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公开(公告)号:US20240279048A1
公开(公告)日:2024-08-22
申请号:US18568850
申请日:2022-06-15
Applicant: Water Stuff & Sun GmbH
Inventor: Johan BEJHED
CPC classification number: B81B1/006 , F16K99/0015 , G05D7/005 , B81B2201/054 , B81B2201/058 , B81B2201/10 , B81B2203/0338 , B81B2207/03 , F16K2099/008
Abstract: A fluid-control device comprises a stack of wafers in which flow components are provided as micro-electro-mechanical systems—MEMS. The flow components are selected from fluid-control components and/or fluid-monitor components. The fluid-control device has a first flow component that is encircled, in a main plane of the stack of wafers, by a second flow component.
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公开(公告)号:US20180186627A1
公开(公告)日:2018-07-05
申请号:US15857461
申请日:2017-12-28
Applicant: Intel IP Corporation
Inventor: Gerald Ofner , Thorsten Meyer , Reinhard Mahnkopf , Christian Geissler , Andreas Augustin
CPC classification number: B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.
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公开(公告)号:US10005659B2
公开(公告)日:2018-06-26
申请号:US15440962
申请日:2017-02-23
Applicant: Infineon Technologies AG
Inventor: Thomas Grille , Ursula Hedenig , Michael Roesner , Gudrun Stranzl , Martin Zgaga
CPC classification number: B81B7/0061 , B01D67/0034 , B81B2201/0257 , B81B2201/10 , B81C1/00904 , B81C2201/0132 , Y10T428/24273
Abstract: A hole plate and a MEMS microphone arrangement are disclosed. In an embodiment a hole plate includes a substrate with a first main surface, a second main surface, and a lateral surface and a perforation structure formed within the substrate, the perforation structure having a plurality of through-holes through the substrate, wherein the through-holes and the lateral surface are a result of a simultaneous dry etching step.
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公开(公告)号:US09663353B2
公开(公告)日:2017-05-30
申请号:US14403571
申请日:2013-06-28
Applicant: Intel IP Corporation
Inventor: Gerald Ofner , Thorsten Meyer , Reinhard Mahnkopf , Christian Geissler , Andreas Augustin
CPC classification number: B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.
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公开(公告)号:US20080152892A1
公开(公告)日:2008-06-26
申请号:US12033235
申请日:2008-02-19
Applicant: Johannes Edlinger , Claus Heine-Kempkens , Othmar Zuger
Inventor: Johannes Edlinger , Claus Heine-Kempkens , Othmar Zuger
IPC: B32B3/26
CPC classification number: G02B1/118 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B5/1809 , G02B5/1847 , G02B5/3058 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: Methods for filtering particles from a fluid are disclosed, wherein an array of microstructures defining respective microchannels having respective minimum widths are used to separate the fluid from particles to be filtered. The fluid flows through the minimum widths into the microchannels defined between adjacent microstructures. The particles to be filtered are prevented from passing through the respective minimum widths, resulting in filtration of those particles from the fluid. The microchannels can be provided with gradient characteristics to separate particles in the fluid according to size.
Abstract translation: 公开了用于从流体中过滤颗粒的方法,其中使用限定具有相应最小宽度的相应微通道的微结构阵列来将流体与要过滤的颗粒分离。 流体流过最小宽度进入相邻微结构之间限定的微通道。 要防止过滤的颗粒通过相应的最小宽度,导致这些颗粒从流体中过滤。 微通道可以具有梯度特性以根据尺寸分离流体中的颗粒。
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公开(公告)号:US20050208211A1
公开(公告)日:2005-09-22
申请号:US11104186
申请日:2005-04-12
Applicant: Johannes Edlinger , Claus Heine-Kemkens , Othmar Zuger
Inventor: Johannes Edlinger , Claus Heine-Kemkens , Othmar Zuger
IPC: B01D21/00 , B01D39/20 , B01L3/00 , B81B1/00 , C23C14/04 , G02B5/18 , G02B5/30 , G02B6/12 , B05D5/06
CPC classification number: G02B1/118 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B5/1809 , G02B5/1847 , G02B5/3058 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: An optical component or an analytical platform includes a substrate, an array of microstructures on the substrate and microchannels formed by side walls of adjacent microstructures, a width of the microchannels varies as a function of distance to the substrate, the width continuously decreasing with increasing distance from the substrate within at least one distance-interval. In a method for producing such a component or such a platform a substrate with an array of surface microstructures is coated in a vapor treatment in such a way that shadowing effects of the coating mechanism narrow at least partially a width of the upper parts of side walls of the microstructures thereby forming at least partially embedded microchannels.
Abstract translation: 光学部件或分析平台包括基板,基板上的微结构阵列和由相邻微结构的侧壁形成的微通道,微通道的宽度随着距衬底的距离而变化,宽度随着距离的增加而连续减小 在至少一个距离间隔内的衬底。 在用于制造这种部件或这种平台的方法中,具有表面微结构阵列的基板以蒸气处理方式被涂覆,使得涂覆机构的遮蔽效应至少部分地缩小了侧壁上部的宽度 从而形成至少部分嵌入的微通道。
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公开(公告)号:US06780786B2
公开(公告)日:2004-08-24
申请号:US09994280
申请日:2001-11-26
Applicant: George M. Dougherty
Inventor: George M. Dougherty
IPC: H01L2131
CPC classification number: B81C1/00158 , B01D67/0072 , B01D71/02 , B01D2323/10 , B01D2325/02 , B01D2325/04 , B81B2201/10 , B81C2201/0115 , B81C2201/017 , H01L21/28525 , H01L29/16
Abstract: A membrane structure comprising a silicon film having a grain structure including grains defining pores therebetween.
Abstract translation: 一种膜结构,其包括具有晶粒结构的硅膜,所述晶粒结构包括在其间限定孔的颗
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公开(公告)号:US20030100136A1
公开(公告)日:2003-05-29
申请号:US09994280
申请日:2001-11-26
Inventor: George M. Dougherty
IPC: H01L021/00 , H01L021/44 , H01L029/82
CPC classification number: B81C1/00158 , B01D67/0072 , B01D71/02 , B01D2323/10 , B01D2325/02 , B01D2325/04 , B81B2201/10 , B81C2201/0115 , B81C2201/017 , H01L21/28525 , H01L29/16
Abstract: A membrane structure comprising a silicon film having a grain structure including grains defining pores therebetween.
Abstract translation: 一种膜结构,其包括具有晶粒结构的硅膜,所述晶粒结构包括在其间限定孔的颗
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公开(公告)号:US5985164A
公开(公告)日:1999-11-16
申请号:US950952
申请日:1997-10-15
Applicant: Wen-Hua Chu , Mauro Ferrari
Inventor: Wen-Hua Chu , Mauro Ferrari
IPC: B01D39/20 , B01D67/00 , B01D69/02 , B01D69/12 , B01D71/02 , B81B1/00 , B81C1/00 , C23C16/01 , G03F7/00 , B32B31/00 , B01D71/04 , C19K13/00
CPC classification number: B81C1/00246 , B01D39/20 , B01D67/0058 , B01D67/0062 , B01D67/0072 , B01D69/02 , B01D69/12 , B01D71/02 , B81B3/007 , C23C16/01 , G03F7/0015 , B01D2325/04 , B81B2201/10 , B81C2201/014 , B81C2201/032 , B81C2203/0728 , B81C2203/075
Abstract: Surface micromachining and bulk micromachining are employed for realizing a porous membrane with bulk support for a microparticle filter. The filter is manufactured by a process employing a thin film etch-stop, in which the bulk substrate is etched using a first etching process followed by etching of the etch stop and of material within pores of a filter layer using a second etching process. The filter is sufficiently sturdy to allow for easy handling. It may be used as a diffusion barrier and under high pressures. The disclosed fabrication method is simple, reliable, and integrated-circuit compatible, and thus amenable to mass production. Electronic circuitry may be integrated on the filter surface, as may be desired for several purposes, such as fluid characterization, filter self-cleaning, or charging of the filter surfaces. Methods are shown for the realization of biological containment capsules based on this microfilter.
Abstract translation: 采用表面微机械加工和体积微加工技术来实现具有大量支撑微孔过滤器的多孔膜。 该过滤器是通过使用薄膜蚀刻停止的工艺制造的,其中使用第一蚀刻工艺蚀刻大块衬底,然后使用第二蚀刻工艺蚀刻蚀刻停止层和过滤层的孔内的材料。 过滤器足够坚固以便于处理。 它可以用作扩散屏障并在高压下使用。 所公开的制造方法简单,可靠,并且集成电路兼容,因此适合批量生产。 电子电路可以集成在过滤器表面上,如可能需要多种目的,例如流体表征,过滤器自清洁或过滤表面的充电。 显示了基于该微型过滤器实现生物遏制胶囊的方法。
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公开(公告)号:US5798042A
公开(公告)日:1998-08-25
申请号:US663644
申请日:1996-06-14
Applicant: Wen-Hwa Chu , Mauro Ferrari
Inventor: Wen-Hwa Chu , Mauro Ferrari
IPC: A61K9/00 , A61K9/22 , A61K9/50 , A61K9/52 , B01D39/16 , B01D39/20 , B01D67/00 , B01D69/02 , B01D69/12 , B01D71/02 , B01J13/02 , B81B1/00 , B81C1/00 , C04B41/45 , C23C16/01 , G03F7/00 , B01D69/10
CPC classification number: G03F7/0015 , A61K9/0024 , A61K9/0097 , B01D39/1692 , B01D39/20 , B01D67/0058 , B01D67/0062 , B01D67/0072 , B01D67/0083 , B01D69/02 , B01D69/12 , B01D71/02 , B01J13/02 , B81B3/007 , B81C1/00087 , B81C1/00246 , C04B41/4582 , C23C16/01 , G03F7/00 , B01D2323/08 , B01D2323/10 , B01D2325/02 , B01D2325/04 , B81B2201/10 , B81C2201/014 , B81C2201/032 , B81C2203/0728 , B81C2203/075
Abstract: Microfabricated filters utilizing a bulk substrate structure and a thin film structure and a method for constructing such filters. The pores of the filters are defined by spaces between the bulk substrate structure and the thin film structure and are of substantially uniform width, length and distribution. The width of the pores is defined by the thickness of a sacrificial layer and therefore may be smaller than the limit of resolution obtainable with photolithography. The filters provide enhanced mechanical strength, chemical inertness, biological compatibility, and throughput. The filters are constructed using relatively simple fabrication techniques. Also, microfabricated containment wells and capsules constructed with such filters for the immunological isolation of cell transplants and a method for constructing such containment wells and capsules. The pores of the wells and capsules are large enough to let a desired biologically-active molecular product through, while blocking the passage of all larger immunological molecules. The containment wells and capsules provide enhanced biological compatibility and useful life.
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