公开(公告)号：US09974180B2

公开(公告)日：2018-05-15

申请号：US14801686

申请日：2015-07-16

Applicant: Apple Inc.

Inventor： Shayan Malek ,  David A. Pakula ,  Gregory N. Stephens ,  Sawyer I. Cohen ,  Scott A. Myers ,  Tyler B. Cater ,  Eric W. Bates

IPC: G06F1/16 ,  H05K1/18

CPC classification number: H05K1/181 ,  G06F1/1658 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10598 ,  Y02P70/611

Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff. The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

公开(公告)号：US20180123014A1

公开(公告)日：2018-05-03

申请号：US15566784

申请日：2016-04-22

Applicant: Robert Bosch GmbH

Inventor： Tobias Zoller ,  Ricardo Ehrenpfordt ,  Holger Rank ,  Frederik Ante

IPC: H01L35/32 ,  H01L35/06 ,  H01L35/10 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/06 ,  H01L35/10 ,  H01L35/34 ,  H01L2224/48091 ,  H05K1/0271 ,  H05K1/0277 ,  H05K2201/09063 ,  H05K2201/10219 ,  H05K2203/049 ,  H05K2203/308 ,  H01L2924/00014

Abstract: A thermoelectric device includes a printed circuit board, a component which is arranged on the printed circuit board, a cover which covers the printed circuit board, a thermoelectric generator, and a spring unit. The thermoelectric generator is thermally connected to the printed circuit board or metal paths on the printed circuit board and to the cover in order to generate an electric supply voltage for the component from the temperature difference between the printed circuit board and the cover. The spring unit elastically holds the thermoelectric generator between the printed circuit board and the cover.

公开(公告)号：US09913405B2

公开(公告)日：2018-03-06

申请号：US14668017

申请日：2015-03-25

Applicant: International Business Machines Corporation

Inventor： Jeffrey P. Gambino ,  Richard S. Graf ,  Sudeep Mandal ,  David J. Russell

IPC: H01L21/00 ,  H05K7/20 ,  H01L35/34 ,  H01L23/15 ,  H01L23/38 ,  H05K1/03 ,  H01L23/13 ,  H01L23/00

CPC classification number: H05K7/2039 ,  H01L23/13 ,  H01L23/15 ,  H01L23/38 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L35/34 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/0306 ,  H05K2201/10219 ,  H05K2201/10378 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.

公开(公告)号：US09883598B2

公开(公告)日：2018-01-30

申请号：US15289950

申请日：2016-10-10

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Ming-Hao Wu ,  Cheng-Po Yu

IPC: H01L35/30 ,  H05K3/46 ,  H05K1/18 ,  H05K1/02 ,  G06F1/20 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

公开(公告)号：US20170257975A1

公开(公告)日：2017-09-07

申请号：US15601256

申请日：2017-05-22

Applicant: Honeywell International Inc.

Inventor： Peter Charles Strickland ,  Sergiy Borysenko ,  Bradley Jessup

IPC: H05K7/20 ,  H05K3/06 ,  H05K1/02

CPC classification number: H05K7/20 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/06 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10219 ,  Y10T29/49156 ,  Y10T29/49361

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

公开(公告)号：US20160358849A1

公开(公告)日：2016-12-08

申请号：US15174677

申请日：2016-06-06

Applicant: North Carolina State University

Inventor： Jesse S. Jur ,  Murat Yokus ,  Rachel Foote ,  Amanda Caton Myers ,  Raj Pravinbhai Bhakta

IPC: H01L23/528 ,  H01L23/532

CPC classification number: H05K1/0283 ,  G01N33/367 ,  H01L23/4985 ,  H01L23/49883 ,  H01L33/62 ,  H05K1/038 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10219

Abstract: Provided herein are flexible interconnects, systems containing one or more flexible interconnects, and textiles including one or more flexible interconnects.

Abstract translation: 本文提供了柔性互连，包含一个或多个柔性互连的系统和包括一个或多个柔性互连的纺织品。

公开(公告)号：US20160286686A1

公开(公告)日：2016-09-29

申请号：US14668017

申请日：2015-03-25

Applicant: International Business Machines Corporation

Inventor： Jeffrey P. Gambino ,  Richard S. Graf ,  Sudeep Mandal ,  David J. Russell

IPC: H05K7/20 ,  H05K3/00 ,  H05K1/09 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K7/2039 ,  H01L23/13 ,  H01L23/15 ,  H01L23/38 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L35/34 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/0306 ,  H05K2201/10219 ,  H05K2201/10378 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.

Abstract translation: 本发明一般涉及集成电路（IC）芯片封装，更具体地，涉及一种形成具有一个或多个嵌入式珀耳帖器件的玻璃插入件以及导电通孔的结构和方法，以帮助从一个或多个IC散发热量 通过玻璃插入件将芯片封装在多维芯片封装中，并进入有机载体，在其中可将其分散到下面的基板中。

公开(公告)号：US09322580B2

公开(公告)日：2016-04-26

申请号：US14176388

申请日：2014-02-10

Applicant: Laird Technologies, Inc.

Inventor： Jeffrey Gerard Hershberger ,  Richard F. Hill ,  Robert Michael Smythe ,  Michael G. Sutsko

IPC: H05K7/20 ,  F25B21/02 ,  H05K1/02 ,  H01L23/38 ,  H01L35/32 ,  H01L35/30 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00

CPC classification number: F25B21/02 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/205 ,  H05K2201/10219 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.

Abstract translation: 电路组件通常包括电路板和被配置为将热电模块耦合到电路板的至少一个电路径。 当热电模块经由至少一个电路径耦合到电路板时，电路板和至少一个电路径形成热电模块的一部分。 包括构成热电模块的一部分的电路板的部分的热电模块限定了小于电路板的覆盖区的覆盖区。 因此，电路板能够在由热电模块限定的覆盖区以外的位置支撑电路板上的电气部件。

公开(公告)号：US20150003017A1

公开(公告)日：2015-01-01

申请号：US14365084

申请日：2012-12-06

Applicant: THALES

Inventor： Christian Tantolin ,  Claude Sarno

IPC: H05K7/20

CPC classification number: H05K7/20009 ,  H01L23/38 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/062 ,  H05K2201/10219 ,  H01L2924/00

Abstract: A system for regulating the temperature of printed circuit boards comprises a first assembly of at least one Peltier element, for regulating the temperature of a second assembly of at least one electronic component or for harvesting thermal energy dissipated by the second assembly. At least one Peltier element of the first assembly is coupled to first heat-exchanging means that are coupled to at least one electronic component of the second assembly, and to second heat-exchanging means allowing thermal energy given off from at least one Peltier element of the first assembly to be dissipated.

Abstract translation: 用于调节印刷电路板的温度的系统包括至少一个珀耳帖元件的第一组件，用于调节至少一个电子部件的第二组件的温度或用于收集由第二组件耗散的热能。 第一组件的至少一个珀耳帖元件被耦合到耦合到第二组件的至少一个电子部件的第一热交换装置，以及允许从至少一个珀耳帖元件发出的热能的第二热交换装置 第一个要消散的组件。

公开(公告)号：US20140185312A1

公开(公告)日：2014-07-03

申请号：US14135160

申请日：2013-12-19

Applicant: Duane Louderback

Inventor： Duane Louderback

IPC: F21V29/00 ,  H01L33/64 ,  H05K3/30 ,  H01S5/024

CPC classification number: H05K1/0203 ,  F21V29/54 ,  H01L23/24 ,  H01L33/645 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02415 ,  H05K2201/10106 ,  H05K2201/10219 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An optical module apparatus and method operates at high temperatures. The apparatus has a first printed circuit board with optoelectronics and electronics located on a thermoelectric cooler. The thermoelectric cooler is located on a second printed circuit board that also has electronics that control the thermoelectric cooler separately mounted thereon. The optical module operates at substantially higher temperatures by placing the optoelectronics and the electronics, not including the thermoelectric cooler controller, on the thermoelectric cooler. The electronics controlling the thermoelectric cooler only require relatively simple, low-speed electronics that are implemented in integrated circuit technologies. The integrated circuit electronics may operate at very high temperatures (200° C. or higher) thereby making control of the thermoelectric cooler with uncooled electronics possible.

Abstract translation: 光模块装置和方法在高温下运行。 该装置具有位于热电冷却器上的具有光电子和电子器件的第一印刷电路板。 热电冷却器位于第二印刷电路板上，该印刷电路板还具有控制分别安装在其上的热电冷却器的电子器件。 光学模块通过将光电子器件和电子设备（不包括热电冷却器控制器）放置在热电冷却器上而在更高的温度下工作。 控制热电冷却器的电子器件仅需要在集成电路技术中实现的相对简单的低速电子设备。 集成电路电路可以在非常高的温度（200℃或更高）下运行，从而使得具有非制冷电子部件的热电冷却器成为可能。