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    FUNCTIONAL DEVICE AND METHOD OF MANUFACTURING THE SAME
    35.
    发明申请
    FUNCTIONAL DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    功能装置及其制造方法

    公开(公告)号：US20150290641A1

    公开(公告)日：2015-10-15

    申请号：US14432068

    申请日：2013-09-27

    Applicant: Japan Science and Technology Agency

    Inventor： Takehiko Kitamori ,  Kazuma Mawatari

    IPC: B01L3/00 ,  B29C65/00

    CPC classification number: B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0896 ,  B01L2300/12 ,  B01L2300/161 ,  B01L2400/0415 ,  B29C65/002 ,  B29L2031/7562 ,  B81B2201/058 ,  B81C1/00119

    Abstract: A functional device (and a functional device manufacturing method) includes a first substrate in which a groove is formed in one surface, a second substrate which is integrally disposed by bonding one surface of the second substrate to the one surface of the first substrate, and forms a flow path together with the groove of the first substrate, at least one modification object of a capture body which captures a target substance supplied into the flow path, an electrode which imparts an electrical or a chemical action to the target substance, and a catalyst, in which the modification object is disposed by being modified on a part of an inner surface of the flow path, a bonding portion between the one surface of the first substrate and the one surface of the second substrate is formed by bonding fluorine to silica.

    Abstract translation: 功能元件（功能元件的制造方法）包括在一个面上形成有槽的第一基板，通过将第二基板的一个表面粘合到第一基板的一个表面而一体地设置的第二基板，以及 与第一基板的凹槽一起形成流路，捕获体的至少一个修改对象，其捕获供给到流路中的目标物质，向目标物质施加电或化学作用的电极，以及 催化剂，其中通过在所述流路的内表面的一部分上被改性而设置所述改性对象，所述第一基板的所述一个表面与所述第二基板的所述一个表面之间的接合部分通过将氟结合到二氧化硅上而形成 。

    SYSTEM AND METHODS FOR ACTUATION USING ELECTRO-OSMOSIS
    38.
    发明申请
    SYSTEM AND METHODS FOR ACTUATION USING ELECTRO-OSMOSIS 有权
    使用电致病毒作用的系统和方法

    公开(公告)号：US20150210534A1

    公开(公告)日：2015-07-30

    申请号：US14422654

    申请日：2013-08-20

    Applicant: CORNELL UNIVERSITY

    Inventor： Robert MacCurdy ,  Hod Lipson

    IPC: B81B3/00 ,  B01L3/00 ,  B81B5/00

    CPC classification number: B81B3/0021 ,  B01D61/427 ,  B01L3/502746 ,  B81B5/00 ,  B81B2201/0214 ,  B81B2201/058 ,  B81B2203/04 ,  B81B2203/06 ,  F25B41/02

    Abstract: The invention exploits a widely used device in micro-fluidics, the electro-osmotic pump (EOP), to create very low energy micro-scale and macro-scale mechanical actuators. The EOP uses electrical fields to move naturally occurring charged particles (ions) through a fluid medium. As the ions move in response to the applied field, they drag the (non-charged) fluid along, establishing bulk flow. When confined to a narrow chamber, a pressure gradient can be established. The combination of pressure gradient and flow performs mechanical work. With the use of electro-osmotic pumps, the invention enables actuators to be constructed in a variety of embodiments, including for example, a sheet structure, a piston structure, and a cellular structure to name a few.

    Abstract translation: 本发明利用了广泛使用的微流体学设备，即电渗泵（EOP），以创建极低能量的微尺度和宏观尺度的机械致动器。 EOP使用电场来移动天然存在的带电粒子（离子）通过流体介质。 当离子响应于所施加的场移动时，它们沿着沿着（非带电）的流体拖动，建立大量流动。 当限制在狭窄的室中时，可以建立压力梯度。 压力梯度和流量的组合执行机械作业。 通过使用电渗透泵，本发明使致动器能够以各种实施例构造，例如，薄片结构，活塞结构和细胞结构等等。

    Method for plugging a hole
    39.
    发明授权
    Method for plugging a hole 有权
    堵塞孔的方法

    公开(公告)号：US09027239B2

    公开(公告)日：2015-05-12

    申请号：US13511486

    申请日：2010-12-17

    Applicant: Andreas Fischer ,  Göran Stemme ,  Frank Niklaus ,  Niklas Roxhed

    Inventor： Andreas Fischer ,  Göran Stemme ,  Frank Niklaus ,  Niklas Roxhed

    IPC: H01R9/00 ,  H05K3/00 ,  B81C1/00 ,  B01L3/00

    CPC classification number: B81C1/00293 ,  B01L3/502707 ,  B01L2300/042 ,  B81B2201/058 ,  B81B2203/0315 ,  B81C2201/019 ,  B81C2203/0145 ,  Y10T29/49117 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49826 ,  Y10T29/49885

    Abstract: A method for at least partially inserting a plug into a hole, said method comprising the steps of a) providing a at least one substrate with at least one hole wherein said at least one hole has a largest dimension of from 1 μm to 300 μm, b) providing a piece of material, wherein said piece of material has a larger dimension than said at least one hole, c) pressing said piece of material against the hole with a tool so that a plug is formed, wherein at least a part of said piece of material is pressed into said hole, d) removing the tool from the piece of material. There is further disclosed a plugged hole manufactured with the method. One advantage of an embodiment is that an industrially available wire bonding technology can be used to seal various cavities. The existing wire bonding technology makes the plugging fast and cheap.

    Abstract translation: 一种用于至少部分地将插头插入孔中的方法，所述方法包括以下步骤：a）提供具有至少一个孔的至少一个基底，其中所述至少一个孔具有1μm至300μm的最大尺寸， b）提供一块材料，其中所述材料片具有比所述至少一个孔更大的尺寸，c）用工具将所述材料件压靠在孔上，从而形成插塞，其中至少部分 所述材料被压入所述孔中，d）从所述材料上移除所述工具。 还公开了一种使用该方法制造的堵塞孔。 一个实施例的一个优点是可以使用工业上可用的引线接合技术来密封各种空腔。 现有的导线接合技术使堵塞快速便宜。

    MEMS package
    40.
    发明授权
    MEMS package 有权
    MEMS封装

    公开(公告)号：US09012255B1

    公开(公告)日：2015-04-21

    申请号：US14060716

    申请日：2013-10-23

    Applicant: DunAn Microstaq, Inc.

    Inventor： Parthiban Arunasalam ,  Joe Albert Ojeda, Sr.

    IPC: H01L21/00 ,  B81C1/00 ,  H01L29/00 ,  B01L3/00

    CPC classification number: B81C1/00309 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/027 ,  B81B2201/058 ,  B81C2203/0163

    Abstract: A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.

    Abstract translation: MEMS封装的制造方法包括：首先提供由第一材料形成并在其中限定孔的衬底。 孔基本上完全衬有与第一材料不同的第二材料。 具有形成在其中的流体通道的微加工部件固定到基底上，使得孔和流体通道流体连通。

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