公开(公告)号：US20180212645A1

公开(公告)日：2018-07-26

申请号：US15745908

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Emanuel COHEN

IPC: H04B1/48 ,  H01L23/66 ,  H01L25/065 ,  H01Q1/22

CPC classification number: H04W76/10 ,  H01L23/66 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/16221 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01Q1/2266 ,  H01Q1/2283 ,  H01Q3/30 ,  H04B1/38 ,  H04B1/48 ,  H04Q1/15 ,  H05K7/1487

Abstract: A microelectronic package is described with a wireless interconnect for chip-to-chip communication. In one example, the package includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the package substrate coupled to the radio to send the modulated data over the carrier to an external device.

公开(公告)号：US20180097458A1

公开(公告)日：2018-04-05

申请号：US15283117

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Feras EID ,  Adel A. ELSHERBINI ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H02N2/02 ,  H01L41/09 ,  H01L41/187 ,  H01L41/18

CPC classification number: H02N2/023 ,  G01J3/42 ,  H01L27/20 ,  H02N2/025 ,  H02N2/026 ,  H02N2/101

Abstract: Embodiments of the invention include a self-propelled sensor system. In an embodiment, the self-propelled sensor system includes a piezoelectrically actuated motor that is integrated with a substrate. In an embodiment, the self-propelled sensor system may also include a sensor and an integrated circuit electrically coupled to the piezoelectrically actuated motor. Embodiments of the invention may also include self-propelled sensor systems that include plurality of piezoelectrically actuated motors. In an embodiment the piezoelectrically actuated motors may be one or more different types of motors including, but not limited to, stick and slip motors, inchworm stepping motors, standing acoustic wave motors, a plurality of piezoelectrically actuated cantilevers, and a piezoelectrically actuated diaphragm. Additional embodiments of the invention may include a plurality of self-propelled sensor systems that are communicatively coupled to form a sensor mesh.

公开(公告)号：US20180006208A1

公开(公告)日：2018-01-04

申请号：US15199894

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01L41/113 ,  G06F1/16 ,  H01L41/16

CPC classification number: H01L41/1136 ,  B81B2201/0235 ,  B81B2207/012 ,  B81C1/00476 ,  G06F1/1633 ,  G06F1/1694 ,  G06F2200/1637 ,  H01L41/1132 ,  H01L41/16

Abstract: Embodiments of the invention include a sensing device that includes a base structure having a proof mass that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. The proof mass deflects in response to application of an external force or acceleration and this deflection causes a stress in the piezoelectric material which generates a voltage differential between the first and second electrodes.

公开(公告)号：US20180004357A1

公开(公告)日：2018-01-04

申请号：US15199906

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN ,  Shawna M. LIFF

IPC: G06F3/043 ,  H03H9/25 ,  G06F3/041

CPC classification number: G06F3/0436 ,  G06F3/0416 ,  H01L2924/15311 ,  H01L2924/181 ,  H03H9/25 ,  H01L2924/00012

Abstract: Embodiments of the invention include an acoustic sensing device having a piezoelectric transmit transducer to receive input electrical signals and to generate a surface acoustic wave to be transmitted along a surface of the sensing device which is integrated with an organic substrate. The sensing device also includes a piezoelectric receive transducer to receive the surface acoustic wave and to generate output electrical signals and an input region integrated with the organic substrate. The input region is capable of receiving input which changes an acoustic amplitude of the surface acoustic wave.

公开(公告)号：US20180001640A1

公开(公告)日：2018-01-04

申请号：US15199899

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Shawna M. LIFF ,  Sasha N. OSTER ,  Thomas L. SOUNART ,  Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Johanna M. SWAN

IPC: B41J2/14

CPC classification number: B41J2/14298 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2002/14266 ,  B41J2202/13

Abstract: Embodiments of the invention include a piezoelectric package integrated jet device. In one example, the jet device includes a vibrating membrane positioned between first and second cavities of an organic substrate, a piezoelectric material coupled to the vibrating membrane which acts as a first electrode, and a second electrode in contact with the piezoelectric material. The vibrating membrane generates fluid flow through an orifice in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US20170288642A1

公开(公告)日：2017-10-05

申请号：US15088987

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras EID ,  Georgios C. DOGIAMIS ,  Valluri R. RAO ,  Adel A. ELSHERBINI ,  Johanna M. SWAN ,  Telesphor KAMGAING ,  Vijay K. NAIR

IPC: H03H9/54 ,  H03H9/05 ,  B01D21/30 ,  H03H9/17

CPC classification number: H03H9/54 ,  H03H9/05 ,  H03H9/0542 ,  H03H9/17 ,  H03H9/173 ,  H03H9/2463 ,  H03H2009/02503 ,  H03H2009/155

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US20170285695A1

公开(公告)日：2017-10-05

申请号：US15089001

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Feras EID ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: G06F1/18 ,  H03H9/54 ,  H03H9/56

CPC classification number: G06F1/18 ,  H03H9/0542 ,  H03H9/0557 ,  H03H9/542 ,  H03H9/545 ,  H03H9/56 ,  H03H9/587

Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.

公开(公告)号：US20250070083A1

公开(公告)日：2025-02-27

申请号：US18942054

申请日：2024-11-08

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Henning BRAUNISCH ,  Aleksandar ALEKSOV ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Patrick MORROW ,  Kimin JUN ,  Brennen MUELLER ,  Paul B. FISCHER

IPC: H01L25/065 ,  H01L23/498 ,  H01L25/00

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include: a first die having a first surface and an opposing second surface, first conductive contacts at the first surface of the first die, and second conductive contacts at the second surface of the first die; and a second die having a first surface and an opposing second surface, and first conductive contacts at the first surface of the second die; wherein the second conductive contacts of the first die are coupled to the first conductive contacts of the second die by interconnects, the second surface of the first die is between the first surface of the first die and the first surface of the second die, and a footprint of the first die is smaller than and contained within a footprint of the second die.

公开(公告)号：US20250040231A1

公开(公告)日：2025-01-30

申请号：US18914863

申请日：2024-10-14

Applicant: Intel Corporation

Inventor： Han Wui THEN ,  Marko RADOSAVLJEVIC ,  Pratik KOIRALA ,  Nicole K. THOMAS ,  Paul B. FISCHER ,  Adel A. ELSHERBINI ,  Tushar TALUKDAR ,  Johanna M. SWAN ,  Wilfred GOMES ,  Robert S. CHAU ,  Beomseok CHOI

IPC: H01L27/06 ,  H01L21/765 ,  H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L23/64 ,  H01L25/00 ,  H01L25/065 ,  H01L27/092 ,  H01L29/06 ,  H01L29/20 ,  H01L29/205 ,  H01L29/40 ,  H01L29/423 ,  H01L29/66 ,  H01L29/778 ,  H01L29/786

Abstract: Gallium nitride (GaN) three-dimensional integrated circuit technology is described. In an example, an integrated circuit structure includes a layer including gallium and nitrogen, a plurality of gate structures over the layer including gallium and nitrogen, a source region on a first side of the plurality of gate structures, a drain region on a second side of the plurality of gate structures, the second side opposite the first side, and a drain field plate above the drain region wherein the drain field plate is coupled to the source region. In another example, a semiconductor package includes a package substrate. A first integrated circuit (IC) die is coupled to the package substrate. The first IC die includes a GaN device layer and a Si-based CMOS layer.

公开(公告)号：US20240213216A1

公开(公告)日：2024-06-27

申请号：US18597684

申请日：2024-03-06

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Amr Elshazly ,  Arun CHANDRASEKHAR ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: H01L25/065 ,  H01L23/498 ,  H01L25/00

CPC classification number: H01L25/0652 ,  H01L23/49822 ,  H01L25/50

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.