Apparatus and method for measuring each thickness of a multilayer stacked on a substrate
    31.
    发明授权
    Apparatus and method for measuring each thickness of a multilayer stacked on a substrate 失效
    用于测量层叠在基板上的多层厚度的装置和方法

    公开(公告)号:US06912056B2

    公开(公告)日:2005-06-28

    申请号:US10914149

    申请日:2004-08-10

    CPC classification number: G01B11/0641

    Abstract: In an apparatus and a method of measuring a thickness of a multilayer on a substrate, a spectrum of reflected light reflected from the substrate is measured. A plurality of recipe data, each corresponding to one of a plurality of hypothetical multilayers, is stored. One of the plurality of hypothetical multilayers is initially assumed to be the multilayer actually formed on the substrate. A plurality of theoretical spectra is calculated using one of the plurality of recipe data in accordance with various theoretical thicknesses of one of the plurality of hypothetical multilayers. The measured spectrum is compared with the plurality of theoretical spectra to determine a temporary thickness of the multilayer. A reliability of the temporary thickness of the multilayer is estimated. The temporary thickness is output as a thickness of the multilayer on the substrate when the reliability of the temporary thickness is within an allowable range.

    Abstract translation: 在测量基板上的多层厚度的装置和方法中,测量从基板反射的反射光的光谱。 存储多个与多个假想多层中的一个对应的食谱数据。 多个假想多层中的一个最初被假设为实际形成在基底上的多层。 根据多个假想多层之一的各种理论厚度,使用多个配方数据中的一个来计算多个理论光谱。 将测量的光谱与多个理论光谱进行比较,以确定多层的临时厚度。 估计多层的临时厚度的可靠性。 当临时厚度的可靠性在允许范围内时,临时厚度作为衬底上的多层的厚度输出。

    Apparatus and method for measuring each thickness of a multilayer stacked on a substrate

    公开(公告)号:US20050041255A1

    公开(公告)日:2005-02-24

    申请号:US10914149

    申请日:2004-08-10

    CPC classification number: G01B11/0641

    Abstract: In an apparatus and a method of measuring a thickness of a multilayer on a substrate, a spectrum of reflected light reflected from the substrate is measured. A plurality of recipe data, each corresponding to one of a plurality of hypothetical multilayers, is stored. One of the plurality of hypothetical multilayers is initially assumed to be the multilayer actually formed on the substrate. A plurality of theoretical spectra is calculated using one of the plurality of recipe data in accordance with various theoretical thicknesses of one of the plurality of hypothetical multilayers. The measured spectrum is compared with the plurality of theoretical spectra to determine a temporary thickness of the multilayer. A reliability of the temporary thickness of the multilayer is estimated. The temporary thickness is output as a thickness of the multilayer on the substrate when the reliability of the temporary thickness is within an allowable range.

    Method and apparatus for classifying defects of an object
    34.
    发明申请
    Method and apparatus for classifying defects of an object 有权
    用于分类物体缺陷的方法和装置

    公开(公告)号:US20050018182A1

    公开(公告)日:2005-01-27

    申请号:US10786137

    申请日:2004-02-26

    CPC classification number: G01N21/956 G01N21/9501

    Abstract: A method for classifying defects of an object includes irradiating lights having different wavelengths onto the object to create an inspection spot on the object, collecting scattered lights generated by the irradiated lights scattering from the inspection spot, and classifying defects of the object by type of defect by analyzing the scattered lights. An apparatus for classifying defects of an object includes light creating means emitting lights having different wavelengths to create an inspection spot on the object, and a detecting member for collecting scattered lights that are created from the lights scattering from the inspection spot, wherein the scattered lights are analyzed and classified in accordance with defects positioned on the inspection spot of the object.

    Abstract translation: 用于对物体的缺陷进行分类的方法包括将不同波长的光照射到物体上以在物体上产生检查点,收集由检查点散射的照射光产生的散射光,并根据缺陷类型对物体的缺陷进行分类 通过分析散射光。 用于对物体的缺陷进行分类的装置包括:发光装置,其发射具有不同波长的光,以在物体上产生检查点;以及检测部件,用于收集从检查点散射的光产生的散射光,其中散射光 根据位于物体检查点的缺陷进行分析和分类。

    Overlay measuring method and system, and method of manufacturing semiconductor device using the same
    37.
    发明授权
    Overlay measuring method and system, and method of manufacturing semiconductor device using the same 有权
    覆盖测量方法和系统,以及使用其制造半导体器件的方法

    公开(公告)号:US09455206B2

    公开(公告)日:2016-09-27

    申请号:US14796478

    申请日:2015-07-10

    Abstract: An overlay measuring method includes irradiating an electron beam onto a sample, including a multi-layered structure of overlapped upper and lower patterns formed thereon, to obtain an actual image of the upper and lower patterns. A first image representing the upper pattern and a second image representing the lower pattern are obtained from the actual image. A reference position for the upper and lower patterns is determined from a design image of the upper and lower patterns. A position deviation of the upper pattern with respect to the reference position in the first image and a position deviation of the lower pattern with respect to the reference position in the second image are calculated to determine an overlay between the upper pattern and the lower pattern.

    Abstract translation: 覆盖测量方法包括将电子束照射到样品上,包括形成在其上的重叠的上下图案的多层结构,以获得上下图案的实际图像。 从实际图像中获得代表上部图案的第一图像和表示较低图案的第二图像。 根据上下图案的设计图像确定上下图案的参考位置。 计算上部图形相对于第一图像中的基准位置的位置偏差和下部图形相对于第二图像中的基准位置的位置偏差,以确定上部图案和下部图案之间的叠加。

    Defect inspection apparatus and defect inspection method using the same
    38.
    发明授权
    Defect inspection apparatus and defect inspection method using the same 有权
    缺陷检查装置和缺陷检查方法使用

    公开(公告)号:US08902412B2

    公开(公告)日:2014-12-02

    申请号:US13472145

    申请日:2012-05-15

    CPC classification number: G01N21/55 G01N21/9501

    Abstract: A defect inspection apparatus comprises a table on which a substrate is placed, a first detection unit which is disposed above the table to detect an optical signal from the substrate, a second detection unit which is disposed above the table to detect an electrical signal from the substrate, and a signal processing unit which is connected to the first detection unit and the second detection unit to detect a chemical defect using the optical signal and the electrical signal.

    Abstract translation: 缺陷检查装置包括:放置基板的工作台,设置在工作台上方以检测来自衬底的光信号的第一检测单元,设置在工作台上方的第二检测单元,用于检测来自基板的电信号; 基板和连接到第一检测单元和第二检测单元的信号处理单元,以使用光信号和电信号来检测化学缺陷。

    TD PROBE AND ITS USES
    39.
    发明申请
    TD PROBE AND ITS USES 审中-公开
    TD探索及其用途

    公开(公告)号:US20120220468A1

    公开(公告)日:2012-08-30

    申请号:US13392400

    申请日:2010-09-02

    Abstract: The present invention relates to a target discriminative probe (TD probe) and its uses or applications. The TD probe is hybridized with a target nucleic acid sequence through both of the 5′-second hybridization portion and the 3′-first hybridization portion. When the TD probe is hybridized with a non-target nucleic acid sequence, both the 5′-second hybridization portion and the separation portion are not hybridized with the non-target nucleic acid sequence such that both portions form a single strand due to its low Tm value. As such, the TD probe exhibits distinctly different hybridization patterns for each of the target and the non-target nucleic acid sequence, discriminating the target nucleic acid sequence from the non-target nucleic acid sequence with much higher specificity.

    Abstract translation: 本发明涉及目标鉴别探针(TD探针)及其用途或应用。 TD探针通过5'-第二杂交部分和3'-第一杂交部分与靶核酸序列杂交。 当TD探针与非靶核酸序列杂交时,5'-第二杂交部分和分离部分都不与非靶核酸序列杂交,使得两部分由于其低部分形成单链 Tm值。 因此,TD探针对靶和非靶核酸序列中的每一个显示明显不同的杂交模式,以非常高的特异性区分靶核酸序列与非靶核酸序列。

    Light source unit, manufacturing method thereof, and display device having the same
    40.
    发明授权
    Light source unit, manufacturing method thereof, and display device having the same 有权
    光源单元及其制造方法以及具有该光源单元的显示装置

    公开(公告)号:US08152354B2

    公开(公告)日:2012-04-10

    申请号:US12262373

    申请日:2008-10-31

    Abstract: A light source unit includes; a first base layer, a plurality of conductive pads disposed on the first base layer, a second base layer disposed on the first base layer and including a plurality of openings therein exposing the plurality of conductive pads, a wiring portion disposed on the second base layer, and a plurality of light source elements disposed on the plurality of conductive pads exposed by the plurality of openings in the second base layer.

    Abstract translation: 光源单元包括: 第一基底层,设置在第一基底层上的多个导电焊盘,设置在第一基底层上并包括多个开口的第二基底层,其暴露多个导电焊盘;布置部分,设置在第二基底层上 以及设置在由第二基层中的多个开口暴露的多个导电焊盘上的多个光源元件。

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