公开(公告)号：US5751068A

公开(公告)日：1998-05-12

申请号：US847320

申请日：1997-04-23

Applicant: Jack McMahon ,  George Chiu

Inventor： Jack McMahon ,  George Chiu

IPC: B23K3/06 ,  B23K35/02 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/16 ,  B23K3/0623 ,  B23K3/0692 ,  B23K35/0222 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11013 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/27438 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/303 ,  Y02P70/613

Abstract: An electronic component with insulative tape-held solder forms is disclosed. Electronic components may be any of the integrated circuit chips, chip packages and printed circuit boards. The solder forms are coupled to conductive pads of the electronic component through through-holes in the insulative tape. The solder forms may be shaped as balls, cylinders, polygonal boxes, barrels, or hour-glasses. The insulative tape is thermally conductive and heat resistant. The tape may be made of an organic material such as an elastomer. The tape may further have impregnated materials such as ceramic, aluminum nitride, or solder flux to improve its thermal, mechanical, and/or electrical properties.

Abstract translation: 公开了一种具有绝缘带状焊接形式的电子部件。 电子部件可以是集成电路芯片，芯片封装和印刷电路板中的任何一个。 焊料形式通过绝缘带中的通孔耦合到电子部件的导电焊盘。 焊料形状可以形成为球，圆柱体，多边形盒，桶或小时眼镜。 绝缘带是导热和耐热的。 胶带可以由诸如弹性体的有机材料制成。 带可以进一步具有诸如陶瓷，氮化铝或助焊剂的浸渍材料，以改善其热，机械和/或电性质。

公开(公告)号：US5736074A

公开(公告)日：1998-04-07

申请号：US496972

申请日：1995-06-30

Applicant: Donald J. Hayes ,  Mary W. Hartnett

Inventor： Donald J. Hayes ,  Mary W. Hartnett

IPC: B01J2/00 ,  B22F1/00 ,  B22F1/02 ,  B22F9/14 ,  B23K3/06 ,  B23K35/02 ,  C23C4/12 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/10 ,  H05K3/32 ,  H05K3/34 ,  B29B9/10

CPC classification number: H01L24/12 ,  B01J2/006 ,  B22F1/0048 ,  B22F1/02 ,  B22F9/14 ,  B23K3/0607 ,  B23K3/0623 ,  B23K35/0244 ,  C23C4/123 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3457 ,  B23K2201/40 ,  B23K35/025 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/29101 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L24/81 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H05K2201/0218 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/013 ,  H05K2203/041 ,  H05K2203/0425 ,  H05K3/102 ,  Y02P70/613 ,  Y10T29/4913

Abstract: Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.

Abstract translation: 形成具有基本均匀的尺寸和形状并且涂覆有较低温度熔融材料的固体球，用于互连阵列，焊膏，Z轴导电粘合剂等。两种材料的滴在飞行中合并形成较低熔化的涂层 温度较高的材料在较高熔点的材料下降。

公开(公告)号：US5731066A

公开(公告)日：1998-03-24

申请号：US546795

申请日：1995-10-23

Applicant: Akihiro Ando ,  Osamu Yamada ,  Ryohei Satoh ,  Takashi Inoue ,  Masahide Okamoto ,  Fumiyuki Kobayashi ,  Toshihiko Ohta ,  Minoru Tanaka

Inventor： Akihiro Ando ,  Osamu Yamada ,  Ryohei Satoh ,  Takashi Inoue ,  Masahide Okamoto ,  Fumiyuki Kobayashi ,  Toshihiko Ohta ,  Minoru Tanaka

IPC: H05K1/09 ,  B23K1/00 ,  H01L23/498 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00 ,  B32B15/00 ,  B23K31/02 ,  H01R9/09

CPC classification number: H01L23/49811 ,  B23K1/0016 ,  H05K1/111 ,  B23K2201/40 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/0376 ,  H05K2201/098 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  Y02P70/611 ,  Y10T428/24926

Abstract: In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.

Abstract translation: 在具有输入/输出引脚接合电极的电子电路装置中，为了显着地改善诸如润湿性和接合强度的接合特性并且大大简化了制造工艺，在形成玻璃陶瓷用于板的电子电路板 材料和布线导体和接合电极，其中Cu的尺寸设置成延伸超过针孔，使得焊料仅与其接触而不是陶瓷电路板。 在使用基板材料的电极上形成覆盖层时，以相同的工序形成布线和接合电极，根据需要在该电极上形成Au或Au-Ni层叠膜，然后使用 焊接如Au-Sn或Au-Ge。

公开(公告)号：US5707000A

公开(公告)日：1998-01-13

申请号：US636252

申请日：1996-04-23

Applicant: David Charles Olson ,  Robert Phillips, III

Inventor： David Charles Olson ,  Robert Phillips, III

IPC: B23K1/018 ,  G01R1/04 ,  G01R31/28 ,  H01L21/60 ,  H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0486 ,  B23K1/018 ,  G01R1/0483 ,  G01R31/2867 ,  H01L24/799 ,  H01L24/98 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/131 ,  H01L2224/75703 ,  H01L2224/7999 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T156/19

Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

公开(公告)号：US5673844A

公开(公告)日：1997-10-07

申请号：US581270

申请日：1995-12-29

Applicant: Richard H. Sargent

Inventor： Richard H. Sargent

IPC: B23K20/02 ,  H01L21/58

CPC classification number: B23K20/028 ,  B23K2201/40

Abstract: A device placement or diebonding head for a diebonding apparatus including a chamber with openings in its end walls, a rod-and-piston combination extending through the chamber with the rod ends protruding through the openings, a gas inlet port into the chamber above or below the piston, and gas pressure resisting means to resist movement of said piston in response to gas pressure. The diebonding head rod has an axial bore therethrough. Its upper end is configured for connection to a vacuum source and its placement end is configured for mounting of a vacuum tool. Thus, force exerted by the rod placement end on a device being diebonded is adjustable by adjusting the gas pressure relative to the resisting means force. The gas inlet may be above or below the piston. The resisting means may be a helical spring in the same or the opposite end of the chamber as the gas inlet. Alternatively, the resisting means may be pressure from gas entering the opposite end of the chamber from the first gas inlet port. A gas inlet into the lower chamber end wall opening may be used to provide an air bearing to prevent binding of the rod within the opening. A diebonding apparatus and a method for adjusting the force exerted by a device placement head on a device being placed on a substrate are also disclosed.

Abstract translation: 一种用于胶粘装置的装置放置或胶粘头，包括在其端壁中具有开口的室，延伸穿过室的杆 - 活塞组合，杆端突出穿过开口，进入到上方或下方的室的气体入口 活塞和气体压力抵抗装置，以抵抗所述活塞响应于气体压力的运动。 胶粘头杆具有穿过其中的轴向孔。 其上端构造成用于连接到真空源，并且其放置端构造成用于安装真空工具。 因此，通过相对于阻力装置的力调节气体压力，可以通过杆放置端施加在待粘合的装置上的力。 气体入口可以在活塞的上方或下方。 抵抗装置可以是与气体入口相同或相反的端部的螺旋弹簧。 或者，抵抗装置可以是从第一气体入口进入到腔的相对端的气体的压力。 可以使用进入下腔室端壁开口的气体入口来提供空气轴承以防止杆在开口内的结合。 还公开了一种用于调节由设备放置头施加在被放置在基板上的装置上的力的粘合装置和方法。

公开(公告)号：US5639014A

公开(公告)日：1997-06-17

申请号：US498538

申请日：1995-07-05

Applicant: David M. Damiano ,  Mark Fery ,  Terry J. Oldham

Inventor： David M. Damiano ,  Mark Fery ,  Terry J. Oldham

IPC: H01L23/04 ,  H01L21/50 ,  B23K31/02

CPC classification number: H01L23/06 ,  H01L23/04 ,  B23K2201/40 ,  H01L2924/0002 ,  H01L2924/01079

Abstract: A method of making an integral solder and plated cover for an electronic package is described which involves applying a corrosion resistant material onto a metal strip and a solderable material on the corrosion resistant material. A solder material is then roll clad over the solderable material after which it is stamped to covers which are then coated with gold.

Abstract translation: 描述了制造用于电子封装的整体焊料和镀覆盖的方法，其涉及将抗腐蚀材料施加到耐腐蚀材料上的金属带和可焊接材料上。 然后将焊料材料卷绕在可焊接材料上，然后将其冲压成盖，然后用金涂覆。

公开(公告)号：US5632630A

公开(公告)日：1997-05-27

申请号：US545163

申请日：1995-10-19

Applicant: Duane F. Card ,  Eberhard S. Dittman ,  Mukund K. Saraiya

Inventor： Duane F. Card ,  Eberhard S. Dittman ,  Mukund K. Saraiya

IPC: B23K1/005 ,  B23K35/26 ,  G02B6/42 ,  H01L31/0203 ,  H05K1/00 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09

CPC classification number: H05K3/3447 ,  B23K1/0056 ,  B23K35/268 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4274 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H01L31/0203 ,  H01R12/62 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/363 ,  B23K2201/40 ,  G02B6/4201 ,  G02B6/4269 ,  H05K1/0393 ,  H05K1/118 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K3/306 ,  H05K3/3468 ,  H05K3/3494 ,  H05K3/366 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the optical sub-assemblies and are substantially smaller than the hole. A soldering bridge comprising several separate tabs equally spaced about the land and which project from the land into the hole and are very flexible in relation to the lead so that the lead can be placed in any radial position within the hole, but regardless of the position of the lead within the hole the projections of the soldering bridge project close enough to the lead so that during wave soldering a joint of desired configuration is produced. The soldering bridge can be integral with the land so that the bridge helps connect the solder to the land allowing the land to be smaller and thus providing for closer spacing between connection holes. More generally, the soldering bridge of the invention is useful for mass soldering of any flexible or rigid circuit board in which leads are to be inserted into substantially larger passages or passages are to be very closely spaced.

Abstract translation: 光学模块包含形成电缆的柔性电路板，其连接在光学模块内的光学子组件和刚性互连结构之间。 电缆包括靠近通孔的焊盘，用于焊接连接到从光学子组件延伸并且基本上小于孔的引线。 一种焊接桥，包括几个单独的突出部，其平行地围绕该平台分隔开并且从该凸台突出到该孔中并且相对于引线非常柔性，使得该引线可以放置在该孔内的任何径向位置，而不管该位置 在孔内的引线内，焊接桥的突出部分足够靠近引线，使得在波峰焊期间产生所需构造的接头。 焊接桥可以与焊盘成一体，使得桥接器有助于将焊料连接到焊盘，从而使焊盘更小，从而在连接孔之间提供更紧密的间隔。 更一般来说，本发明的焊接桥可用于任何柔性或刚性电路板的大规模焊接，其中引线将被插入到基本较大的通道中或通道将非常紧密地间隔开。

公开(公告)号：US5615828A

公开(公告)日：1997-04-01

申请号：US397395

申请日：1995-03-02

Applicant: Bradley N. Stoops

Inventor： Bradley N. Stoops

IPC: B23K1/20 ,  B23K3/08 ,  B23K37/00

CPC classification number: B23K1/203 ,  B23K3/082 ,  B23K2201/40

Abstract: A dispensing apparatus for applying a pulsed thin stream of flux to a surface such as a printed circuit board. The stream of flux is pulsed at a high rate to apply a thin layer of flux on the surface. The dispensing head consists of multiple orifices for applying the flux to the board. The streams of flux are angularly disposed and a pan is positioned for capturing flux which passes by the board. The board is conveyed by the dispensing head. Controls are incorporated for board sensing and identification, application width selection, precise pressure control, fluid flow monitoring and system safety conditions.

Abstract translation: 一种分配装置，用于将脉冲的稀薄流量流施加到诸如印刷电路板的表面。 磁通流以高速脉冲，以在表面上施加薄层的助焊剂。 分配头由用于将焊剂施加到板的多个孔组成。 焊剂流成角度地布置，并且锅定位成用于捕获通过板的通量。 板由分配头传送。 控制装置用于电路板感测和识别，应用宽度选择，精确的压力控制，流体流量监测和系统安全条件。

公开(公告)号：US5598965A

公开(公告)日：1997-02-04

申请号：US333753

申请日：1994-11-03

Applicant: William E. Scheu

Inventor： William E. Scheu

IPC: B23K1/018 ,  B23K3/04

CPC classification number: B23K1/018 ,  B23K2201/40 ,  Y10S269/903

Abstract: A electronic chip removal and replacement system to be used to remove and replace a surface mounted or edge connected electronic chip from a circuit board, the system including a heater assembly having a heater unit which produces a quantity of heat, thereby heating an air flow which passes thereover to produce heated air which exits the heater assembly through an outlet nozzle. The hot air flow is applied to the electronic chip in a specific controlled pattern as directed through a microprocessor which directs a timed and ramped increase and decrease of a temperature of the heater unit in accordance with a specific type of chip being heated. Further, the microprocessor is structured such that it can be disengaged remotely whereby only the heater unit is shut down and not the remainder of the system including the air flow over the heater unit, thereby allowing the heater unit to cool down between uses and facilitating ramped up heating in accordance with a specific ramped heating profile corresponding the specific type of electronic chip being replaced or removed.

Abstract translation: 一种用于从电路板去除和替换表面安装或边缘连接的电子芯片的电子芯片移除和更换系统，该系统包括具有产生一定量的加热器单元的加热器组件，从而加热空气流 通过它们以产生通过出口喷嘴离开加热器组件的加热空气。 热空气流以指定的微处理器以特定的受控模式施加到电子芯片，微处理器根据加热器的特定类型的芯片引导加热器单元的定时和增加的温度升高和降低。 此外，微处理器被构造成使得其可以远程地脱离，从而只有加热器单元被关闭，并且系统的其余部分包括空气流过加热器单元，从而允许加热器单元在使用之间冷却并且促进加速 根据特定的斜坡加热曲线，对应于被替换或去除的特定类型的电子芯片。

公开(公告)号：US5579984A

公开(公告)日：1996-12-03

申请号：US429707

申请日：1995-04-27

Applicant: Toshiaki Sasano

Inventor： Toshiaki Sasano

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/00

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/05553 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/78801 ,  H01L2224/85148 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01082

Abstract: In wire bonding used in manufacturing, for example, semiconductor devices, inputting of the coordinates of the first and second leads of a lead frame, on which a semiconductor chip is installed, into an operation controller makes it possible that the coordinates of all of the remaining leads are automatically calculated by an image processor and the bonding coordinates for such leads are also automatically calculated.

Abstract translation: 在制造中使用的引线接合例如半导体器件中，将安装有半导体芯片的引线框架的第一引线和第二引线的坐标输入到操作控制器中使得可以将所有的 剩余的引线由图像处理器自动计算，并且这些引线的键合坐标也被自动计算。