公开(公告)号：US20120073870A1

公开(公告)日：2012-03-29

申请号：US13213984

申请日：2011-08-19

Applicant: Hyung Jin JEON ,  Young Do KWEON ,  Seung Wook PARK ,  Seon Hee MOON

Inventor： Hyung Jin JEON ,  Young Do KWEON ,  Seung Wook PARK ,  Seon Hee MOON

IPC: H05K1/11 ,  H01K3/10

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/036 ,  H05K3/42 ,  H05K3/4602 ,  H05K3/4605 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/0594 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.

Abstract translation: 公开了一种印刷电路板，包括基底构件，形成在基底构件的两个表面中的每一个上的绝缘层，使得基底构件的表面变平，形成在绝缘层上的电路层和用于连接的通孔 所述电路层形成在所述基底构件的一个表面上，所述电路层形成在所述基底构件的另一个表面上。 还提供了制造印刷电路板的方法。

公开(公告)号：US08111367B2

公开(公告)日：2012-02-07

申请号：US12250725

申请日：2008-10-14

Applicant: Hiroshi Ueda ,  Shigeaki Noumi

Inventor： Hiroshi Ueda ,  Shigeaki Noumi

IPC: G02F1/1345

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/0175 ,  H05K2201/0326 ,  H05K2201/10674

Abstract: A display device comprises a metallic wiring formed on an insulating substrate, an inorganic insulating film formed on the metallic wiring, an organic resin film formed on the inorganic insulating film, a transparent conductive film formed in a portion on the metallic wiring where the inorganic insulating film and the organic resin film are removed, a connection terminal formed in a region for mounting a driving IC external to the display region on the insulating substrate, and a bump of the driving IC connected to the connection terminal by an anisotropic conductive film in order to supply a signal to the display region. The region for mounting a driving IC includes a region where the inorganic insulating film and the organic resin film are formed on the metallic wiring and a region where the inorganic insulating film and the organic resin film are removed from the metallic wiring.

Abstract translation: 显示装置包括形成在绝缘基板上的金属布线，形成在金属布线上的无机绝缘膜，形成在无机绝缘膜上的有机树脂膜，形成在金属布线上的部分上的无机绝缘层的透明导电膜 膜和有机树脂膜被除去，形成在用于将绝缘基板上的显示区域外部的驱动IC安装的区域中的连接端子和通过各向异性导电膜连接到连接端子的驱动IC的凸起顺序 以向显示区域提供信号。 用于安装驱动IC的区域包括在金属布线上形成无机绝缘膜和有机树脂膜的区域以及从金属布线去除无机绝缘膜和有机树脂膜的区域。

公开(公告)号：US08108990B2

公开(公告)日：2012-02-07

申请号：US12255699

申请日：2008-10-22

Applicant: Takashi Kariya ,  Hironori Tanaka

Inventor： Takashi Kariya ,  Hironori Tanaka

IPC: H05K3/00

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09827 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2224/05599

Abstract: A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.

Abstract translation: 一种印刷电路板，包括导体部分，在导体部分上形成的绝缘层，形成在绝缘层之上的薄膜电容器，并且包括第一电极，第二电极和介于第一电极和第二电极之间的高电介质层 第二电极和通过第二电极和绝缘层形成的通孔导体结构，并且电连接第二电极和导体部分。 通孔导体结构在第二电极中具有第一部分，在绝缘层中具有第二部分。 通孔导体结构的第一部分具有朝向导体部分逐渐变细的截锥形。

公开(公告)号：US20120012378A1

公开(公告)日：2012-01-19

申请号：US12894002

申请日：2010-09-29

Applicant: Hyung Jin Jeon ,  Young Do Kweon ,  Seung Wook Park ,  Seon Hee Moon

Inventor： Hyung Jin Jeon ,  Young Do Kweon ,  Seung Wook Park ,  Seon Hee Moon

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/4602 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/036 ,  H05K3/4605 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/10378 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.

公开(公告)号：US07982139B2

公开(公告)日：2011-07-19

申请号：US11356350

申请日：2006-02-17

Applicant: Takashi Kariya ,  Akira Mochida

Inventor： Takashi Kariya ,  Akira Mochida

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/10522 ,  H05K2201/10734

Abstract: A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32, etc.; and a capacitor portion 40 having a high dielectric constant layer 43, formed of ceramic and first and second layer electrodes 41 and 42 that sandwich the high dielectric constant layer 43. One of either of the first and second layer electrodes 41 and 42 is connected to a power supply line of the semiconductor element and the other of either of the first and second layer electrodes 41 and 42 is connected to a ground line. In this multilayer printed wiring board 10, high dielectric constant layer 43 included in the layered capacitor portion 40, which is connected between the power supply line and the ground line, is formed of ceramic. With this structure, the static capacitance of the layered capacitor portion 40 can be high, and an adequate decoupling effect is exhibited even under circumstances in which instantaneous potential drops occur readily.

Abstract translation: 多层印刷电路板10包括：安装部分60，其顶表面上安装有电连接到布线图案32的半导体元件; 以及具有由陶瓷形成的高介电常数层43的电容器部分40和夹在高介电常数层43上的第一和第二层电极41和42。第一和第二层电极41和42中的一个连接到 半导体元件的电源线和第一和第二层电极41和42中的另一个连接到接地线。 在这种多层印刷电路板10中，连接在电源线和接地线之间的层状电容器部分40中包括的高介电常数层43由陶瓷形成。 利用这种结构，层状电容器部分40的静态电容可以很高，并且即使在容易发生瞬时电位下降的情况下也可以发挥足够的去耦效应。

公开(公告)号：US07927517B2

公开(公告)日：2011-04-19

申请号：US12437657

申请日：2009-05-08

Applicant: Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

Inventor： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC: C09D5/24 ,  H01B1/08

CPC classification number: H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

Abstract translation: 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂层溶液包含烷氧基钛，二 - 二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

公开(公告)号：US07888803B2

公开(公告)日：2011-02-15

申请号：US11580928

申请日：2006-10-16

Applicant: Takashi Kariya ,  Hironori Tanaka

Inventor： Takashi Kariya ,  Hironori Tanaka

IPC: H01L23/48

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09827 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2224/05599

Abstract: A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.

Abstract translation: 一种印刷电路板，包括导体部分，在导体部分上形成的绝缘层，形成在绝缘层之上的薄膜电容器，并且包括第一电极，第二电极和介于第一电极和第二电极之间的高电介质层 第二电极和通过第二电极和绝缘层形成的通孔导体结构，并且电连接第二电极和导体部分。 通孔导体结构在第二电极中具有第一部分，在绝缘层中具有第二部分。 通孔导体结构的第一部分具有朝向导体部分逐渐变细的截锥形。

公开(公告)号：US07837817B2

公开(公告)日：2010-11-23

申请号：US12480190

申请日：2009-06-08

Applicant: James D Smith ,  Gary Stevens ,  John W Wood

Inventor： James D Smith ,  Gary Stevens ,  John W Wood

IPC: D06M23/08

CPC classification number: H01B3/04 ,  C03C25/1095 ,  H01B3/084 ,  H05K1/0366 ,  H05K2201/0175 ,  H05K2201/029 ,  Y10T156/10 ,  Y10T442/2033 ,  Y10T442/2418 ,  Y10T442/2426 ,  Y10T442/2475 ,  Y10T442/2861 ,  Y10T442/2893 ,  Y10T442/291 ,  Y10T442/2918 ,  Y10T442/2992 ,  Y10T442/3382 ,  Y10T442/3935 ,  Y10T442/3976

Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.

Abstract translation: 本发明通过具有高导热性材料6的织物的表面涂覆来促进织物的导热性。当织物是单独的纤维或股线4时，织物可以被表面涂覆，因此，股线束，成形织物或组合。 本发明使用的特定类型的纤维基质是玻璃。 一些织物可以是多于一种类型的材料的组合，或者可以在交替层中具有不同的材料。 本发明的HTC涂层包括金刚石涂层（DLC）和金属氧化物，氮化物，碳化物以及可以施加到主体基质上的混合化学计量和非化学计量组合。

公开(公告)号：US20100244280A1

公开(公告)日：2010-09-30

申请号：US12749117

申请日：2010-03-29

Applicant: Noriyoshi Shimizu ,  Akio Rokugawa

Inventor： Noriyoshi Shimizu ,  Akio Rokugawa

IPC: H01L23/48 ,  H01L21/04

CPC classification number: H05K3/28 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H05K3/3452 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/099 ,  H05K2203/0577 ,  H01L2224/0401

Abstract: A board on which a wiring having an electrode pad is formed is prepared. A resist film is formed on the board in order to cover the wiring and then the resist film is left on the electrode pad through patterning. An inorganic insulating film is formed on the board in order to cover the wiring and then the resist film is removed, thereby removing the inorganic insulating film provided on the resist film to leave the inorganic insulating film between the wirings. A solder resist layer is formed on the board in order to cover the wiring and then the electrode pad is exposed.

Abstract translation: 制备其上形成有电极焊盘的布线的板。 在板上形成抗蚀剂膜以覆盖布线，然后通过图案化将抗蚀剂膜留在电极焊盘上。 在板上形成无机绝缘膜以覆盖布线，然后除去抗蚀剂膜，从而除去设置在抗蚀剂膜上的无机绝缘膜，以使布线之间的无机绝缘膜离开。 在板上形成阻焊层以覆盖布线，然后暴露电极焊盘。

公开(公告)号：US07687366B2

公开(公告)日：2010-03-30

申请号：US11601101

申请日：2006-11-17

Applicant: Yongki Min

Inventor： Yongki Min

IPC: H01L21/20 ,  H01G9/00

CPC classification number: H01L23/49822 ,  H01G4/228 ,  H01G4/33 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/162 ,  H05K3/048 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09763 ,  Y10T29/417 ,  H01L2924/00

Abstract: An embedded passive structure, its method of formation, and its integration onto a substrate during fabrication are disclosed. In one embodiment, the embedded passive structure is a thin film capacitor (TFC) formed using a thin film laminate that has been mounted onto a substrate. The TFC's capacitor dielectric and/or lower electrode layers are patterned in such a way as to reduce damage and improve cycle time. In one embodiment, the capacitor dielectric has a high dielectric constant and the substrate is an organic packaging substrate.

Abstract translation: 公开了嵌入式被动结构，其形成方法及其在制造过程中与衬底的集成。 在一个实施例中，嵌入式无源结构是使用已经安装在基板上的薄膜层叠体形成的薄膜电容器（TFC）。 TFC的电容器电介质和/或下电极层被图案化以减少损坏并改善循环时间。 在一个实施例中，电容器电介质具有高介电常数，并且衬底是有机封装衬底。