公开(公告)号：US20140240932A1

公开(公告)日：2014-08-28

申请号：US13843873

申请日：2013-03-15

Applicant: MC10, INC.

Inventor： Yung-Yu Hsu

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

Abstract translation: 提供缓冲结构，其可以用于减少适应电子系统中的应变，其包括与更刚性的装置部件电连通的顺应部件。 缓冲结构设置在适配电子系统上或至少部分嵌入适配电子系统中，使得缓冲结构与柔顺部件和更刚性的器件部件之间的连接区域的至少一部分重叠。 缓冲结构可以具有比适形电子系统的密封剂更高的杨氏模量值。

公开(公告)号：US20140160622A1

公开(公告)日：2014-06-12

申请号：US13842121

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hae Sock CHUNG ,  Doo Young KIM ,  Na Rim HA ,  Youn Sik JIN ,  Tae Ok KIM

IPC: H05K1/02 ,  H01G4/12 ,  H05K1/18 ,  H01G4/012

CPC classification number: H05K1/0231 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01G4/38 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1028 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/43

Abstract: There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.

Abstract translation: 提供了一种层叠型多层陶瓷电子部件，包括：陶瓷体，多个第一和第二内部以及形成在陶瓷元件的彼此相对的两个表面上的第一和第二外部电极; 以及第一和第二金属框架，其被设置为彼此面对并且允许陶瓷体的第一和第二外部电极分别附接到其上，其中两个或更多个陶瓷体在第一和第二金属框架之间沿长度方向 第一和第二金属框架之间具有间隔，并且各个陶瓷体具有不同的电容水平。

公开(公告)号：US20140154894A1

公开(公告)日：2014-06-05

申请号：US14007127

申请日：2012-03-23

Applicant: Andreas Heise

Inventor： Andreas Heise

IPC: H05K3/20 ,  H05K13/04 ,  H05K1/11

CPC classification number: H05K3/20 ,  H01R43/205 ,  H05K1/117 ,  H05K1/118 ,  H05K3/202 ,  H05K3/4015 ,  H05K13/04 ,  H05K13/0417 ,  H05K13/046 ,  H05K2201/1028 ,  H05K2203/033 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/53174

Abstract: A method for producing an electric contact sensor plate and for populating an electric or electronic module with the contact sensor plate in an automated manner is provided. An end piece of a metal foil strip is fed in a feeding step, in which the contact sensor plate is positioned on the electric or electronic module in a positioning step, and in which the contact sensor plate is fastened on the electric or electronic module in a fastening step. The method is characterized in that the contact sensor plate is produced by being severed from the foil strip in a severing step that follows the feeding step and precedes the positioning step.

Abstract translation: 提供了一种用于制造电接触传感器板并且用自动方式用接触传感器板填充电气或电子模块的方法。 在馈电步骤中馈送金属箔条的端部，其中接触传感器板在定位步骤中位于电气或电子模块上，并且其中接触传感器板被紧固在电气或电子模块上 紧固步骤。 该方法的特征在于，接触传感器板通过在跟随进给步骤并在定位步骤之前的切断步骤中从箔条切断而制造。

公开(公告)号：US20140106560A1

公开(公告)日：2014-04-17

申请号：US14132157

申请日：2013-12-18

Applicant: Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushcheko ,  Guanghai Xu

Inventor： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushcheko ,  Guanghai Xu

IPC: H01L23/00

CPC classification number: H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract translation: 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。

公开(公告)号：US20110284924A1

公开(公告)日：2011-11-24

申请号：US13052025

申请日：2011-03-18

Applicant: Satoshi TERAMAE

Inventor： Satoshi TERAMAE

IPC: H01L29/739 ,  H01L27/12

CPC classification number: H01L25/072 ,  H01L23/04 ,  H01L23/049 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L2224/29101 ,  H01L2224/32013 ,  H01L2224/32238 ,  H01L2224/45124 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/222 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/1028 ,  H05K2201/10287 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device includes: an insulating substrate; a first electrode pattern and a second electrode pattern provided apart from each other on a major surface of the insulating substrate; a semiconductor element connected to the first electrode pattern; an electrode terminal connected to the second electrode pattern; and a connection wiring. The connection wiring electrically connects the first electrode pattern and the second electrode pattern with each other and has a thermal resistance larger than that of the first electrode pattern.

Abstract translation: 半导体器件包括：绝缘基板; 在所述绝缘基板的主表面上彼此分开设置的第一电极图案和第二电极图案; 连接到第一电极图案的半导体元件; 连接到第二电极图案的电极端子; 和连接线。 连接布线将第一电极图案和第二电极图案彼此电连接并且具有比第一电极图案的热阻大的热阻。

公开(公告)号：US20110274866A1

公开(公告)日：2011-11-10

申请号：US13186486

申请日：2011-07-20

Applicant: CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: B65D65/28

CPC classification number: H05K3/0097 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T428/15

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. Each of the folding portions defines at least one groove in at least one side thereof along the at least one line of weakness.

Abstract translation: 提供了用于制造多层印刷电路板的示例性内基板。 内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。 每个基板单元被构造成用于形成一体的印刷电路板。 每个折叠部分在相邻的基板单元之间互连。 每个折叠部分限定垂直于内部基板的纵向方向的至少一条弱线，以便于相邻的基板单元相互折叠和展开。 每个折叠部分沿着至少一条弱点在其至少一侧限定至少一个凹槽。

公开(公告)号：US20110247872A1

公开(公告)日：2011-10-13

申请号：US12756748

申请日：2010-04-08

Applicant: Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushchenko ,  Guanghai Xu

Inventor： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushchenko ,  Guanghai Xu

IPC: H05K1/11 ,  B23K1/00 ,  H05K1/09

CPC classification number: H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract translation: 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。

公开(公告)号：US07986034B2

公开(公告)日：2011-07-26

申请号：US12052863

申请日：2008-03-21

Applicant: Alfred Kemper ,  Guido Strotmann

Inventor： Alfred Kemper ,  Guido Strotmann

IPC: H01L23/49 ,  H01L23/498 ,  H01L21/00

CPC classification number: H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/4853 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48458 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0285 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for producing a power semiconductor module including forming a contact between a contact region and a contact element as an ultrasonic welding contact via a sonotrode. The ultrasonic welding operation also being used for joining the contact regions with the contact ends and consequently for joining the contacts and the foot regions.

Abstract translation: 一种用于生产功率半导体模块的方法，包括通过超声波焊接形成作为超声波焊接接点的接触区域和接触元件之间的接触。 超声波焊接操作也用于将接触区域与接触端部接合，并且因此用于接合触头和脚部区域。

公开(公告)号：US20110143625A1

公开(公告)日：2011-06-16

申请号：US13033307

申请日：2011-02-23

Applicant: Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

Inventor： Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC: H01J9/00

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract translation: 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US07948762B2

公开(公告)日：2011-05-24

申请号：US12027751

申请日：2008-02-07

Applicant: Marta Castillo Garcia ,  Miguel Angel Herrero Perez

Inventor： Marta Castillo Garcia ,  Miguel Angel Herrero Perez

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/058 ,  H05K2201/1028 ,  H05K2201/10356

Abstract: Wiring system which comprises: a flexible printed circuit board (1) with a surface (2) in turn comprising one or more electrical circuits formed by conductive strips (4) and a plurality of electronic components (5) connected to said conductive strips (4) and with at least one extension or branch (6) extending directly from said surface (2) and also comprising conductive strips (7); characterized in that it further comprised: at least one flexible flat cable (8) joined to said at least one extension or branch (6), such that an electrical connection is formed between said flexible flat cable (8) and said extension or branch (6). A vehicle door which internally comprises this wiring system.

Abstract translation: 一种布线系统，包括：具有表面（2）的柔性印刷电路板（1），其又包括由导电条（4）形成的一个或多个电路和连接到所述导电条（4）的多个电子元件（5） ）和至少一个从所述表面（2）直接延伸并且还包括导电条（7）的延伸部分（6）; 其特征在于，还包括：连接到所述至少一个延伸部或分支（6）的至少一个柔性扁平电缆（8），使得在所述柔性扁平电缆（8）和所述延伸部或分支（6）之间形成电连接 6）。 内部包括该接线系统的车门。