公开(公告)号：US20180222749A1

公开(公告)日：2018-08-09

申请号：US15885401

申请日：2018-01-31

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00158 ,  B81B3/0005 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  H04R7/10 ,  H04R19/04 ,  H04R2201/003

Abstract: A membrane component comprises a membrane structure comprising an electrically conductive membrane layer. The electrically conductive membrane layer has a suspension region and a membrane region. In addition, the suspension region of the electrically conductive membrane layer is arranged on an insulation layer. Furthermore, the insulation layer is arranged on a carrier substrate. Moreover, the membrane component comprises a counterelectrode structure. A cavity is arranged vertically between the counterelectrode structure and the membrane region of the electrically conductive membrane layer. In addition, an edge of the electrically conductive membrane layer projects laterally beyond an edge of the insulation layer by more than half of a vertical distance between the electrically conductive membrane layer and the counterelectrode structure.

公开(公告)号：US20180202882A1

公开(公告)日：2018-07-19

申请号：US15921504

申请日：2018-03-14

Applicant: InvenSense, Inc.

Inventor： Johannes Schumm ,  Andreas Reinhard ,  Thomas Kraehenbuehl ,  Stefan Thiele ,  Rene Hummel ,  Chung-Hsien Lin ,  Wang Shen Su ,  Tsung Lin Tang ,  Chia Min Lin

IPC: G01L9/00 ,  H01L29/84 ,  B81C1/00

CPC classification number: G01L9/0042 ,  B81B3/0089 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81C1/00285 ,  G01L9/0045 ,  G01L9/0073 ,  H01L29/84

Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.

公开(公告)号：US20180194618A1

公开(公告)日：2018-07-12

申请号：US15910647

申请日：2018-03-02

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Kai-Fung Chang ,  Len-Yi Leu ,  Lien-Yao Tsai

IPC: B81C1/00 ,  B81B7/02 ,  B81B3/00 ,  H01L23/48 ,  H01L21/768 ,  G01L9/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/09 ,  B81C2203/0109 ,  B81C2203/0172 ,  G01L9/0042 ,  G01L9/0073 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/80805 ,  H01L2224/81805

Abstract: A MEMS device and methods of forming are provided. A dielectric layer of a first substrate is patterned to expose conductive features and a bottom layer through the dielectric layer. A first surface of a second substrate is bonded to the dielectric layer and the second substrate is patterned to form a membrane and a movable element. A cap wafer is bonded to the second substrate, where bonding the cap wafer to the second substrate forms a first sealed cavity comprising the movable element and a second sealed cavity that is partially bounded by the membrane. Portions of the cap wafer are removed to expose the second sealed cavity to ambient pressure.

公开(公告)号：US20180188127A1

公开(公告)日：2018-07-05

申请号：US15736436

申请日：2016-06-14

Applicant: Teknologian Tutkimuskeskus VTT Oy

Inventor： Vladimir ERMOLOV ,  Jaakko SAARILAHTI

IPC: G01L9/00 ,  B81B3/00 ,  B81C1/00 ,  G01L19/06

CPC classification number: G01L9/0047 ,  B81B3/0051 ,  B81B2201/0264 ,  B81C1/00182 ,  G01L9/0042 ,  G01L9/0073 ,  G01L19/0618

Abstract: According to an example aspect of the present invention, there is provided a MEMS capacitive pressure sensor (1), comprising a first electrode (17), a deformable second electrode (18) being electrically insulated from the first electrode (17) by means of a chamber (4) between the first electrode (17) and the second electrode (18), and wherein at least one of the first electrode (17) and the second electrode (18) includes at least one pedestal (5) protruding into the chamber (4). According to another example aspect of the present invention, there is also provided a method for manufacturing a MEMS capacitive pressure sensor (1).

公开(公告)号：US20180162723A1

公开(公告)日：2018-06-14

申请号：US15737389

申请日：2016-08-03

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Munenori DEGAWA ,  Hiroshi KIKUCHI

IPC: B81B7/02 ,  G01C19/5747 ,  G01C19/5783 ,  G01L9/12 ,  G01P15/08 ,  G01P15/125 ,  G01P15/18

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0109 ,  B81B2203/04 ,  B81B2203/051 ,  B81B2207/015 ,  B81B2207/07 ,  G01C19/5747 ,  G01C19/5783 ,  G01D21/02 ,  G01L9/0052 ,  G01L9/12 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814

Abstract: Provided is an inertia sensor that can be reduced in size. An inertia sensor having layers 1a, 2a in which detection parts 20, 30 are formed, the inertial sensor being a laminated structure obtained by laminating two or more of the layers.

公开(公告)号：US20180162722A1

公开(公告)日：2018-06-14

申请号：US15372565

申请日：2016-12-08

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B7/0061 ,  B81B2201/0264 ,  B81C1/00325

Abstract: Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

公开(公告)号：US09994439B2

公开(公告)日：2018-06-12

申请号：US15417674

申请日：2017-01-27

Applicant: Seiko Epson Corporation

Inventor： Yusuke Matsuzawa ,  Takuya Kinugawa

IPC: B81B3/00 ,  G01C5/06 ,  G01L9/00

CPC classification number: B81B3/001 ,  B81B2201/0264 ,  B81B2207/015 ,  B81C2203/0728 ,  G01C5/06 ,  G01L9/0054

Abstract: A pressure sensor has a substrate having a diaphragm, a cavity portion that is positioned on one side of the diaphragm, and a ceiling portion that is disposed opposite to the diaphragm via the cavity portion, and unevenness is formed on a surface of the substrate facing the cavity portion. In addition, the unevenness has a plurality of recessed portions.

公开(公告)号：US20180124521A1

公开(公告)日：2018-05-03

申请号：US15629518

申请日：2017-06-21

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Domenico GIUSTI ,  Sebastiano CONTI

IPC: H04R17/02 ,  B81C1/00 ,  B81B3/00 ,  H01L41/113 ,  H01L41/312 ,  H01L41/04 ,  H04R31/00

CPC classification number: H04R17/02 ,  B81B3/0037 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/012 ,  B81C1/00158 ,  G01L9/0042 ,  G01L9/0073 ,  H01L41/042 ,  H01L41/1132 ,  H01L41/1138 ,  H01L41/312 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003

Abstract: A MEMS sensor, in particular a microphone, of a piezoelectric type, formed in a membrane of semiconductor material accommodating a compliant portion, which extends from a first surface to a second surface of the membrane. The compliant portion has a Young's modulus lower than the rest of the membrane. A sensitive region having piezoelectric material extends on the first surface, over the compliant portion and is fixed at its ends to the membrane on opposite sides of the compliant portion. A third area of the membrane, arranged between the compliant portion and the second surface, forms a hinge element.

公开(公告)号：US09957156B2

公开(公告)日：2018-05-01

申请号：US15080356

申请日：2016-03-24

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Ming Chen ,  Ping-Yin Liu ,  Chung-Yi Yu ,  Yeur-Luen Tu

IPC: H01L29/84 ,  B81B7/00 ,  B81C1/00 ,  H01L23/00

CPC classification number: B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/052 ,  B81C1/00269 ,  B81C1/00357 ,  B81C2201/013 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/036 ,  H01L24/03 ,  H01L24/09 ,  H01L2224/02163 ,  H01L2224/05082 ,  H01L2224/05109 ,  H01L2224/05117 ,  H01L2224/05124 ,  H01L2224/05138 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/1461

Abstract: An embodiment method includes forming a first plurality of bond pads on a device substrate, depositing a spacer layer over and extending along sidewalls of the first plurality of bond pads, and etching the spacer layer to remove lateral portions of the spacer layer and form spacers on sidewalls of the first plurality of bond pads. The method further includes bonding a cap substrate including a second plurality of bond pads to the device substrate by bonding the first plurality of bond pads to the second plurality of bond pads.

公开(公告)号：US20180105417A1

公开(公告)日：2018-04-19

申请号：US15782758

申请日：2017-10-12

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Michael J. SEDDON

IPC: B81B7/00 ,  G01L9/00 ,  G01L9/06 ,  G01L13/02 ,  B81B3/00

CPC classification number: B81B7/008 ,  B81B3/0021 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00246 ,  G01L9/0048 ,  G01L9/0052 ,  G01L9/0054 ,  G01L9/0055 ,  G01L9/06 ,  G01L13/025 ,  G01L19/0069

Abstract: Implementations of absolute pressure sensor devices may include a microelectromechanical system (MEMS) absolute pressure sensor coupled over a controller die. The MEMS absolute pressure sensor may be mechanically coupled to the controller die and may also be configured to electrically couple with the controller die. A perimeter of the controller die may be one of the same size and larger than a perimeter of the MEMS absolute pressure sensor. The controller die may be configured to electrically couple with a module through an electrical connector.