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公开(公告)号:US20180158674A1
公开(公告)日:2018-06-07
申请号:US15802089
申请日:2017-11-02
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Shintaro Yamada , Li Cui , Christopher Gilmore , Joshua A. Kaitz , Sheng Liu , James F. Cameron , Suzanne M. Coley
IPC: H01L21/027 , G03F7/11 , C09D171/00
CPC classification number: H01L21/0276 , C09D171/00 , G03F7/0752 , G03F7/091 , G03F7/094 , G03F7/11 , G03F7/16 , G03F7/20 , G03F7/30 , H01L21/0332 , H01L21/3065 , H01L21/3081 , H01L21/31116 , H01L21/31138
Abstract: Aromatic resin polymers and compositions containing them are useful as underlayers in semiconductor manufacturing processes.
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公开(公告)号:US20180059547A1
公开(公告)日:2018-03-01
申请号:US15254935
申请日:2016-09-01
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Charlotte A. Cutler , Suzanne M. Coley , Owendi Ongayi , Christopher P. Sullivan , Paul J. LaBeaume , Li Cui , Shintaro Yamada , Mingqi Li , James F. Cameron
IPC: G03F7/11 , G03F7/16 , G03F7/42 , G03F7/20 , G03F7/30 , C08G77/04 , C09D5/20 , C09D183/04 , C08F20/14 , C08F24/00 , C08G73/12 , C08F20/32 , C08G67/00 , C08F20/28
CPC classification number: G03F7/11 , C08F20/10 , C08F20/14 , C08F20/28 , C08F20/32 , C08F24/00 , C08F220/14 , C08F220/20 , C08F220/24 , C08F222/06 , C08F222/40 , C08F230/08 , C08F2220/1825 , C08F2220/1858 , C08F2220/1891 , C08F2220/282 , C08F2220/283 , C08F2220/325 , C08F2800/10 , C08G67/00 , C08G73/128 , C08G77/04 , C09D5/20 , C09D183/04 , G03F7/0752 , G03F7/161 , G03F7/20 , G03F7/30 , G03F7/422 , G03F7/423
Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.
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公开(公告)号:US11762294B2
公开(公告)日:2023-09-19
申请号:US17007877
申请日:2020-08-31
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventor: Joshua Kaitz , Sheng Liu , Li Cui , Shintaro Yamada , Suzanne M. Coley , Iou-Sheng Ke
Abstract: A photoresist underlayer composition, comprising a polymer comprising a repeating unit of formula (1):
wherein Ar is a monocyclic or polycyclic C5-60 aromatic group, wherein the aromatic group comprises one or more aromatic ring heteroatoms, a substituent group comprising a heteroatom, or a combination thereof; R1 is hydrogen, substituted or unsubstituted C1-30 alkyl, substituted or unsubstituted C1-30 heteroalkyl, substituted or unsubstituted C3-30 cycloalkyl, substituted or unsubstituted C2-30 heterocycloalkyl, substituted or unsubstituted C2-30 alkenyl, substituted or unsubstituted C2-30 alkynyl, substituted or unsubstituted C6-30 aryl, substituted or unsubstituted C7-30 arylalkyl, substituted or unsubstituted C7-30 alkylaryl, substituted or unsubstituted C3-30 heteroaryl, or substituted or unsubstituted C4-30 heteroarylalkyl; and R2 is substituted or unsubstituted C1-30 alkyl, substituted or unsubstituted C1-30 heteroalkyl, substituted or unsubstituted C3-30 cycloalkyl, substituted or unsubstituted C2-30 heterocycloalkyl, substituted or unsubstituted C2-30 alkenyl, substituted or unsubstituted C2-30 alkynyl, substituted or unsubstituted C6-30 aryl, substituted or unsubstituted C7-30 arylalkyl, substituted or unsubstituted C7-30 alkylaryl, substituted or unsubstituted C3-30 heteroaryl, or substituted or unsubstituted C4-30 heteroarylalkyl, wherein R1 and R2 can be optionally taken together to form a ring.-
公开(公告)号:US11506979B2
公开(公告)日:2022-11-22
申请号:US15834157
申请日:2017-12-07
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Li Cui , Paul J. LaBeaume , Charlotte A. Cutler , Suzanne M. Coley , Shintaro Yamada , James F. Cameron , William Williams
IPC: G03F7/09 , G03F7/11 , G03F7/42 , C08F8/14 , C08F8/42 , C09D151/00 , C09D187/00 , G03F7/26 , G03F7/16 , G03F7/20 , C08L101/00 , G03F7/075 , C08F212/32 , C08F220/28 , C08F220/30 , C08F212/14
Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.
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公开(公告)号:US20220066320A1
公开(公告)日:2022-03-03
申请号:US17007877
申请日:2020-08-31
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventor: Joshua Kaitz , Sheng Liu , Li Cui , Shintaro Yamada , Suzanne M. Coley , Iou-Sheng Ke
Abstract: A photoresist underlayer composition, comprising a polymer comprising a repeating unit of formula (1): wherein Ar is a monocyclic or polycyclic C5-60 aromatic group, wherein the aromatic group comprises one or more aromatic ring heteroatoms, a substituent group comprising a heteroatom, or a combination thereof; R1 is hydrogen, substituted or unsubstituted C1-30 alkyl, substituted or unsubstituted C1-30 heteroalkyl, substituted or unsubstituted C3-30 cycloalkyl, substituted or unsubstituted C2-30 heterocycloalkyl, substituted or unsubstituted C2-30 alkenyl, substituted or unsubstituted C2-30 alkynyl, substituted or unsubstituted C6-30 aryl, substituted or unsubstituted C7-30 arylalkyl, substituted or unsubstituted C7-30 alkylaryl, substituted or unsubstituted C3-30 heteroaryl, or substituted or unsubstituted C1-30 heteroarylalkyl; and R2 is substituted or unsubstituted C1-30 alkyl, substituted or unsubstituted C1-30 heteroalkyl, substituted or unsubstituted C3-30 cycloalkyl, substituted or unsubstituted C2-30 heterocycloalkyl, substituted or unsubstituted C2-30 alkenyl, substituted or unsubstituted C2-30 alkynyl, substituted or unsubstituted C6-30 aryl, substituted or unsubstituted C7-30 arylalkyl, substituted or unsubstituted C7-30 alkylaryl, substituted or unsubstituted C3-30 heteroaryl, or substituted or unsubstituted C4-30 heteroarylalkyl, wherein R1 and R2 can be optionally taken together to form a ring.
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公开(公告)号:US20210341840A1
公开(公告)日:2021-11-04
申请号:US17231417
申请日:2021-04-15
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Sheng Liu , James F. Cameron , Shintaro YAMADA , Iou-Sheng KE , Keren ZHANG , Suzanne M. Coley , Li Cui , Paul J. LaBeaume , Deyan Wang
Abstract: Coating compositions comprise: a curable compound comprising: a core chosen from a C6 carbocyclic aromatic ring, a C2-5 heterocyclic aromatic ring, a C9-30 fused carbocyclic aromatic ring system, a C4-30 fused heterocyclic aromatic ring system, C1-20 aliphatic, and C3-20 cycloaliphatic, and three or more substituents of formula (1) wherein at least two substituents of formula (1) are attached to the aromatic core; and wherein: Ar1 is chosen from a C6 carbocyclic aromatic ring, a C2-5 heterocyclic aromatic ring, a C9-30 fused carbocyclic aromatic ring system, and a C4-30 fused heteroocyclic aromatic ring system; Z is a substituent independently chosen from OR1, protected hydroxyl, carboxyl, protected carboxyl, SR1, protected thiol, —O—C(═O)—C1-6 alkyl, halogen, and NHR2; wherein each R1 is independently chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, and C5-30 aryl; each R2 is independently chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, C5-30 aryl, C(═O)—R1, and S(═O)2—R1; x is an integer from 1 to the total number of available aromatic ring atoms in Ar1; and * denotes the point of attachment to the core; provided that no substituents of formula (1) are in an ortho position to each other on the same aromatic ring of the core; a polymer; and one or more solvents, wherein the total solvent content is from 50 to 99 wt % based on the coating composition. Coated substrates formed with the coating compositions and methods of forming electronic devices using the compositions are also provided. The compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices.
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公开(公告)号:US20190146343A1
公开(公告)日:2019-05-16
申请号:US16133739
申请日:2018-09-18
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Charlotte A Cutler , Li Cui , Shintaro Yamada , Paul J. LaBeaume , Suzanne M. Coley , James F. Cameron , Daniel Greene
IPC: G03F7/11 , C09D143/04 , C08F230/08 , G03F7/16 , G03F7/32 , G03F7/20 , G03F7/42
Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.
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公开(公告)号:US20190041751A1
公开(公告)日:2019-02-07
申请号:US16022874
申请日:2018-06-29
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Li Cui , Paul J. LaBeaume , James F. Cameron , Charlotte A. Cutler , Shintaro Yamada , Suzanne M. Coley , Iou-Sheng Ke
IPC: G03F7/11 , C08F230/08 , C09D143/04 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/42 , G03F7/40
Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising one or more condensed polymers having an organic polymer chain having pendently-bound moieties having an acidic proton and a pKa in water from −5 to 13 and having pendently-bound siloxane moieties are provided.
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公开(公告)号:US10114288B2
公开(公告)日:2018-10-30
申请号:US15254935
申请日:2016-09-01
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Charlotte A. Cutler , Suzanne M. Coley , Owendi Ongayi , Christopher P. Sullivan , Paul J. LaBeaume , Li Cui , Shintaro Yamada , Mingqi Li , James F. Cameron
IPC: G03F7/11 , G03F7/075 , C08F20/14 , C08F20/28 , C08F20/32 , C08F24/00 , C08G67/00 , C08G73/12 , C08G77/04 , C09D5/20 , C09D183/04 , G03F7/16 , G03F7/20 , G03F7/30 , G03F7/42 , C08F20/10 , C08F220/14 , C08F220/20 , C08F220/24 , C08F222/06 , C08F222/40 , C08F230/08 , C08F220/18 , C08F220/28 , C08F220/32
Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.
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公开(公告)号:US10007184B2
公开(公告)日:2018-06-26
申请号:US15254929
申请日:2016-09-01
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Li Cui , Charlotte A. Cutler , Suzanne M. Coley , Owendi Ongayi , Christopher P. Sullivan , Paul J. LaBeaume , Shintaro Yamada , Mingqi Li , James F. Cameron
IPC: G03F7/42 , G03F7/11 , G03F7/16 , G03F7/20 , G03F7/30 , C08F16/10 , C08F24/00 , C08G77/04 , C09D5/20 , C09D183/04 , C08G63/08 , C08F20/14 , C08F20/30 , C08F20/06
CPC classification number: G03F7/11 , C08F16/10 , C08F20/06 , C08F20/10 , C08F20/14 , C08F20/30 , C08F24/00 , C08F220/14 , C08F220/20 , C08F220/34 , C08F222/06 , C08F222/40 , C08F230/08 , C08F2220/1825 , C08F2220/1858 , C08F2220/1891 , C08F2220/282 , C08F2220/283 , C08F2220/325 , C08F2800/10 , C08G63/08 , C08G77/04 , C08G77/20 , C08G77/80 , C09D5/20 , C09D183/04 , G03F7/0752 , G03F7/161 , G03F7/20 , G03F7/30 , G03F7/422 , G03F7/423 , C08K5/19 , C08L33/14
Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.
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