公开(公告)号：US20130048336A1

公开(公告)日：2013-02-28

申请号：US13589287

申请日：2012-08-20

Applicant: Ranjit MALIK

Inventor： Ranjit MALIK

IPC: H01B7/28 ,  B32B15/08 ,  C09J7/02 ,  H01L31/18 ,  H01L51/48

CPC classification number: H01L31/0512 ,  C09D5/084 ,  C09D5/086 ,  C09J7/28 ,  C09J7/29 ,  C09J9/02 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2203/322 ,  Y02E10/50 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/2804 ,  Y10T428/2848

Abstract: A tape is disclosed. The tape includes a metallic foil, an adhesive layer laminated on one surface of the metallic foil and a protective polymeric coating laminated on an opposing second surface of the metallic foil. The protective coating comprises an anti-corrosion agent. The protective coating shields the metallic foil from corrosion and other drawbacks that can occur by environmental exposure. The tape readily can be employed as a busbar tape in photovoltaic cells to provide a cost-effective substitute for the tin-coated copper currently used there.

Abstract translation: 公开了一种胶带。 胶带包括金属箔，层压在金属箔的一个表面上的粘合剂层和层压在金属箔的相对的第二表面上的保护性聚合物涂层。 保护涂层包括防腐蚀剂。 保护涂层可以防止金属箔受到环境暴露的腐蚀和其他缺点。 胶带易于用作光伏电池中的母线带，为目前在那里使用的镀锡铜提供了经济有效的替代品。

公开(公告)号：US20120214010A1

公开(公告)日：2012-08-23

申请号：US13503855

申请日：2010-10-27

Applicant: Tomohiro Kagimoto ,  Toshiaki Chuma

Inventor： Tomohiro Kagimoto ,  Toshiaki Chuma

IPC: B32B15/08 ,  B23K1/20 ,  B32B15/082

CPC classification number: H01L24/29 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2479/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83205 ,  H01L2224/83222 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0405 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T428/31678 ,  Y10T428/31699 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The present invention provides a conductive connecting material having a multilayered structure comprising a resin composition (A) and a metal foil (B) selected from a solder foil or a tin foil, wherein the volume ratio ((A)/(B)) of the resin composition (A) and the metal foil (B) selected from a solder foil or a tin foil in the conductive connecting material is 1-40 or 20-500, as well as a method for connecting terminals using the conductive connecting material. The conductive connecting material of the present invention is preferably used for electrically connecting electronic members in an electrical or electronic component.

Abstract translation: 本发明提供一种具有多层结构的导电连接材料，其包含树脂组合物（A）和选自焊锡箔或锡箔的金属箔（B），其中体积比（（A）/（B）） 在导电连接材料中，选自焊锡箔或锡箔中的树脂组合物（A）和金属箔（B）为1-40或20-500，以及使用导电连接材料连接端子的方法。 本发明的导电连接材料优选用于将电子部件或电子部件中的电子部件电连接。

公开(公告)号：US20120202055A1

公开(公告)日：2012-08-09

申请号：US13362097

申请日：2012-01-31

Applicant: Kenichi KATAOKA ,  Natsuki UKEI ,  Hiromoto HARUTA ,  Kenjiro NIIMI ,  Tatsumi AMANO

Inventor： Kenichi KATAOKA ,  Natsuki UKEI ,  Hiromoto HARUTA ,  Kenjiro NIIMI ,  Tatsumi AMANO

IPC: B32B3/00

CPC classification number: C09J9/02 ,  C08K3/017 ,  C08K3/105 ,  C08K5/34924 ,  C08K5/43 ,  C09J7/29 ,  C09J2201/602 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2433/006 ,  Y10T428/265

Abstract: A pressure-sensitive adhesive sheet 1 provided by the present invention is provided with a substrate film 12 comprising a transparent resin material, an antistatic layer 14 provided on a first side 12A thereof, and a pressure-sensitive adhesive layer 20 provided on a second side 12B thereof. The antistatic layer 14 contains an antistatic component (for example, an electroconductive polymer) and a binder resin, and has an average thickness Dave of 1 nm to less than 100 nm. The pressure-sensitive adhesive layer 20 contains an acrylic polymer as a base polymer and an ionic compound (such as an ionic liquid and alkaline metal salt) as an antistatic component.

Abstract translation: 由本发明提供的压敏粘合片1设置有包括透明树脂材料的基底膜12，设置在其第一侧12A上的抗静电层14和设置在第二侧上的压敏粘合剂层20 12B。 抗静电层14含有抗静电成分（例如导电性聚合物）和粘合剂树脂，平均厚度Dave为1nm以上且小于100nm。 压敏粘合剂层20含有作为基础聚合物的丙烯酸类聚合物和作为抗静电成分的离子性化合物（例如离子液体和碱金属盐）。

公开(公告)号：US20110214735A1

公开(公告)日：2011-09-08

申请号：US13125497

申请日：2009-11-02

Applicant: David V. Mahoney ,  Mitchell T. Huang ,  Richard D. Twigg

Inventor： David V. Mahoney ,  Mitchell T. Huang ,  Richard D. Twigg

IPC: H01L31/0216 ,  B32B3/10 ,  B32B3/28 ,  B32B7/12 ,  B32B5/16 ,  H01L31/02 ,  H01L31/18 ,  B32B37/12

CPC classification number: C09J11/04 ,  C08K7/18 ,  C08K9/02 ,  C09J7/28 ,  C09J7/29 ,  C09J9/02 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2205/102 ,  C09J2433/00 ,  H01L31/022425 ,  Y10T428/12361 ,  Y10T428/24331 ,  Y10T428/24628 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2848

Abstract: Provided are conductive laminated assemblies and conductive assembly tapes that are used thereon. The conductive laminated assemblies include a conductive foil, a pressure sensitive adhesive, a conductive element as a part of the foil or in the pressure sensitive adhesive and a conductive substrate. The conductive substrate can be a photovoltaic or solar cell.

Abstract translation: 提供在其上使用的导电层压组件和导电组装带。 导电层叠组件包括导电箔，压敏粘合剂，作为箔的一部分的导电元件或压敏粘合剂中的导电元件和导电基底。 导电衬底可以是光伏或太阳能电池。

公开(公告)号：US20100288328A1

公开(公告)日：2010-11-18

申请号：US12680263

申请日：2008-09-25

Applicant: Naoki Fukushima ,  Isao Tsukagoshi

Inventor： Naoki Fukushima ,  Isao Tsukagoshi

IPC: H01L31/042 ,  H01B5/00 ,  B32B37/24

CPC classification number: H01L31/022433 ,  C09J7/28 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2203/322 ,  H01L31/0508 ,  H01L31/0512 ,  H01R4/04 ,  H01R12/62 ,  Y02E10/50 ,  Y10T156/1002

Abstract: The conductor-connecting member of the invention is a conductor-connecting member comprising an adhesive layer 3 formed on at least one surface of a metal foil 1, wherein the metal foil 1 comprises a plurality of projections 2 of substantially equal height integrated with the metal foil 1, on the surface on which the adhesive layer 3 is formed, and the adhesive layer 3 fills in the projections 2 so that the surface formed on the side opposite the metal foil 1 is essentially smooth.

Abstract translation: 本发明的导体连接构件是导体连接构件，其包括形成在金属箔1的至少一个表面上的粘合剂层3，其中金属箔1包括与金属一体化的基本相等高度的多个突起2 箔1，在其上形成有粘合剂层3的表面上，并且粘合剂层3填充在突起2中，使得形成在与金属箔1相对的一侧上的表面基本上是平滑的。

公开(公告)号：US20100189952A1

公开(公告)日：2010-07-29

申请号：US12751558

申请日：2010-03-31

Applicant: Daniel P. Segall ,  Iris E. Hilton ,  Melissa E. Szymanski ,  John R. Pennace

Inventor： Daniel P. Segall ,  Iris E. Hilton ,  Melissa E. Szymanski ,  John R. Pennace

IPC: B32B27/18 ,  H01B1/12 ,  B32B27/30 ,  B32B7/00

CPC classification number: C08K5/19 ,  C08K5/42 ,  C08L33/00 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/06 ,  C09J2201/602 ,  C09J2433/00 ,  Y10T428/24008 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2891

Abstract: A biomedical sensor is disclosed that includes a conductive material for coupling to monitoring equipment, and a composite. The composite includes a polymeric material and a polar material that is substantially dispersed within the polymeric material. The composite has a first side that is coupled to the conductive material and has a second side that is positionable with respect to a subject to be monitored. The polar material exhibits molecular compatibility with the polymeric material such that the polar material neither blooms to a surface of the polymeric material nor crystallizes within the polymeric material.

Abstract translation: 公开了一种生物医学传感器，其包括用于耦合到监测设备的导电材料和复合材料。 复合材料包括聚合物材料和基本上分散在聚合材料内的极性材料。 复合材料具有耦合到导电材料的第一侧，并且具有可相对于待监测对象定位的第二侧。 极性材料表现出与聚合物材料的分子相容性，使得极性材料既不会聚合到聚合物材料的表面也不在聚合物材料内结晶。

公开(公告)号：US07754790B2

公开(公告)日：2010-07-13

申请号：US12010172

申请日：2008-01-22

Applicant: Masao Saito ,  Osamu Takamatsu ,  Takayuku Matsushima

Inventor： Masao Saito ,  Osamu Takamatsu ,  Takayuku Matsushima

IPC: B32B7/10 ,  C08K9/02 ,  C08L63/10

CPC classification number: H05K3/323 ,  C08F290/062 ,  C08L71/12 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/02 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/08 ,  C09J133/068 ,  C09J163/10 ,  C09J2201/602 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K2201/0239 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/31935 ,  C08F220/32 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract translation: 提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。 本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

公开(公告)号：US20100116314A1

公开(公告)日：2010-05-13

申请号：US12615251

申请日：2009-11-09

Applicant: Naoki FUKUSHIMA ,  Isao TSUKAGOSHI ,  Takehiro SHIMIZU

Inventor： Naoki FUKUSHIMA ,  Isao TSUKAGOSHI ,  Takehiro SHIMIZU

IPC: H01L31/042 ,  H01B5/00

CPC classification number: H01L31/18 ,  C08K7/18 ,  C09J7/28 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2205/102 ,  H01L31/022425 ,  H01L31/0512 ,  Y02E10/50

Abstract: The electric conductor connecting member of this invention comprises a metal foil having a roughened surface on at least one main side, and an adhesive layer formed on the roughened surface of the metal foil.

Abstract translation: 本发明的导电体连接构件包括在至少一个主面上具有粗糙表面的金属箔和形成在金属箔的粗糙表面上的粘合层。

公开(公告)号：US20090169852A1

公开(公告)日：2009-07-02

申请号：US12304474

申请日：2007-06-28

Applicant: Jeongwan Choi ,  Un Nyoung Sa

Inventor： Jeongwan Choi ,  Un Nyoung Sa

IPC: C09J7/02 ,  H01B5/00 ,  H01B1/12 ,  H01B1/22

CPC classification number: C09J9/02 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/602 ,  C09J2433/00 ,  Y10T442/10

Abstract: Disclosed is an electroconductive adhesive tape having different adhesion values on both surfaces thereof. A method for producing the same is also disclosed. The adhesive tape has different adhesion values on both surfaces thereof, elasticity, and electroconductivity along the longitudinal direction as well as the transverse direction. Thus, the adhesive tape can be used in electronic components, as an electromagnetic wave-shielding tape that permits easy attachment/detachment.

Abstract translation: 公开了在其两个表面上具有不同粘附值的导电胶带。 也公开了其制造方法。 粘合带在其两个表面上具有不同的附着值，沿着纵向和横向都具有弹性和导电性。 因此，胶带可以用作电子部件，作为允许容易的安装/拆卸的电磁波屏蔽带。

公开(公告)号：US20080166543A1

公开(公告)日：2008-07-10

申请号：US11941498

申请日：2007-11-16

Applicant: Qizhuo Zhuo

Inventor： Qizhuo Zhuo

IPC: H01L21/00 ,  B32B5/16

CPC classification number: C09J5/06 ,  C09J9/02 ,  C09J2201/602 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260 ° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.

Abstract translation: 用于涂覆半导体晶片的导电组合物包括具有小于2微米的平均粒度和小于10微米的最大粒度的导电填料，第一树脂的软化点在80-260℃之间，溶剂 ，固化剂和第二树脂，其中在室温下第一树脂基本上可溶于溶剂。