公开(公告)号：US2752580A

公开(公告)日：1956-06-26

申请号：US35117853

申请日：1953-04-27

Applicant: SHEWMAKER CHARLES A

Inventor： SHEWMAKER CHARLES A

IPC: H01R12/71 ,  H02B1/00 ,  H05K3/30 ,  H05K3/36

CPC classification number: H01R12/718 ,  H05K3/308 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10856 ,  Y10T29/49945

公开(公告)号：US20150235733A1

公开(公告)日：2015-08-20

申请号：US14180475

申请日：2014-02-14

Applicant: LEAR CORPORATION

Inventor： George E. Fox ,  Bert W. Eakins

IPC: H01B5/02 ,  H05K1/18

CPC classification number: H05K1/18 ,  H01R12/585 ,  H01R12/718 ,  H01R13/055 ,  H05K3/308 ,  H05K2201/10303 ,  H05K2201/10856 ,  H05K2201/10871

Abstract: The present disclosure includes an electrical terminal that may include a first portion, a second portion, and/or a middle portion. A middle portion may be disposed between first and second portions and/or a middle portion may include a first middle section, a second middle section, a recessed portion disposed between the first middle section and the second middle section, and/or an aperture. The electrical terminal may include a transition portion that may be disposed between a middle portion and a second portion.

Abstract translation: 本公开包括可以包括第一部分，第二部分和/或中间部分的电端子。 中间部分可以设置在第一和第二部分之间，和/或中间部分可以包括第一中间部分，第二中间部分，设置在第一中间部分和第二中间部分之间的凹部，和/或孔。 电端子可以包括可以设置在中间部分和第二部分之间的过渡部分。

公开(公告)号：US08900008B2

公开(公告)日：2014-12-02

申请号：US13481176

申请日：2012-05-25

Applicant: James A. Day, Jr. ,  Zachary B. Durham ,  Luke D. Remis ,  Tony C. Sass ,  Gregory D. Sellman

Inventor： James A. Day, Jr. ,  Zachary B. Durham ,  Luke D. Remis ,  Tony C. Sass ,  Gregory D. Sellman

IPC: H01R13/60

CPC classification number: H05K13/04 ,  H01R12/585 ,  H05K1/115 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10878

Abstract: A universal press-fit connection allows a component having a connector pin to be connected to a compatible plated through hole of a circuit board regardless of circuit board thickness. The connector pin includes a proximate end adjacent the component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through hole includes a first portion partially extending through the circuit board and a second, wider portion extending beyond the first portion. The fork lock initially moves radially inward upon insertion into the first portion via flexing of the compliant portion, and re-expands when entering the second portion. The compliant portion engages the through hole and the fork lock secures the connector pin in the through hole.

Abstract translation: 通用压配合连接允许具有连接器引脚的部件连接到电路板的兼容的电镀通孔，而与电路板厚度无关。 连接器销包括邻近部件的近端，具有叉锁的远端以及近端和远端之间的柔顺部分。 多宽度通孔包括部分延伸穿过电路板的第一部分和延伸超过第一部分的第二较宽部分。 当通过柔性部分的弯曲插入到第一部分中时，叉锁首先向内径向移动，并且当进入第二部分时，叉锁重新膨胀。 柔性部分接合通孔，叉锁将连接器销固定在通孔中。

公开(公告)号：US08701971B2

公开(公告)日：2014-04-22

申请号：US13313293

申请日：2011-12-07

Applicant: Masahiro Tagano ,  Teruyuki Kitahara

Inventor： Masahiro Tagano ,  Teruyuki Kitahara

IPC: B23K1/20 ,  H01R9/22 ,  H05K1/11

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H01R12/707 ,  H05K1/0263 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/1446 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.

Abstract translation: 印刷电路板包括具有第一侧，与第一侧相对的第二侧和通孔的印刷电路板主体; 布置在所述印刷电路板主体的第一侧上的印刷导体; 以及布置在印刷电路板主体的第二侧上的母线，母线包括延伸穿过通孔的端子。 端子在与通孔内部相对应的位置处包括多个分支端子部分，并且至少一个分支端子部分弯曲并附着到印刷导体。

公开(公告)号：US20130312257A1

公开(公告)日：2013-11-28

申请号：US13711681

申请日：2012-12-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Day, JR. ,  Zachary B. Durham ,  Luke D. Remis ,  Tony C. Sass ,  Gregory D. Sellman

IPC: H05K13/04

CPC classification number: H05K13/04 ,  H01R12/585 ,  H05K1/115 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10878

Abstract: An electronic component is connected to a circuit board by forming a connector pin on the electronic component, the connector pin having a proximate end secured to the electronic component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through-hole is formed on a circuit board having a circuit board thickness greater than a length of the connector pin, with a first portion that is narrower than each of the compliant portion and the fork lock and extends partially through the circuit board and a second portion that extends beyond the first portion and is wider than the first portion. The connector pin is inserted into the first portion of the through-hole and the fork lock is moved beyond the first portion into the second portion of the through-hole.

Abstract translation: 电子部件通过在电子部件上形成连接器销而连接到电路板，连接器销具有固定到电子部件的近端，具有叉锁的远端以及近端和远端之间的柔顺部分 。 在具有大于连接器针的长度的电路板厚度的电路板上形成多个宽度的通孔，第一部分比柔性部分和叉锁的每一个窄，并且部分延伸穿过电路 板和延伸超过第一部分并且比第一部分更宽的第二部分。 连接器销插入到通孔的第一部分中，叉锁移动超过第一部分进入通孔的第二部分。

公开(公告)号：US08315035B2

公开(公告)日：2012-11-20

申请号：US12629646

申请日：2009-12-02

Applicant: Masaaki Togashi ,  Sunao Masuda ,  Hiroshi Abe

Inventor： Masaaki Togashi ,  Sunao Masuda ,  Hiroshi Abe

IPC: H01G4/228 ,  H01G2/20 ,  H01G4/06

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10636 ,  H05K2201/10856 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41

Abstract: A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided. Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets is easy to see from the outside, and a connection yield can also be secured.

Abstract translation: 提供一种能够防止发生振动噪声并提高封装密度和封装产率的层叠电容器，以及制造多层电容器的方法。 即使当在施加电压时在该多层电容器中产生电致伸缩振动，金属端子的接合表面也可以弯曲，以减轻电致伸缩振动，从而防止发生振动噪声。 接头表面形成有切口，从而可以完全确保其柔性。 在该层叠电容器中，由电极连接面，基板连接面和接合面形成的台阶位于与电介质层的层叠方向相反的与电容器元件本体重叠的区域内。 因此，焊料圆角不会从电容器元件主体突出，从而可以提高安装基板K上的封装密度。 焊接圆角的状态从外部容易看出，也可以确保连接良率。

公开(公告)号：US20120156898A1

公开(公告)日：2012-06-21

申请号：US13319744

申请日：2010-05-07

Applicant: Werner Kallee

Inventor： Werner Kallee

IPC: H01R12/52

CPC classification number: H05K3/368 ,  H01R12/523 ,  H01R12/585 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10856

Abstract: In order to mechanically and electrically connect two printed circuit boards (26, 27) in a parallel arrangement, a plurality of connecting elements (1) is arranged in an insulating member (22) having parallel faces, said connecting elements projecting from both opposite faces of the insulating member. The projecting part of the connecting elements is designed as a contact element (6), thus allowing said contact elements to be plugged into plated-through bores (28) of the printed circuit boards. The contact elements are secured within the plated-through bores by means of a clamping force acting transverse to the plugging direction. The clamping force causes the contact elements to be pressed against the walls of the plated-through bores and thus both mechanically secures the contact elements and establishes an electric connection. According to the invention, the clamping force of the connecting elements is greater for one printed circuit board than the clamping force of the connecting elements for the other printed circuit board so as to ensure that the insulating member remains plugged in one of the printed circuit boards along with the connecting elements contained in the insulating member when the connection is released.

Abstract translation: 为了以平行布置机械地和电气地连接两个印刷电路板（26,27），多个连接元件（1）被布置在具有平行面的绝缘构件（22）中，所述连接元件从两个相对面 的绝缘构件。 连接元件的突出部分被设计为接触元件（6），从而允许所述接触元件插入印刷电路板的穿通孔（28）中。 接触元件通过横向于插入方向的夹紧力固定在镀通孔内。 夹紧力使得接触元件被压靠在穿通孔的壁上，因此两者都机械地固定接触元件并建立电连接。 根据本发明，一个印刷电路板的连接元件的夹持力比用于另一个印刷电路板的连接元件的夹持力大，以便确保绝缘构件保持插入其中一个印刷电路板 以及当连接被释放时包含在绝缘构件中的连接元件。

公开(公告)号：US08094461B2

公开(公告)日：2012-01-10

申请号：US11892600

申请日：2007-08-24

Applicant: Masahiro Tagano ,  Teruyuki Kitahara

Inventor： Masahiro Tagano ,  Teruyuki Kitahara

IPC: H01R9/00

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H01R12/707 ,  H05K1/0263 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/1446 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.

Abstract translation: 印刷电路板包括具有第一侧，与第一侧相对的第二侧和通孔的印刷电路板主体; 布置在所述印刷电路板主体的第一侧上的印刷导体; 以及布置在印刷电路板主体的第二侧上的母线，母线包括延伸穿过通孔的端子。 端子在与通孔内部相对应的位置处包括多个分支端子部分，并且至少一个分支端子部分弯曲并附着到印刷导体。

公开(公告)号：US20100188798A1

公开(公告)日：2010-07-29

申请号：US12629646

申请日：2009-12-02

Applicant: Masaaki TOGASHI ,  Sunao MASUDA ,  Hiroshi ABE

Inventor： Masaaki TOGASHI ,  Sunao MASUDA ,  Hiroshi ABE

IPC: H01G4/228 ,  H01L21/00

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10636 ,  H05K2201/10856 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41

Abstract: A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided.Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets is easy to see from the outside, and a connection yield can also be secured.

Abstract translation: 提供一种能够防止发生振动噪声并提高封装密度和封装产率的层叠电容器，以及制造多层电容器的方法。 即使当在施加电压时在该多层电容器中产生电致伸缩振动，金属端子的接合表面也可以弯曲，以减轻电致伸缩振动，从而防止发生振动噪声。 接头表面形成有切口，从而可以完全确保其柔性。 在该层叠电容器中，由电极连接面，基板连接面和接合面形成的台阶位于与电介质层的层叠方向相反的与电容器元件本体重叠的区域内。 因此，焊料圆角不会从电容器元件主体突出，从而可以提高安装基板K上的封装密度。 焊接圆角的状态从外部容易看出，也可以确保连接良率。

公开(公告)号：US07621759B2

公开(公告)日：2009-11-24

申请号：US12320545

申请日：2009-01-29

Applicant: Dai Ito ,  Takayoshi Honda

Inventor： Dai Ito ,  Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10856 ,  Y10T29/49144

Abstract: An electronic apparatus is disclosed that includes a board and an electronic component having a body. The board has multiple through-holes and multiple lands covering multiple through-holes. The electronic component has multiple terminals. The terminals are respectively coupled with the lands while a part of each terminal being inserted into a through-hole. A shape of the through-hole is generally circular and different from a part of the land on a back surface of the board. The part of the land on the back surface has a width and the width is different in directions.

Abstract translation: 公开了一种包括板和具有主体的电子部件的电子设备。 该板具有多个通孔和多个覆盖多个通孔的焊盘。 电子元件具有多个端子。 端子分别与平台接合，而每个端子的一部分插入到通孔中。 通孔的形状通常是圆形的，并且不同于板的背面上的一部分焊盘。 后表面上的部分区域具有宽度，宽度方向不同。