公开(公告)号：US11955577B2

公开(公告)日：2024-04-09

申请号：US17011707

申请日：2020-09-03

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Nathan Phillips Beckett ,  Gilad Almogy

IPC: H01L31/18 ,  B41F15/08 ,  H01L21/67 ,  H01L21/677 ,  H01L31/042 ,  H01L31/05

CPC classification number: H01L31/1876 ,  B41F15/0881 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/67207 ,  H01L21/67282 ,  H01L21/6776 ,  H01L31/042 ,  H01L31/0504 ,  H01L31/18 ,  H01L31/188 ,  Y02E10/50 ,  Y02P70/50

Abstract: Multi-operation tools for photovoltaic cell processing are described. In an example, a multi-operation tool includes a conveyor system to move a photovoltaic (PV) cell continuously along a conveyor path through a laser scribing station and an adhesive printing station. Furthermore, the PV cell may be aligned to a laser head of the laser scribing station and a printer head of the adhesive printing station in a single alignment operation prior to being laser scribed and printed with an adhesive in a continuous process.

公开(公告)号：US11949037B2

公开(公告)日：2024-04-02

申请号：US17744519

申请日：2022-05-13

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Pei Hsuan Lu ,  Benjamin I. Hsia ,  Taeseok Kim

IPC: H01L31/18 ,  B23K26/382 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/0236

CPC classification number: H01L31/18 ,  B23K26/382 ,  H01L31/022441 ,  H01L31/02168 ,  H01L31/02363 ,  H01L31/1804

Abstract: Local patterning and metallization of semiconductor structures using a laser beam, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a method of fabricating a solar cell includes providing a substrate having an intervening layer thereon. The method also includes locating a metal foil over the intervening layer. The method also includes exposing the metal foil to a laser beam, wherein exposing the metal foil to the laser beam forms openings in the intervening layer and forms a plurality of conductive contact structures electrically connected to portions of the substrate exposed by the openings.

公开(公告)号：US11942565B2

公开(公告)日：2024-03-26

申请号：US17021930

申请日：2020-09-15

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Staffan Westerberg ,  Timothy Weidman ,  David D. Smith

IPC: H01L31/18 ,  H01L31/068

CPC classification number: H01L31/1864 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/50

Abstract: Methods of fabricating solar cell emitter regions using substrate-level ion implantation, and resulting solar cells, are described. In an example, a method of fabricating a solar cell involves forming a lightly doped region in a semiconductor substrate by ion implantation, the lightly doped region of a first conductivity type of a first concentration. The method also involves forming a first plurality of dopant regions of the first conductivity type of a second, higher, concentration by ion implantation, the first plurality of dopant regions overlapping with a first portion of the lightly doped region. The method also involves forming a second plurality of dopant regions by ion implantation, the second plurality of dopant regions having a second conductivity type of a concentration higher than the first concentration, and the second plurality of dopant regions overlapping with a second portion of the lightly doped region and alternating with but not overlapping the first plurality of dopant regions.

公开(公告)号：US20240088317A1

公开(公告)日：2024-03-14

申请号：US18513256

申请日：2023-11-17

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  DAVID FREDRIC JOEL KAVULAK ,  LEWIS ABRA ,  THOMAS P. PASS ,  TAESEOK KIM ,  MATTHIEU MOORS ,  BENJAMIN IAN HSIA ,  GABRIEL HARLEY

IPC: H01L31/05 ,  H01L31/0224 ,  H01L31/068

CPC classification number: H01L31/0516 ,  H01L31/022441 ,  H01L31/022458 ,  H01L31/05 ,  H01L31/0504 ,  H01L31/0508 ,  H01L31/0682 ,  Y02E10/50 ,  Y02E10/546 ,  Y02E10/547

Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.

公开(公告)号：US20240048093A1

公开(公告)日：2024-02-08

申请号：US18381549

申请日：2023-10-18

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Lee J. Gorny

IPC: H02S30/10 ,  H02S20/23 ,  H02S40/34 ,  H01L31/048

CPC classification number: H02S30/10 ,  H02S20/23 ,  H02S40/34 ,  H01L31/048

Abstract: One embodiment is a photovoltaic (PV) module including a frame to receive a perimeter of a backside of a photovoltaic (PV) laminate. The cross rail assembly may include: a conductive frame to receive a perimeter of a backside of a photovoltaic (PV) laminate; one or more conductive cross rail members provide structural rigidity to the conductive frame; and one or more pairs of couplers coupled to the conductive frame, wherein: at least one coupler comprises a grounding coupler having a first keyed section to insert into an opening in the conductive frame and a second keyed section to mate with an end of a conductive cross rail member of the one or more conductive cross rail members to ground the conductive cross rail member to the frame; or at least one coupler of at least one of the one or more pairs includes a length to define a cabling channel.

公开(公告)号：US20240047595A1

公开(公告)日：2024-02-08

申请号：US18380578

申请日：2023-10-16

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Richard Hamilton Sewell ,  David Aaron Randolph Barkhouse ,  Douglas Rose ,  Lewis Abra

IPC: H01L31/05

CPC classification number: H01L31/0508 ,  H01L31/0516

Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

公开(公告)号：US20240030864A1

公开(公告)日：2024-01-25

申请号：US18375272

申请日：2023-09-29

Applicant: Maxeon Solar Pte. Ltd.

Inventor： GOPAL KRISHAN GARG ,  SEUNG BUM RIM ,  PETER JOHN COUSINS

IPC: H02S40/32 ,  H02S40/34 ,  H01L31/05 ,  H01L31/0475 ,  H01L31/068

CPC classification number: H02S40/32 ,  H02S40/34 ,  H01L31/0504 ,  H01L31/0475 ,  H01L31/068 ,  Y02E10/547

Abstract: A photovoltaic module can include a high voltage photovoltaic laminate that include a plurality of high voltage photovoltaic cells with each of the high voltage photovoltaic cells including a plurality of sub-cells. A boost-less conversion device can be configured to convert a first voltage from the high voltage photovoltaic laminate to a second voltage.

公开(公告)号：US11869992B2

公开(公告)日：2024-01-09

申请号：US17971369

申请日：2022-10-21

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Seung Bum Rim ,  Gabriel Harley

IPC: H01L31/0443 ,  H01L31/02 ,  H01L31/0368 ,  H01L31/18 ,  H01L27/142

CPC classification number: H01L31/0443 ,  H01L27/1421 ,  H01L31/02008 ,  H01L31/03682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/50

Abstract: A solar cell can include a built-in bypass diode. In one embodiment, the solar cell can include an active region disposed in or above a first portion of a substrate and a bypass diode disposed in or above a second portion of the substrate. The first and second portions of the substrate can be physically separated with a groove. A metallization structure can couple the active region to the bypass diode.

公开(公告)号：US11855582B2

公开(公告)日：2023-12-26

申请号：US17574064

申请日：2022-01-12

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Lee Gorny ,  Gabriela Elena Bunea

IPC: H02S30/10 ,  H02S40/34 ,  H02S30/00

CPC classification number: H02S30/10 ,  H02S30/00 ,  H02S40/34

Abstract: Photovoltaic module systems are provided. These systems can comprise multiple photovoltaic laminates connected with one or more mechanical coupling pairs that extend beyond perimeter edges of individual photovoltaic laminates. The mechanical coupling pairs can be connected to ends of support members positioned beneath the photovoltaic laminates. During assembly, an additional photovoltaic laminate may be added to connected photovoltaic laminates that are previously connected and lie along a shared plane of reference via pairs of mechanical couplings.

公开(公告)号：US20230402968A1

公开(公告)日：2023-12-14

申请号：US17981698

申请日：2022-11-07

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Ruihua LI ,  Yafu LIN ,  Nicholas Eli BERRY

IPC: H02S40/36 ,  H02S30/00 ,  H01L31/0203 ,  H01L31/05

CPC classification number: H02S40/36 ,  H02S30/00 ,  H01L31/0512 ,  H01L31/0508 ,  H01L31/0203

Abstract: A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and conductively bonded to each other in their overlapping regions to form super cells, which may be arranged to efficiently use the area of the solar module. Solar cells are conductive bonded to each other with electrically conductive adhesive containing soft spacers.