公开(公告)号：US20160007412A1

公开(公告)日：2016-01-07

申请号：US14738448

申请日：2015-06-12

Applicant: Applied Materials, Inc.

Inventor： Matthew Busche ,  Wendell Boyd, JR. ,  Todd J. Egan ,  Gregory L. Kirk ,  Vijay D. Parkhe ,  Michael R. Rice ,  Leon Volfovski

IPC: H05B3/00 ,  H05B3/26 ,  H05B3/14 ,  H01L21/67 ,  H05B3/06

Abstract: Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may optionally be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects.

Abstract translation: 基板温度控制装置和电子装置制造系统向处理室中的基板提供像素化的基于光的加热。 处理室中的衬底保持器可以包括底板。 底板具有可以具有多个空腔的顶表面和连接到空腔的多个凹槽。 光纤可以被容纳在槽中，使得每个空腔具有终止于其中的相应光纤以将光传送到其上。 一些或所有空腔可以具有设置在其中的环氧光学漫射器以漫射由光纤提供的光。 可以将衬底放置在其上的陶瓷板可以结合到基板。 可以可选地在基板和陶瓷板之间设置散热板。 还提供了在电子设备制造系统中控制衬底保持器温度的方法，以及其他方面。

公开(公告)号：US20160007411A1

公开(公告)日：2016-01-07

申请号：US14737799

申请日：2015-06-12

Applicant: Applied Materials, Inc.

Inventor： Matthew Busche ,  Wendell Boyd, JR. ,  Dmitry A. Dzilno ,  Vijay D. Parkhe ,  Michael R. Rice ,  Leon Volfovski

IPC: H05B3/00 ,  H05B3/14 ,  H05B3/06

CPC classification number: H05B3/0047 ,  H01L21/67103 ,  H01L21/67248 ,  H05B1/0233

Abstract: Substrate temperature control apparatus including groove-routed optical fibers. Substrate temperature control apparatus includes upper and lower members including grooves in one or both, and a plurality of optical fibers routed in the grooves. In one embodiment, the optical fibers are adapted to provide light-based pixelated heating. In another embodiment, embedded optical temperature sensors are adapted to provide temperature measurement. Substrate temperature control systems, electronic device processing systems, and methods including groove-routed optical fiber temperature control and measurement are described, as are numerous other aspects.

Abstract translation: 基板温度控制装置，包括槽路布置的光纤。 衬底温度控制装置包括上部和下部构件，其包括一个或两个中的凹槽，以及在凹槽中布置的多个光纤。 在一个实施例中，光纤适于提供基于光的像素化加热。 在另一个实施例中，嵌入式光学温度传感器适于提供温度测量。 还描述了基板温度控制系统，电子设备处理系统以及包括沟道布线的光纤温度控制和测量的方法。

公开(公告)号：US09111980B2

公开(公告)日：2015-08-18

申请号：US13721311

申请日：2012-12-20

Applicant: APPLIED MATERIALS, INC.

Inventor： David K. Carlson ,  Michael R. Rice ,  Kartik B. Shah ,  Kashif Maqsood ,  Pravin K. Narwankar

IPC: C23C16/00 ,  H01L21/683 ,  B05B1/00 ,  C30B25/14 ,  C30B25/08 ,  E05F1/00 ,  H01L21/67 ,  H01L21/677 ,  C30B29/06

CPC classification number: H01L21/683 ,  B05B1/005 ,  C30B25/08 ,  C30B25/14 ,  C30B29/06 ,  E05F1/00 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67115 ,  H01L21/67173 ,  H01L21/67712 ,  H01L21/6776

Abstract: Apparatus for the removal of exhaust gases are provided herein. In some embodiments, an apparatus may include a carrier for supporting one or more substrates in a substrate processing tool, the carrier having a first exhaust outlet, and an exhaust assembly including a first inlet disposed proximate the carrier to receive process exhaust from the first exhaust outlet of the carrier, a second inlet to receive a cleaning gas, and an outlet to remove the process exhaust and the cleaning gas.

Abstract translation: 本文提供了用于排出废气的设备。 在一些实施例中，设备可以包括用于在衬底处理工具中支撑一个或多个衬底的载体，所述载体具有第一排气出口和排气组件，所述排气组件包括靠近所述载体设置的第一入口，以接收来自所述第一排气 载体的出口，用于接收清洁气体的第二入口和用于去除工艺废气和清洁气体的出口。

公开(公告)号：US20140196850A1

公开(公告)日：2014-07-17

申请号：US14075603

申请日：2013-11-08

Applicant: APPLIED MATERIALS, INC.

Inventor： Klaus Schuegraf ,  Seshadri Ramaswami ,  Michael R. Rice ,  Mohsen S. Salek ,  Claes H. Bjorkman

IPC: H01L21/78 ,  H01L21/02

CPC classification number: H01L21/78 ,  H01L21/02076 ,  H01L21/30 ,  H01L21/302 ,  H01L21/308 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67017 ,  H01L21/67207 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate.

Abstract translation: 单片化多个半导体管芯的方法包括提供载体衬底并将半导体衬底接合到载体衬底。 半导体衬底包括多个器件。 该方法还包括在半导体衬底上形成掩模层，将掩模层的预定部分暴露于光，以及处理掩模层的预定部分以在半导体衬底上形成预定的掩模图案。 所述方法还包括形成所述多个半导体管芯，所述多个半导体管芯中的每一个与所述预定掩模图案相关联并且包括所述多个器件中的一个或多个并且将所述多个半导体管芯与所述载体衬底分离。

公开(公告)号：US20250125170A1

公开(公告)日：2025-04-17

申请号：US18991285

申请日：2024-12-20

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice

IPC: H01L21/67 ,  B65G47/90 ,  G06F12/00 ,  H01L21/677 ,  H01L21/687

Abstract: A mainframe of a device fabrication system comprises a base and a plurality of facets on the base, wherein a first facet of the plurality of facets comprises a first frame comprising a first column on a first side of the first facet, a second column on a second side of the first facet, and a beam connecting the first column to the second column. The mainframe further comprises a lid over the plurality of facets, wherein the base, the lid and the plurality of facets together define an interior volume. A first replaceable interface plate is sealed to the first frame of the first facet. The first column of the first facet comprises a first channel that fluidly couples a first vacuum region associated with the first replaceable interface plate to a vacuum port.

公开(公告)号：US12094752B2

公开(公告)日：2024-09-17

申请号：US17843652

申请日：2022-06-17

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice ,  Yogananda Sarode Vishwanath ,  Sunil Srinivasan ,  Rajinder Dhindsa ,  Steven E. Babayan ,  Olivier Luere ,  Denis M. Koosau ,  Imad Yousif

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/68735 ,  H01J37/32082 ,  H01J37/32091 ,  H01J37/32715 ,  H01L21/67017 ,  H01L21/6719 ,  H01L21/6831 ,  H01L21/68742 ,  H01J2237/334

Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.

公开(公告)号：US12074010B2

公开(公告)日：2024-08-27

申请号：US17470294

申请日：2021-09-09

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice ,  Hanish Kumar Panavalappil Kumarankutty ,  Steven D. Marcus ,  Kirubanandan Naina Shanmugam ,  Sriharsha Dharmapura Sathyanarayanamurthy ,  Madhukar Krishna ,  Shivaprakash Padadayya Hiremath ,  Senthil Kumar Nattamai Subramanian ,  Sankar Menon Cherubala Pathayapura

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46

CPC classification number: H01J37/3244 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/4586 ,  C23C16/46 ,  C23C16/463 ,  H01J37/32357 ,  H01J37/32522 ,  H01J37/32724 ,  C23C16/4582

Abstract: Methods and apparatus for coating processing reactor component parts are provided herein. In some embodiments, a part coating reactor includes: a lower body and a lid assembly that together define and enclose an interior volume; one or more heaters disposed in the lid assembly; one or more coolant channels disposed in the lid assembly to flow a heat transfer medium therethrough; a plurality of gas passages disposed through the lid assembly to facilitate providing one or more gases to the interior volume, wherein the plurality of gas passages include a plurality of fluidly independent plenums disposed in the lid assembly; and one or more mounting brackets to facilitate coupling a workpiece to the lid assembly.

公开(公告)号：US11782404B2

公开(公告)日：2023-10-10

申请号：US17219692

申请日：2021-03-31

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice ,  Dean C. Hruzek

IPC: G05B15/02 ,  H01L21/677

CPC classification number: G05B15/02 ,  H01L21/67775

Abstract: A system comprises a factory interface (FI) comprising an FI chamber and a carrier purge chamber, the FI configured to receive a substrate carrier that becomes coupled to the FI such that the carrier purge chamber is positioned between the FI chamber and the substrate carrier, the substrate carrier comprising a carrier door. The system further comprises an environmental control system coupled to at least one of the FI chamber or the carrier purge chamber and configured to couple to the substrate carrier, the environmental control system operable to separately control environmental conditions within at least one of: the carrier purge chamber and the substrate carrier; the carrier purge chamber and the FI chamber; or the FI chamber and the substrate carrier, while the carrier door of the substrate carrier is closed.

公开(公告)号：USD992611S1

公开(公告)日：2023-07-18

申请号：US29859229

申请日：2022-11-08

Applicant: Applied Materials, Inc.

Designer： Michael R. Rice ,  Michael C. Kuchar ,  Travis Morey ,  Adam J. Wyatt ,  Ofer Amir

Abstract: FIG. 1 is a top perspective view of a mainframe for substrate processing system of the present design.
FIG. 2 is a side view thereof.
FIG. 3 is a side view thereof.
FIG. 4 is a front view thereof.
FIG. 5 is a rear view thereof.
FIG. 6 is a top view thereof.
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a top perspective view thereof, showing unclaimed components attached thereto.
The broken lines shown in the figures are directed to unclaimed portions of the mainframe and/or unclaimed components attached to the mainframe that are for illustrative purposes only and form no part of the claimed design.

公开(公告)号：USD991994S1

公开(公告)日：2023-07-11

申请号：US29859227

申请日：2022-11-08

Applicant: Applied Materials, Inc.

Designer： Michael R. Rice ,  Michael C. Kuchar ,  Travis Morey ,  Adam J. Wyatt ,  Ofer Amir

Abstract: FIG. 1 is a top perspective view of a mainframe for substrate processing system of the present design.
FIG. 2 is a side view thereof.
FIG. 3 is a side view thereof.
FIG. 4 is a front view thereof.
FIG. 5 is a rear view thereof.
FIG. 6 is a top view thereof.
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a top perspective view thereof, showing unclaimed components attached thereto.
The broken lines shown in the figures are directed to unclaimed portions of the mainframe and/or unclaimed components attached to the mainframe that are for illustrative purposes only and form no part of the claimed design.