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公开(公告)号：US20210146554A1
公开(公告)日：2021-05-20
申请号：US16807106
申请日：2020-03-02
Applicant: Applied Materials, Inc.
Inventor： Jeffrey C. Hudgens , Nir Merry
Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an arm component and a blade component. The blade component may comprise two or more end effectors that can retrieve and place two or more substrates at a time. The apparatus can include multiple arm components and multiple blade components. Each blade component can comprise two or more end effectors to carry two or more substrates at one time. The blade components can move independent of one another or may be dependently connected.
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公开(公告)号：US10943805B2
公开(公告)日：2021-03-09
申请号：US15983834
申请日：2018-05-18
Applicant: Applied Materials, Inc.
Inventor： Jeffrey C. Hudgens , Michael R. Rice , Karuppasamy Muthukamatchi , Nir Merry
IPC: H01L21/677 , H01L21/687 , H01L21/67
Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an upper arm and three blades B1, B2, B3 that are independently rotatable. The three blades are configured to service a first dual load lock and second dual load lock wherein each dual load lock includes a different pitch. In some embodiments, a first pitch P1 is smaller than a second pitch P2. Blades B2 and B3 (or optionally blades B1 and B2) can service the first dual load lock with Pitch P1 and blades B1 and B3 can service the second dual load lock including the second pitch P2. Methods of operating the electronic device manufacturing apparatus and the robot apparatus are provided, as are numerous other aspects.
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公开(公告)号：US10112259B2
公开(公告)日：2018-10-30
申请号：US14684290
申请日：2015-04-10
Applicant: APPLIED MATERIALS, INC.
Inventor： James M. Holden , Nir Merry , Todd Egan
IPC: B23K26/06 , B23K26/00 , B23K26/36 , H01L21/67 , H01J37/32 , H01L21/3065 , H01L21/78 , B23K26/364 , B23K26/0622 , B23K26/40 , B23K103/16 , B23K103/00
Abstract: Methods and apparatuses for dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating by a laser beam with a centrally peaked spatial power profile to form an ablated trench in the substrate below thin film device layers which is positively sloped. In an embodiment, a femtosecond laser forms a positively sloped ablation profile which facilitates vertically-oriented propagation of microcracks in the substrate at the ablated trench bottom. With minimal lateral runout of microcracks, a subsequent anisotropic plasma etch removes the microcracks for a cleanly singulated chip with good reliability.
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公开(公告)号：US09296105B2
公开(公告)日：2016-03-29
申请号：US14085462
申请日：2013-11-20
Applicant: Applied Materials, Inc.
Inventor： Nir Merry , Alex Minkovich , Jeffrey C. Hudgens , Brendan Till
CPC classification number: B25J9/1653
Abstract: Embodiments disclose a vibration-controlled robot apparatus. The apparatus includes a robot having an end effector operable to transport a substrate, a sensor coupled to the robot, the sensor operable to sense vibration as the robot transports the substrate, and operating the robot to reduce vibration of the end effector supporting the substrate. In some embodiments, a filter is provided in the motor drive circuit to filter one or more frequencies causing unwanted vibration of the end effector. Vibration control systems and methods of operating the same are provided, as are other aspects.
Abstract translation: 实施例公开了一种振动控制机器人装置。 该装置包括机器人，其具有可操作地输送基底的端部执行器，耦合到机器人的传感器，当机器人传送基板时可操作以感测振动的传感器，以及操作机器人以减少支撑基板的端部执行器的振动。 在一些实施例中，在马达驱动电路中提供过滤器以过滤一个或多个引起末端执行器的不希望的振动的频率。 与其他方面一样，提供了振动控制系统及其操作方法。
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公开(公告)号：US20240258137A1
公开(公告)日：2024-08-01
申请号：US18632509
申请日：2024-04-11
Applicant: Applied Materials, Inc.
Inventor： Nir Merry , Schubert S. Chu , Sushant S. Koshti , Michael C. Kuchar , Nyi Oo Myo , Songjae Lee
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67196 , H01L21/67167 , H01L21/68707 , H01L21/67207
Abstract: A substrate processing system includes a factory interface, a transfer chamber of heptagonal shape and including four first facets and three second facets, each having a width that is narrower than that of each of the four first facets. A processing chamber is attached to one of the four first facets. A first auxiliary chamber attached to a first of the three second facets and is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A second auxiliary chamber is attached to a third of the three second facets. The load lock is attached to the transfer chamber between the first and second auxiliary chambers. A robot is attached to a bottom of the transfer chamber and adapted to transfer substrates to/from the first processing chamber, the first auxiliary chamber, and the load lock.
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Patent Agency Ranking
公开(公告)号：US11996307B2
公开(公告)日：2024-05-28
申请号：US17317566
申请日：2021-05-11
Applicant: Applied Materials, Inc.
Inventor： Nir Merry , Schubert S. Chu , Sushant S. Koshti , Michael C. Kuchar , Nyi Oo Myo , Songjae Lee
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67196 , H01L21/67167 , H01L21/68707 , H01L21/67207
Abstract: A substrate processing system includes a factory interface having a controlled environment and a transfer chamber. The transfer chamber includes four first facets and three second facets, where each of the three second facets has a width that is narrower than that of each of the four first facets. A first processing chamber is attached to one of the four first facets. A first auxiliary chamber is attached to a first of the three second facets, where the first auxiliary chamber is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A robot is attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the first processing chamber, the first auxiliary chamber, and the load lock.
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37.发明申请公开(公告)号：US20220293444A1
公开(公告)日：2022-09-15
申请号：US17829607
申请日：2022-06-01
Applicant: Applied Materials, Inc.
Inventor： Paul B. Reuter , Robin C. Armstrong , John C. Menk , Nir Merry
IPC: H01L21/673
Abstract: An equipment front end module, including: an equipment front end module chamber. An upper plenum at a top of the equipment front end module and including an opening into the equipment front end module chamber. A plurality of return ducts that are coupled between a bottom of the equipment front end module chamber and the upper plenum, the plurality of return ducts providing a return gas flow path enabling recirculation of gas from the equipment front end module chamber to the upper plenum.
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公开(公告)号：US20220199436A1
公开(公告)日：2022-06-23
申请号：US17317566
申请日：2021-05-11
Applicant: Applied Materials, Inc.
Inventor： Nir Merry , Schubert S. Chu , Sushant S. Koshti , Michael C. Kuchar , Nyi Oo Myo , Songjae Lee
IPC: H01L21/67 , H01L21/687
Abstract: A substrate processing system includes a factory interface having a controlled environment and a transfer chamber. The transfer chamber includes four first facets and three second facets, where each of the three second facets has a width that is narrower than that of each of the four first facets. A first processing chamber is attached to one of the four first facets. A first auxiliary chamber is attached to a first of the three second facets, where the first auxiliary chamber is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A robot is attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the first processing chamber, the first auxiliary chamber, and the load lock.
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公开(公告)号：US20220083081A1
公开(公告)日：2022-03-17
申请号：US17475294
申请日：2021-09-14
Applicant: APPLIED MATERIALS, INC.
Inventor： Nir Merry , Paul Wirth , Ming Xu , Sushant Koshti , Raechel Chu-Hui Tan
Abstract: Disclosed herein are embodiments of a mass flow control apparatus, systems incorporating the same, and methods using the same. In one embodiment, a mass flow control apparatus comprises a flow modulating valve configured to modulate gas flow in a gas flow channel, a sensor device, such as a micro-electromechanical (MEMS) device, configured to generate a signal responsive to a condition of the gas flow, and a processing device operatively coupled to the flow modulating valve and the sensor device to control the flow modulating valve based on a signal received from the sensor device.
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公开(公告)号：US20220081282A1
公开(公告)日：2022-03-17
申请号：US17475296
申请日：2021-09-14
Applicant: APPLIED MATERIALS, INC.
IPC: B81B3/00
Abstract: Disclosed herein are embodiments of a sensor device, systems incorporating the same, and methods of fabricating the same. In one embodiment, a sensor device comprises a free-standing sensing element, such as a micro-electromechanical system (MEMS) device. The sensor device further comprises a metallic band to facilitate mounting the MEMS device to a mounting plate. The sensor device further comprises a conformal coating on a least a portion of a sensor region of the sensor device.
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