公开(公告)号：US20090084590A1

公开(公告)日：2009-04-02

申请号：US12188257

申请日：2008-08-08

Applicant: Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

Inventor： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC: H05K1/00

CPC classification number: H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

Abstract translation: 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US20070257356A1

公开(公告)日：2007-11-08

申请号：US11822084

申请日：2007-07-02

Applicant: Tomoyuki Abe ,  Motoaki Tani

Inventor： Tomoyuki Abe ,  Motoaki Tani

IPC: H01L21/00

CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49833 ,  H01L23/5389 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3511

Abstract: A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed to an opening part piercing the support body and the second substrate. The first substrate includes a first dielectric layer and a wiring layer, a plurality of first electrodes connected to the semiconductor chip which first electrodes are provided on a first surface of the first substrate exposed to an inside of the opening part, and the second substrate includes a second dielectric layer made of a material substantially the same as the first dielectric layer.

Abstract translation: 半导体器件包括支撑体，设置在支撑体的一侧的表面上的第一基板，设置在支撑体的另一侧的表面上的第二基板和设置在第一基板上的半导体芯片， 穿过所述支撑体和所述第二基板的开口部。 第一基板包括第一介电层和布线层，多个与半导体芯片连接的第一电极，第一电极设置在暴露于开口部的内部的第一基板的第一表面上，第二基板包括 由与第一电介质层基本相同的材料制成的第二电介质层。

公开(公告)号：US20070240901A1

公开(公告)日：2007-10-18

申请号：US11812124

申请日：2007-06-15

Applicant: Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

Inventor： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC: H05K1/11

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

Abstract translation: 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US07246435B2

公开(公告)日：2007-07-24

申请号：US11138467

申请日：2005-05-27

Applicant: Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

Inventor： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC: H01K3/10

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

Abstract translation: 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US20070128825A1

公开(公告)日：2007-06-07

申请号：US11293663

申请日：2005-12-02

Applicant: Tadatomo Suga ,  Mohammad Howlader ,  Tomoyuki Abe

Inventor： Tadatomo Suga ,  Mohammad Howlader ,  Tomoyuki Abe

IPC: H01L21/30 ,  H01L21/46

CPC classification number: H01L21/187 ,  H01L24/27 ,  H01L24/30 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/09701

Abstract: A method for bonding of substrates has a steps of irradiating surfaces of the substrates respectively in a vacuum with both an inert gas beam and a metal beam thereby forming island shaped thin metal films on the surfaces of the substrates, and surface-activated bonding of the substrates through the island shaped thin metal films by contacting the surfaces of the substrates each other.

Abstract translation: 基板的接合方法具有分别在惰性气体束和金属梁两者的真空中照射基板的表面的步骤，从而在基板的表面上形成岛状薄金属膜，并且将表面激活的 通过使基板的表面彼此接触而穿过岛状薄金属膜的基板。

公开(公告)号：US20070122235A1

公开(公告)日：2007-05-31

申请号：US11698531

申请日：2007-01-26

Applicant: Atsushi Kasahara ,  Shunsuke Ushio ,  Kojiro Ogata ,  Hiroshi Inamitsu ,  Fumio Goto ,  Tomoyuki Abe ,  Hiroaki Irie ,  Isami Fujii ,  Kazuo Onoda ,  Hideo Ikeda ,  Eisuke Nagai ,  Atsuki Gomi ,  Masaki Tsunabuchi

Inventor： Atsushi Kasahara ,  Shunsuke Ushio ,  Kojiro Ogata ,  Hiroshi Inamitsu ,  Fumio Goto ,  Tomoyuki Abe ,  Hiroaki Irie ,  Isami Fujii ,  Kazuo Onoda ,  Hideo Ikeda ,  Eisuke Nagai ,  Atsuki Gomi ,  Masaki Tsunabuchi

IPC: E01C7/32

CPC classification number: E01C23/065

Abstract: A method for recycling in place an asphalt mixture layer of a paved road continuously, while moving a self-propelled vehicle system, which comprises a step of heating and softening the asphalt mixture layer, a step of scraping and breaking said hot and softened asphalt mixture layer and keeping the softened mixture at a temperature sufficient not to form an aggregate, to prepare an asphalt mixture having a single-grained structure, a sieving step of classifying said asphalt mixture having a single-grained structure into a plurality of grain size groups, a step of designing mix proportions for converting said asphalt mixture to a recycled asphalt mixture by the use of said plurality of grain size groups classified, a step of mixing uniformly said recycled asphalt mixtures having designed mix proportions, and a step of spreading and compacting said recycled asphalt mixtures having been mixed uniformly, to thereby form a recycled asphalt mixtures layer.

Abstract translation: 一种用于在移动自行车辆系统的同时循环使用铺路的沥青混合物层的方法，其包括加热和软化沥青混合物层的步骤，刮削和破碎所述热和软化沥青混合物的步骤 将软化混合物保持在足够不形成骨料的温度下，制备具有单一颗粒结构的沥青混合料，将具有单一颗粒结构的沥青混合料分级成多个粒度组的筛分步骤， 设计混合比例的步骤，通过使用分级的所述多个粒度组将所述沥青混合物转化为再循环沥青混合物，将所述具有设计的混合比例的再循环沥青混合物均匀混合的步骤，以及将所述沥青混合物扩展和压实所述 再循环沥青混合物已经均匀混合，从而形成再循环沥青混合物层。

公开(公告)号：US07224046B2

公开(公告)日：2007-05-29

申请号：US11141643

申请日：2005-06-01

Applicant: Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani

Inventor： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani

IPC: H01L23/48 ,  H05K3/40

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/09 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).

Abstract translation: 多层布线板（X 1）包括芯部（100）和外芯布线部（30）。 芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20） 包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。 外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。

公开(公告)号：US07017265B2

公开(公告)日：2006-03-28

申请号：US10279980

申请日：2002-10-25

Applicant: Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe

Inventor： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe

IPC: H01K3/10

CPC classification number: H05K3/4661 ,  H05K3/108 ,  H05K3/38 ,  H05K3/389 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/066 ,  H05K2203/1152 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar structure which includes insulating layers and a wiring pattern. The method includes at least the steps of sticking a support whose surface has been treated with a coupling agent onto an insulating layer with a coupling agent interposed therebetween, and transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer.

公开(公告)号：US20050218503A1

公开(公告)日：2005-10-06

申请号：US11141643

申请日：2005-06-01

Applicant: Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani

Inventor： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani

IPC: A63H30/04 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H05K1/03 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/09 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).

Abstract translation: 多层布线板（X 1）包括芯部（100）和外芯布线部（30）。 芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20） 包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。 外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。

公开(公告)号：US5976393A

公开(公告)日：1999-11-02

申请号：US21953

申请日：1998-02-11

Applicant: Tomoyuki Abe

Inventor： Tomoyuki Abe

IPC: H05K1/09 ,  B22F7/08 ,  H01L21/48 ,  H05K3/02 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  B44C1/22

CPC classification number: H05K3/4617 ,  B22F7/08 ,  H01L21/4857 ,  H01L21/486 ,  H05K3/102 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4664 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0191 ,  H05K2203/1131 ,  H05K2203/1327 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/388 ,  H05K3/4038 ,  Y10T156/1057 ,  Y10T29/49155

Abstract: A method of manufacturing a multilayer circuit substrate includes a process of forming via holes in an insulating film, a process of applying an electrically conducting paste obtained by having ultra-fine metal particles disperse in a solvent onto an insulating film, and a process of forming vias composed of a sintered product of ultra-fine metal particles in the via holes by removing the solvent and also sintering the ultra-fine metal particles. The sintered products of the ultra-fine metal particles on the insulating layer is removed (or patterned) by peeling off the protective film stuck to the insulating layer.

Abstract translation: 一种制造多层电路基板的方法包括在绝缘膜中形成通孔的工艺，将通过将超细金属颗粒分散在溶剂中而获得的导电浆料涂敷到绝缘膜上的工艺和形成 由通孔中的超细金属颗粒的烧结体构成的通孔，除去溶剂，并烧结超细金属粒子。 通过剥离粘附到绝缘层上的保护膜，去除（或图案化）绝缘层上的超细金属颗粒的烧结产物。