公开(公告)号：US20190215947A1

公开(公告)日：2019-07-11

申请号：US16118454

申请日：2018-08-31

Applicant: Kunshan Aplus Tec. Corporation

Inventor： Bo-sian DU ,  Chihming LIN ,  Chienhui LEE

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K1/024 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/4635 ,  H05K2201/0141 ,  H05K2201/0154

Abstract: A high-frequency and high-transmission speed FPC with FRCC. The FPC includes FRCC and a double-sided board laminated again each other. The FRCC includes a third copper foil layer, a second ultra-low dielectric adhesive layer and a second insulating layer located between the third copper foil layer and the second ultra-low dielectric adhesive layer. One surface of the third copper foil layer is an inner surface. The double-sided board includes a first copper foil layer, a second copper foil layer and a first insulating layer located between the first copper foil layer and the second copper foil layer. An inner surface of the first copper foil layer has an Rz value of 0.05-0.5 μm. An inner surface of the second copper foil layer has an Rz value of 0.1-1.10 μm. The FPC has a good electrical property, a simple structure, a cost advantage, a brief preparation process, and a low thermal expansion coefficient.

公开(公告)号：US10077337B2

公开(公告)日：2018-09-18

申请号：US14901089

申请日：2014-06-26

Applicant: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.

Inventor： Akira Mori ,  Aiko Hara ,  Eigo Kondo ,  Tomonori Ando

IPC: C08G73/10 ,  C09D179/08 ,  C08J7/04 ,  B32B27/28 ,  B32B15/08 ,  H05K1/03

CPC classification number: C08G73/1082 ,  B32B15/08 ,  B32B27/281 ,  B32B2457/00 ,  C08G73/1042 ,  C08G73/105 ,  C08J7/047 ,  C08J2379/08 ,  C08J2479/08 ,  C09D179/08 ,  H05K1/036 ,  H05K2201/0108 ,  H05K2201/0154

Abstract: A resin film, in which at least one of polyimide layers is a non-thermoplastic polyimide layer having a linear thermal expansion coefficient of 1×10−6 to 30×10−6 (1/K), is shown. The non-thermoplastic polyimide layer is composed of a polyimide which is produced by reacting an anhydride component containing an aromatic tetracarboxylic anhydride with a diamine component, wherein the diamine component contains both a dimer acid-type diamine produced by replacing each of two terminal carboxyl groups in a dimer acid with a primary aminomethyl or amino group and an aromatic diamine, and the dimer acid-type diamine is contained in an amount of 1 to 15 mol % relative to the whole diamine component.

公开(公告)号：US20180242450A1

公开(公告)日：2018-08-23

申请号：US15753017

申请日：2016-08-06

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  SUMITOMO ELECTRIC FINE POLYMER, INC.

Inventor： Yuichiro YAMANAKA ,  Yoshio OKA ,  Satoshi KIYA ,  Yoshifumi UCHITA ,  Makoto NAKABAYASHI

IPC: H05K1/03 ,  H05K3/38 ,  B32B15/088

CPC classification number: H05K1/0346 ,  B32B15/08 ,  B32B15/088 ,  H05K3/381 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

公开(公告)号：US20180242448A1

公开(公告)日：2018-08-23

申请号：US15896166

申请日：2018-02-14

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Kazuo YOSHIKAWA ,  Makoto TAI ,  Nobuyuki IWANO ,  Takayuki MAYAMA

IPC: H05K1/03 ,  H05K3/00 ,  C08L53/00 ,  C08K3/36 ,  C09J153/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20

CPC classification number: H05K1/036 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B2250/02 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2379/08 ,  B32B2457/08 ,  C08K3/36 ,  C08K2003/2227 ,  C08L53/005 ,  C09J7/10 ,  C09J7/387 ,  C09J153/005 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2453/00 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/2063 ,  H05K2203/107

Abstract: The present invention provides a resin composition comprising a specific styrene polymer, a specific inorganic filler, and a curing agent, wherein the styrene polymer is a specific acid-modified styrene polymer, and the resin composition satisfies specific conditions in the form of a film having a thickness of 25 μm.

公开(公告)号：US20180184526A1

公开(公告)日：2018-06-28

申请号：US15737935

申请日：2016-06-28

Applicant: Molex, LLC

Inventor： Marko SPIEGEL ,  Victor ZADEREJ ,  Amrit PANDA

IPC: H05K3/18 ,  H05K1/18 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/188 ,  H05K1/0265 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/183 ,  H05K3/027 ,  H05K3/107 ,  H05K3/182 ,  H05K3/202 ,  H05K2201/0154 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0706 ,  H05K2203/0709 ,  H05K2203/0716 ,  H05K2203/108 ,  H05K2203/1131

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

公开(公告)号：US20180171077A1

公开(公告)日：2018-06-21

申请号：US15735287

申请日：2016-06-10

Applicant: UBE INDUSTRIES, LTD.

Inventor： Takuya OKA ,  Yukinori KOHAMA ,  Ryoichi TAKASAWA ,  Nobuharu HISANO ,  Ken KAWAGISHI

IPC: C08G73/10 ,  C08K3/26 ,  B32B17/06 ,  B32B27/28

CPC classification number: C08G73/1071 ,  B32B17/064 ,  B32B27/281 ,  B32B2307/7242 ,  B32B2457/12 ,  B32B2457/20 ,  B32B2457/208 ,  C08G73/10 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/1078 ,  C08G73/1082 ,  C08G73/14 ,  C08K3/26 ,  C08K2003/2206 ,  C08K2003/262 ,  C08K2003/265 ,  C09D179/08 ,  G06F3/041 ,  G06F2203/04102 ,  H01L23/145 ,  H01L23/4985 ,  H01L27/1218 ,  H01L27/1292 ,  H01L31/03926 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/0108 ,  H05K2201/0154

Abstract: A polyimide precursor composition including a polyimide precursor, and a fine particle having an optical anisotropy; and a polyimide composition including a polyimide, and a fine particle having an optical anisotropy.

公开(公告)号：US09999128B2

公开(公告)日：2018-06-12

申请号：US15344217

申请日：2016-11-04

Applicant: Chibitronics Private Limited

Inventor： Andrew Shane Huang ,  Jie Qi

IPC: H05K3/20 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/22 ,  H05K3/46 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K1/117 ,  C09J9/02 ,  H01R4/04 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/20 ,  H05K3/22 ,  H05K3/321 ,  H05K3/4611 ,  H05K2201/0154 ,  H05K2203/0228 ,  H05K2203/066

Abstract: Electronic sticker technology that enables assembly of circuits at ambient temperature without the use of any special tools.

公开(公告)号：US20180160545A1

公开(公告)日：2018-06-07

申请号：US15673001

申请日：2017-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Dal KIM ,  Oh Hyuck KWON ,  Han Vit KANG ,  Jun Young KIM ,  Moon Kyeong KIM ,  Sang Seob KIM ,  Jung Sik PARK ,  Hee Seok JUNG ,  Sung CHO ,  Heung Sik SHIN ,  Ji Woong OH

IPC: H05K3/36 ,  H04M1/02 ,  G02F1/1333 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K3/363 ,  A61B5/1172 ,  G02F1/1333 ,  G02F1/13338 ,  G02F1/13452 ,  G06F1/1637 ,  G06K9/00013 ,  G06K9/0004 ,  H04M1/0277 ,  H04M2250/16 ,  H05K1/028 ,  H05K1/147 ,  H05K1/188 ,  H05K1/189 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/056 ,  H05K2201/099 ,  H05K2201/10128 ,  H05K2201/10628

Abstract: An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.

公开(公告)号：US09983744B2

公开(公告)日：2018-05-29

申请号：US14846965

申请日：2015-09-07

Applicant: Pressure Profile Systems Inc.

Inventor： Jae S. Son

IPC: G01L1/00 ,  G06F3/044 ,  G06F3/041 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10151

Abstract: A capacitive tactile sensor for measuring location and force of touch from an external object includes a drive electrode layer separated from a sense electrode layer by a dielectric substrate, which may be a two-sided FPCB. A first deformable conductive shield layer is further provided and is separated from either the drive electrode layer or the sense electrode layer by a first compressible dielectric layer. A control electronics are operatively connected to all of the drive electrode layer, sense electrode layer, and the first conductive shield layer. The control electronics may be configured to measure a change in capacitance upon the external object imparting local mechanical compression onto the first conductive shield layer and the first compressible dielectric layer. The tactile sensor improves reliability of interconnections between drive and sense electrodes and the control electronics.

公开(公告)号：US20180146553A1

公开(公告)日：2018-05-24

申请号：US15876702

申请日：2018-01-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Dek Gin YANG

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/02 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0026 ,  H05K3/0058 ,  H05K3/02 ,  H05K3/027 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.