两个开口部之间的分隔壁。

公开(公告)号：US09101050B2

公开(公告)日：2015-08-04

申请号：US14090387

申请日：2013-11-26

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaya Shimamura ,  Kenzo Kitazaki ,  Eiji Mugiya ,  Tatsuro Sawatari ,  Tetsuo Saji ,  Hiroshi Nakamura

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0216 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/107 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/09972 ,  H01L2924/00

Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.

Abstract translation: 电路模块包括电路基板，安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有从密封体的主表面到安装表面形成的沟槽。 沟槽包括由安装表面侧的第一侧壁和主表面侧的第二侧壁构成的侧壁。 连接第一点和第二点的直线具有比靠着安装表面的第一斜坡更缓和的第二斜率。 屏蔽罩覆盖密封体并具有形成在沟槽内的内屏蔽部分和设置在主表面和内屏蔽上的外屏蔽部分。

公开(公告)号：US09066439B2

公开(公告)日：2015-06-23

申请号：US13483587

申请日：2012-05-30

Applicant: Hiroshi Segawa ,  Nobuyuki Naganuma ,  Michimasa Takahashi ,  Teruyuki Ishihara

Inventor： Hiroshi Segawa ,  Nobuyuki Naganuma ,  Michimasa Takahashi ,  Teruyuki Ishihara

IPC: H05K1/16 ,  H05K3/30 ,  H05K3/36 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/141 ,  H05K1/142 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09972 ,  H05K2203/1189 ,  Y10T29/49126

Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.

Abstract translation: 布线基板具有第一布线基板，其具有第一阻焊层，第二布线基板与第一布线基板连接，位于形成于第一布线基板的第一阻焊层的第一开口部， 连接到第一布线板并且位于形成在第一布线板的第一阻焊层中的第二开口部分中，使得第二布线板和第三布线板位于第一布线板的同一侧。 第一布线板的第一开口部分和第一布线板的第二开口部分形成在第一阻焊层中容纳第二和第三布线板的公共开口部分或分离容纳第二布线板的单独开口部分， 第一阻焊层中的第三布线板。

公开(公告)号：US20150131354A1

公开(公告)日：2015-05-14

申请号：US14444393

申请日：2014-07-28

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yuji Nakajima ,  Shigeyasu Iwata

IPC: H02M7/00 ,  H02M7/04

CPC classification number: H02M7/003 ,  H02M7/04 ,  H05K1/0256 ,  H05K1/144 ,  H05K1/165 ,  H05K3/4682 ,  H05K7/1432 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09163 ,  H05K2201/09672 ,  H05K2201/09972 ,  H05K2201/10303

Abstract: According to one embodiment, an AC-DC converter includes a first printed wiring board, a planar transformer, a plurality of primary members, and a plurality of secondary members. The planar transformer has a primary coil, a secondary coil, a second printed wiring board and a core. The primary members are mounted on the first printed wiring board, and are electrically connected to the primary coil. The secondary members are mounted on the second printed wiring board, and are electrically connected to the secondary coil.

Abstract translation: 根据一个实施例，AC-DC转换器包括第一印刷线路板，平面变压器，多个主要部件和多个次要部件。 平面变压器具有初级线圈，次级线圈，第二印刷线路板和芯。 主要部件安装在第一印刷线路板上，并与初级线圈电连接。 次要部件安装在第二印刷线路板上，并且与次级线圈电连接。