公开(公告)号：US20140103463A1

公开(公告)日：2014-04-17

申请号：US14136199

申请日：2013-12-20

Applicant: Infineon Technologies AG

Inventor： Bernhard Winkler ,  Rainer Leuschner ,  Horst Theuss

IPC: B81B7/00 ,  H01L29/84

CPC classification number: B81B7/0058 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/015 ,  B81C2203/0154 ,  G01L9/0054 ,  G01L15/00 ,  G01L19/141 ,  G01L19/148 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

Abstract translation: 实施例涉及传感器和感测装置，系统和方法。 在一个实施例中，微机电系统（MEMS）装置包括至少一个传感器元件; 设置在所述至少一个传感器元件周围的框架元件; 由所述框架元件限定的至少一个端口，所述至少一个端口被配置为将所述至少一个传感器元件的至少一部分暴露于周围环境; 以及设置在所述至少一个端口中的薄层。

公开(公告)号：US20140097514A1

公开(公告)日：2014-04-10

申请号：US13647740

申请日：2012-10-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Klaus Elian ,  Jens Pohl ,  Horst Theuss ,  Renate Hofmann ,  Alexander Glas ,  Carsten Ahrens

IPC: H01L27/08 ,  H01L21/78

CPC classification number: H01L23/295 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5227 ,  H01L23/5389 ,  H01L23/645 ,  H01L24/19 ,  H01L24/96 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2224/03 ,  H01L2924/00

Abstract: A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material.

Abstract translation: 半导体封装包括半导体芯片，施加到半导体芯片的电感器。 电感器包括至少一个绕组。 至少一个绕组内的空间填充有磁性材料。

公开(公告)号：US12135853B2

公开(公告)日：2024-11-05

申请号：US17823372

申请日：2022-08-30

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss

IPC: G06F3/043 ,  B06B1/02

Abstract: What is proposed is an ultrasonic touch sensor having a contact surface for attaching the ultrasonic touch sensor to a casing, having a first ultrasonic transducer element, having a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element, wherein the first semiconductor chip is potted into a potting compound in such a way that a first cutout is formed from the first ultrasonic transducer element to the contact surface of the ultrasonic touch sensor, and wherein the potting compound forms the housing of the ultrasonic touch sensor.

公开(公告)号：US11860272B2

公开(公告)日：2024-01-02

申请号：US18053583

申请日：2022-11-08

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Christoph Steiner ,  Horst Theuss ,  Matthias Eberl ,  Fabian Merbeler

IPC: G06F3/043 ,  G01S15/08

CPC classification number: G01S15/08 ,  G06F3/043

Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.

公开(公告)号：US11619520B2

公开(公告)日：2023-04-04

申请号：US17247665

申请日：2020-12-18

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner ,  Horst Theuss ,  Thomas Mueller

IPC: G01D5/20

Abstract: The present disclosure relates to an inductive angle and/or position sensor comprising a first sensor component and a second sensor component, which is movable relative thereto, wherein the first sensor component comprises an excitation coil and a receiving coil arrangement having two or more individual receiving coils, and wherein the second sensor component comprises an inductive target. The first sensor component comprises a semiconductor chip having an integrated circuit. The sensor comprises a housing, in which the semiconductor chip is arranged. The individual receiving coils of the receiving coil arrangement are configured in at least two structured metallization layers spaced apart from one another, which are arranged within the housing and/or outside on an outer surface of the housing.

公开(公告)号：US20230085825A1

公开(公告)日：2023-03-23

申请号：US17993024

申请日：2022-11-23

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: G01N21/17 ,  G01N29/24 ,  G01R33/028 ,  B81C1/00

Abstract: A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.

公开(公告)号：US11530980B2

公开(公告)日：2022-12-20

申请号：US17336663

申请日：2021-06-02

Applicant: Infineon Technologies AG ,  Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Inventor： Stefan Kolb ,  Alfons Dehe ,  Jochen Huber ,  Franz Jost ,  Horst Theuss ,  Wilhelm Wiedmeier ,  Juergen Woellenstein

IPC: G01N21/17 ,  G01N29/24 ,  G01N29/02 ,  G01N29/30

Abstract: A gas sensor includes a multi-wafer stack of a plurality of layers and a measurement chamber. The plurality of layers includes a first layer comprising a sensor element that has a microelectromechanical system (MEMS) membrane; and a second layer comprising an emitter element configured to emit electromagnetic radiation. The measurement chamber is interposed between the first layer and the second layer. The measurement chamber is configured to receive a measurement gas and further receive the electromagnetic radiation emitted by the emitter element as the electromagnetic radiation travels along a radiation path from a first end of the measurement chamber to a second end of the measurement chamber that is opposite to the first end.

公开(公告)号：US11289353B2

公开(公告)日：2022-03-29

申请号：US16158438

申请日：2018-10-12

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Horst Theuss

IPC: H01L21/673 ,  H01L23/049 ,  H01L23/20 ,  H01L21/67 ,  B81C1/00

Abstract: A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.

公开(公告)号：US11067542B2

公开(公告)日：2021-07-20

申请号：US16686670

申请日：2019-11-18

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Kolb ,  Horst Theuss

IPC: G01N29/24 ,  G01N21/17 ,  G01N29/30

Abstract: Photoacoustic gas sensor having a light pulse emitter, a microphone in a reference gas housing having a reference gas, and a sample gas housing to be filled with a gas to be analyzed. A wall separates the sample gas housing from the reference gas housing, and has a transparent region that is transparent to light within a frequency range of emitted light pulses. Remaining inner walls of the sample gas housing have a reflecting surface that reflect light pulses emitted by the emitter so that a portion of the light pulses not absorbed by the gas to be analyzed pass through the transparent region into the reference gas volume. The microphone generates a sensor signal indicating information on an acoustic wave caused by the light pulses interacting with the reference gas after crossing the gas to be analyzed.

公开(公告)号：US20210043603A1

公开(公告)日：2021-02-11

申请号：US17078460

申请日：2020-10-23

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Stephan Bradl ,  Stefan Miethaner ,  Alexander Heinrich ,  Horst Theuss ,  Peter Scherl

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/677 ,  H01L21/56 ,  H01L21/67 ,  H01L21/48 ,  H01L21/78 ,  H01L23/31

Abstract: A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.