公开(公告)号：US08198138B2

公开(公告)日：2012-06-12

申请号：US11866065

申请日：2007-10-02

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L21/00

CPC classification number: H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Methods for providing and using semiconductor device assemblies or packages include providing or using various elements of a semiconductor device assembly or package. Such a semiconductor device package or assembly may include a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate of such a semiconductor device assembly or package may also include a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die may be aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, may extend from bond pads of the semiconductor die, extend through the opening, protrude beyond the second surface of the substrate, and extend to substrate pads on the second surface. An encapsulant, which may fill the opening and cover the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate.

Abstract translation: 提供和使用半导体器件组件或封装的方法包括提供或使用半导体器件组件或封装的各种元件。 这种半导体器件封装或组件可以包括与衬底的第一表面相邻的衬底和半导体管芯。 这种半导体器件组件或封装的衬底还可以包括与第一表面相对的第二表面，从第一表面和第二表面延伸的开口，第二表面上的接触焊盘和第二表面上的衬底焊盘 到开幕 半导体管芯的焊盘可以与通过衬底的开口对准。 中间导电元件（例如接合线）可以从半导体管芯的接合焊盘延伸，延伸穿过开口，突出超过衬底的第二表面，并延伸到第二表面上的衬底焊盘。 可以填充开口并覆盖中间导电元件的密封剂突出超过衬底的第二表面所在的平面。 离散导电元件，例如焊球，可能从基板的接触垫突出。

公开(公告)号：US08164175B2

公开(公告)日：2012-04-24

申请号：US12714193

申请日：2010-02-26

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L23/04

CPC classification number: H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the first surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Another electronic device, such as another semiconductor device package, may communicate electrically with the die of the semiconductor device assembly through the contact pads on the first surface of the substrate. In some embodiments, the other electronic device may be stacked with the semiconductor device assembly.

Abstract translation: 半导体器件组件包括与衬底的第一表面相邻的衬底和半导体管芯。 衬底还包括与第一表面相对的第二表面，从第一表面和第二表面延伸的开口，第一表面上的接触焊盘以及与开口相邻的第二表面上的衬底焊盘。 半导体管芯的焊盘与通过衬底的开口对准。 诸如接合线的中间导电元件从半导体管芯的接合焊盘延伸通过开口，延伸到衬底的相对的第二表面上的衬底焊盘。 填充开口并覆盖中间导电元件的密封剂突出超过衬底的第二表面所在的平面。 诸如另一半导体器件封装的另一电子器件可以通过衬底的第一表面上的接触焊盘与半导体器件组件的管芯电连通。 在一些实施例中，其他电子设备可以与半导体器件组件堆叠。

公开(公告)号：US20120091572A1

公开(公告)日：2012-04-19

申请号：US13379930

申请日：2009-06-22

Applicant: Tsuneo Hamaguchi ,  Ikio Sugiura ,  Hiroo Sakamoto ,  Masaki Iwata ,  Takashi Shirase ,  Takashi Okamuro

Inventor： Tsuneo Hamaguchi ,  Ikio Sugiura ,  Hiroo Sakamoto ,  Masaki Iwata ,  Takashi Shirase ,  Takashi Okamuro

IPC: H01L23/495

CPC classification number: H01L23/24 ,  H01L23/055 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49805 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15162 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K3/3442 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The semiconductor package includes a package wiring board having an element housing recessed portion on its top surface to house a semiconductor element; multiple side electrodes which are arranged on the outer side surface of the package wiring board and soldered to multiple motherboard electrodes arranged on a motherboard; a semiconductor element fixed onto the bottom surface of the element housing recessed portion; and an element electrode arranged on the bottom of the element housing recessed portion and electrically connected to the semiconductor element and the side electrodes. The package wiring board has a multilayered structure in which woven fabric and a resin adhesive layer are alternately laminated, and the resin adhesive layer is formed of a resin adhesive that contains inorganic filler particles.

Abstract translation: 半导体封装包括封装布线板，该封装布线板在其顶表面上具有容纳凹部的元件，以容纳半导体元件; 布置在封装布线板的外侧表面并焊接到布置在母板上的多个母板电极的多个侧电极; 固定在元件容纳凹部的底面上的半导体元件; 以及元件电极，其设置在元件容纳凹部的底部并电连接到半导体元件和侧电极。 封装布线板具有多层结构，其中机织织物和树脂粘合剂层交替层压，并且树脂粘合剂层由含有无机填料颗粒的树脂粘合剂形成。

公开(公告)号：US08159830B2

公开(公告)日：2012-04-17

申请号：US12426106

申请日：2009-04-17

Applicant: Laurent Sustek ,  Stephane Di Vito

Inventor： Laurent Sustek ,  Stephane Di Vito

IPC: H01L23/02

CPC classification number: H05K3/3442 ,  G06K19/07745 ,  H01L2224/48091 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: A device includes a carrier and an integrated circuit chip having a first side supported by the carrier and a second side having contacts. The carrier has multiple carrier contacts supported by the carrier and separated from the integrated circuit chip. Multiple leads are coupled between the contacts on the integrated circuit chip and the multiple carrier contacts. A resin encapsulates the integrated circuit chip leaving the multiple carrier contacts at least partially uncovered for attaching to a card or board.

Abstract translation: 一种器件包括载体和集成电路芯片，其具有由载体支撑的第一侧和具有触点的第二侧。 载体具有由载体支撑并且与集成电路芯片分离的多个载体接触。 多个引线耦合在集成电路芯片上的触点和多个载体触点之间。 树脂将集成电路芯片封装起来，使得多个载体接触件至少部分地不被覆盖以附接到卡或板上。

公开(公告)号：US08078106B2

公开(公告)日：2011-12-13

申请号：US12543553

申请日：2009-08-19

Applicant: Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

Inventor： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

IPC: H04B7/00 ,  H04B1/16

CPC classification number: H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Abstract translation: 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

公开(公告)号：US08039967B2

公开(公告)日：2011-10-18

申请号：US12686590

申请日：2010-01-13

Applicant: Yuichi Taguchi ,  Akinori Shiraishi ,  Mitsutoshi Higashi

Inventor： Yuichi Taguchi ,  Akinori Shiraishi ,  Mitsutoshi Higashi

IPC: H01L23/48 ,  H01L21/44 ,  H05K7/00

CPC classification number: B81B7/0074 ,  H01L24/16 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10454 ,  H05K2201/10727 ,  H05K2201/10946 ,  H01L2924/00 ,  H01L2224/48

Abstract: A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.

Abstract translation: 布线基板包括硅基板，形成为在厚度方向上穿透硅基板的通孔，形成在硅基板的两个表面和侧表面上的绝缘层和通孔的内表面，形成在 所述通孔，形成在所述硅衬底的至少一个表面上并连接到所述穿透电极的布线层和连接到所述布线层并形成为从所述硅衬底的一个表面延伸到其侧表面的金属线端子 。 电子装置的侧面上的金属线端子与安装基板连接，使得其中电子部件安装在布线基板上的电子装置的基板方向与安装基板的基板方向正交地交叉。

公开(公告)号：US07990470B2

公开(公告)日：2011-08-02

申请号：US12013916

申请日：2008-01-14

Applicant: Wen-Hwa Lin ,  Chen-Kuang Yeh ,  Xiang Huang ,  Wan-Cheng Xie ,  Shao-Guang Mo

Inventor： Wen-Hwa Lin ,  Chen-Kuang Yeh ,  Xiang Huang ,  Wan-Cheng Xie ,  Shao-Guang Mo

IPC: H04N5/225 ,  G03B17/00

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/303 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: An image sensor module includes a circuit board (20), an image sensor (10) and a supporting board (30). The circuit board has a plurality of circuits formed thereon. The image sensor is arranged on one side of the circuit board and is electrically connected to the circuit board. The circuit board defines at least one through opening (22) therein. The supporting board is arranged on an opposite side of the circuit board. A protrusion (31) extends outwardly from the supporting board through the at least one through opening of the circuit board. The image sensor is mounted on the protrusion.

Abstract translation: 图像传感器模块包括电路板（20），图像传感器（10）和支撑板（30）。 电路板上形成有多个电路。 图像传感器布置在电路板的一侧并电连接到电路板。 电路板在其中限定至少一个通孔（22）。 支撑板布置在电路板的相对侧。 突起（31）从支撑板向外延伸穿过电路板的至少一个通孔。 图像传感器安装在突起上。

公开(公告)号：US07984545B2

公开(公告)日：2011-07-26

申请号：US12220746

申请日：2008-07-25

Applicant: Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tamaki Ushimoto

Inventor： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tamaki Ushimoto

IPC: G11B5/127 ,  H04R31/00

CPC classification number: B23K20/007 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/086 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/49021 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49169 ,  Y10T29/5313

Abstract: Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.

Abstract translation: 有助于减少回流焊接头部滑块和悬架的连接端子所需的非活性气体量的方法。 非活性气体从回流装置的喷嘴吹向磁头滑块和悬架的互连接头。 磁头滑块被粘合到万向节舌头上。 喷嘴包括惰性气体通过的管道和装配在管的喷射出口中的多孔构件。 将多孔构件放置在头部滑块附近实现有效地减少焊球周围的氧浓度。

公开(公告)号：US20110169121A1

公开(公告)日：2011-07-14

申请号：US12952173

申请日：2010-11-22

Applicant: Peter Steven Bui ,  Narayan Dass Taneja

Inventor： Peter Steven Bui ,  Narayan Dass Taneja

IPC: H01L31/0216

CPC classification number: H01L27/14643 ,  B23K1/0016 ,  B23K2101/42 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14692 ,  H05K3/26 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10689 ,  H05K2201/10727

Abstract: The present invention is directed toward a detector structure, detector arrays, and a method of detecting incident radiation. The present invention comprises several embodiments that provide for reduced radiation damage susceptibility, decreased affects of crosstalk, reduced dark current (current leakage) and increased flexibility in application. In one embodiment, a photodiode array comprises a substrate having at least a front side and a back side, a plurality of diode elements integrally formed in the substrate forming the array, wherein each diode element has a p+ fishbone pattern on the front side, and wherein the p+ fishbone pattern substantially reduces capacitance and crosstalk between adjacent photodiodes, a plurality of front surface cathode and anode contacts, and wire interconnects between diode elements made through a plurality of back surface contacts.

Abstract translation: 本发明涉及检测器结构，检测器阵列和检测入射辐射的方法。 本发明包括几个实施例，其提供减少的辐射损伤敏感性，降低的串扰影响，降低的暗电流（电流泄漏）和增加的应用灵活性。 在一个实施例中，光电二极管阵列包括至少具有前侧和背面的基板，在形成阵列的基板中一体形成的多个二极管元件，其中每个二极管元件在前侧具有p +鱼骨图案，以及 其中所述p +鱼骨图案基本上减小了相邻光电二极管之间的电容和串扰，多个前表面阴极和阳极触点以及通过多个后表面触点制成的二极管元件之间的导线互连。

公开(公告)号：US07886422B1

公开(公告)日：2011-02-15

申请号：US12186026

申请日：2008-08-05

Applicant: Haiming Zhou ,  Haijun Gao ,  Fei He

Inventor： Haiming Zhou ,  Haijun Gao ,  Fei He

IPC: G11B5/127 ,  H04R31/00

CPC classification number: B23K20/10 ,  B23K1/018 ,  B23K2101/38 ,  H01L2224/81801 ,  H01L2924/01327 ,  H05K1/056 ,  H05K3/225 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0285 ,  H05K2203/081 ,  H05K2203/1581 ,  H05K2203/176 ,  Y10T29/49023 ,  Y10T29/49025 ,  Y10T29/49734 ,  Y10T29/4975 ,  Y10T29/49815 ,  Y10T29/53161 ,  H01L2924/00

Abstract: A method is provided for reclaiming a suspension from a disk drive head gimbal assembly (HGA). An ultrasonic probe is applied to the HGA's read/write head slider on a side opposite that of its solder balls. Ultrasonic oscillations are transmitted through the ceramic slider to the side with the solder balls. The oscillations break the brittle intermetallic compound of the slider balls and free the slider. The ultrasonic energy also weakens the epoxy adhesive between the slider and suspension. The method can be used with heat to further weaken the solder balls and adhesive.

Abstract translation: 提供一种用于从盘驱动头万向架组件（HGA）中回收悬架的方法。 在HGA的读/写头滑块上，与其焊球相反的一侧应用超声波探头。 超声波振荡通过陶瓷滑块传输到与焊球一侧。 振荡破坏滑块球的脆性金属间化合物并释放滑块。 超声能量也削弱了滑块和悬架之间的环氧粘合剂。 该方法可以与热一起使用，以进一步削弱焊球和粘合剂。