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    Process for manufacturing a wiring board having a via
    22.
    发明授权
    Process for manufacturing a wiring board having a via 失效
    具有通路的布线基板的制造方法

    公开(公告)号：US07205230B2

    公开(公告)日：2007-04-17

    申请号：US10914227

    申请日：2004-08-10

    Applicant: Naohiro Mashino

    Inventor： Naohiro Mashino

    IPC: H01L21/44

    CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

    Abstract: A process for manufacturing a wiring board comprising a substrate made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrate to electrically connect the first conductor pattern with the second conductor pattern; the process comprising the following steps of: forming the substrate with a through-hole penetrating thereto and defining openings at the first and second surfaces, respectively; plating the substrate with a metal so that a metal layer having a predetermined thickness is formed on the respective first and second surfaces of the substrate and the through-hole is substantially filled with the metal to be the via conductor; irradiating a laser beam, as a plurality of spots, around a metal-less portion of the plated metal, such as a dimple or seam, at positions corresponding to the openings of the through-hole, so that the a part of the plated metal melts to fill the metal-less portion with the molten metal.

    Abstract translation: 一种制造布线板的方法，包括由绝缘材料制成并具有第一和第二表面的基底，分别形成在第一和第二表面上的第一和第二导体图案，以及穿过基板的通孔导体，以将第一导体 图案与第二导体图案; 该方法包括以下步骤：用穿透其的通孔形成基底并分别在第一和第二表面处限定开口; 用金属电镀基板，使得在基板的相应的第一和第二表面上形成具有预定厚度的金属层，并且通孔基本上填充有作为通孔导体的金属; 在对应于通孔的开口的位置处，将激光束作为多个点照射在电镀金属的无金属部分（例如凹坑或接缝）周围，使得电镀金属的一部分 熔化以用熔融金属填充无金属部分。

    Anchor point for RF circuit boards and related methods
    24.
    发明申请
    Anchor point for RF circuit boards and related methods 审中-公开
    RF电路板的锚点及相关方法

    公开(公告)号：US20030062196A1

    公开(公告)日：2003-04-03

    申请号：US09970170

    申请日：2001-10-03

    Inventor： Tina Barcley ,  Steven G. McNeal ,  Elias D. Lebbos ,  Keith B. Carle

    IPC: H05K001/16

    CPC classification number: H05K3/44 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4084 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2201/10416 ,  H05K2201/10666

    Abstract: A circuit board includes a first layer of an electrically non-conducting material for carrying circuit components, and a second layer of an electrically conductive material for providing a common ground. At least one spot of a relatively more solderable material than the material of the second layer is in electrical contact with the second layer and is aligned with an opening through the first layer so that electrical connection can be made between the components on the first layer and the second layer by soldering to the spot. These anchor points provide a reliable way to connect circuit components to a common ground, from the top of the circuit board, without having to use backside screws and without having to penetrate the second layer.

    Abstract translation: 电路板包括用于承载电路部件的非导电材料的第一层和用于提供公共地面的导电材料的第二层。 与第二层的材料相比，可焊接材料的至少一个点与第二层电接触并且与通过第一层的开口对准，使得可以在第一层上的部件和 第二层通过焊接到现场。 这些固定点提供了将电路部件从电路板的顶部连接到公共接地的可靠方式，而不必使用背面螺钉，而不必穿透第二层。

    Electrically conducting bonding connection
    25.
    发明申请
    Electrically conducting bonding connection 失效
    导电接合连接

    公开(公告)号：US20030019664A1

    公开(公告)日：2003-01-30

    申请号：US10196027

    申请日：2002-07-16

    Inventor： Kurt Gross ,  Hans Rappl

    IPC: H05K007/04 ,  H05K007/02 ,  H05K003/42

    CPC classification number: H01L23/13 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/308 ,  H05K3/44 ,  H05K2201/1025 ,  H05K2201/10416 ,  H05K2201/1059 ,  Y10T29/49147 ,  Y10T29/49153 ,  H01L2924/00

    Abstract: An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).

    Abstract translation: 在布置在导电支撑板（1）的电子电路（S）和支撑板（1）之间通过提供一个孔（4,5）而产生导电接合连接（B） 具有可粘合表面（3）的元件（2）以支撑板（1）和接合元件（2）进入导电和摩擦连接的方式被按压; 随后用接合元件（2）产生接合连接。

    Flexible printed circuit board and electronic component assembly
    27.
    发明授权
    Flexible printed circuit board and electronic component assembly 有权
    柔性印刷电路板和电子元器件组装

    公开(公告)号：US07943855B2

    公开(公告)日：2011-05-17

    申请号：US11425442

    申请日：2006-06-21

    Applicant: Chi-Chen Cheng ,  Chi-Chung Lo

    Inventor： Chi-Chen Cheng ,  Chi-Chung Lo

    IPC: H05K1/00

    CPC classification number: H05K1/0204 ,  H05K1/189 ,  H05K3/281 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/10689

    Abstract: A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat produced from the electronic component can be transmitted to the main layer by a heat-conductive medium between the electronic component and the main layer, and can be diffused via the first opening.

    Abstract translation: 柔性印刷电路（FPC）和电子部件组件。 FPC包括具有第一开口的第一保护层，第一保护层上的主层，以及具有暴露主层的第二开口的第二保护层。 由电子部件产生的热量可以通过电子部件和主体层之间的导热介质传输到主层，并且可以经由第一开口扩散。

    Structure for repairing or modifying surface connections on circuit boards
    30.
    发明授权
    Structure for repairing or modifying surface connections on circuit boards 有权
    修理或修改电路板表面连接的结构

    公开(公告)号：US07199309B2

    公开(公告)日：2007-04-03

    申请号：US11167662

    申请日：2005-06-27

    Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

    Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

    IPC: H01R12/04 ,  H05K1/11

    CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

    Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

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