公开(公告)号：US06574859B2

公开(公告)日：2003-06-10

申请号：US09785787

申请日：2001-02-16

Applicant: Shaji Farooq ,  Mario J. Interrante ,  Sudipta K. Ray ,  William E. Sablinski

Inventor： Shaji Farooq ,  Mario J. Interrante ,  Sudipta K. Ray ,  William E. Sablinski

IPC: H05K336

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

Abstract: An interconnection structure and methods for making and detaching the same are presented for column and ball grid array (CGA and BGA) structures by using a transient solder paste on the electronic module side of the interconnection that includes fine metal powder additives to increase the melting point of the solder bond. The metal powder additives change the composition of the solder bond such that the transient melting solder composition does not completely melt at temperatures below +230° C. and detach from the electronic module during subsequent ref lows. A Pb—Sn eutectic with a lower melting point is used on the opposite end of the interconnection structure. In the first method a transient melting solder paste is applied to the I/O pad of an electronic module by means of a screening mask. Interconnect structures are then bonded to the I/O pad. In a second method, solder preforms in a composition of the transient melting solder paste are wetted onto electronic module I/O pads and interconnect columns or balls are then bonded. Detachment of an electronic module from a circuit card can then be performed by heating the circuit card assembly to a temperature above the eutectic solder melting point, but below the transient solder joint melting point.

Abstract translation: 通过使用包括细金属粉末添加剂的电子模块侧的瞬态焊膏来提供柱和球栅阵列（CGA和BGA）结构的互连结构及其分离方法，以增加熔点 的焊点。 金属粉末添加剂改变焊料接合的组成，使得瞬态熔融焊料组合物在低于+ 230℃的温度下不会完全熔化，并且在后续参考低温期间与电子模块分离。 在互连结构的另一端使用具有较低熔点的Pb-Sn共晶体。在第一种方法中，通过掩模掩模将瞬态熔融焊膏施加到电子模块的I / O焊盘。 然后将互连结构结合到I / O焊盘。在第二种方法中，将瞬态熔融焊膏的组成中的焊料预成型件润湿到电子模块I / O焊盘上，然后连接互连柱或焊球。连接电子 然后可以通过将电路卡组件加热到高于共熔焊料熔点但低于瞬态焊点熔点的温度来执行电路卡的模块。

公开(公告)号：US20020086145A1

公开(公告)日：2002-07-04

申请号：US10024470

申请日：2001-12-21

Inventor： Yoshitaro Yazaki ,  Yoshihiko Shiraishi ,  Koji Kondo ,  Toshikazu Harada ,  Tomohiro Yokochi

IPC: H05K001/03

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T428/24917

Abstract: A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

Abstract translation: 通过用层间导电材料填充形成在布线板的绝缘膜层上的孔，制成加压印刷线路板。 绝缘膜与导体图案堆叠，并且每个导体图案封闭通孔。 夹层导电材料在加压压制程序后在通孔中形成固体导电材料。 固体导电材料包括两种类型的导电材料。 第一类导电材料包括金属，第二类导电材料包括由导体图案的金属和导体金属形成的合金。 导体图形可靠地电连接，而不依赖于机械接触。

公开(公告)号：US06404476B1

公开(公告)日：2002-06-11

申请号：US08962448

申请日：1997-10-31

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F11345

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Abstract translation: 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US06270363B1

公开(公告)日：2001-08-07

申请号：US09315373

申请日：1999-05-18

Applicant: Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01R458

CPC classification number: H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/81101 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/0256 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0272 ,  H05K2201/0284 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A compressible interposer comprising an interposer sheet having a plurality of apertures filled with a dielectric material having a substantially uniform suspension of conductive particles therein forming a plurality of conductive sites. Preferably, the number of conductive sites on the interposer are greater in number than the number of contact pads on the electronic components such that precise alignment of the interposer between the electronic components is not required. The apertures of the interposer sheet confine the conductive particles within the dielectric material such that during compression of the interposer between the electronic components, z-axis conductive pathways are formed without shorting in the x and y directions. Preferably, the interposer sheet comprises polyimide. Preferably, the dielectric material comprises polyimide-siloxane. Preferably, the conductive particles have a diameter of about 2 to about 20 &mgr;m and comprise of a material selected from the group consisting of copper, gold, silver, nickel, palladium, platinum, and alloys thereof. The particles may also be coated with an additional conductive material such as solder having a lower melting temperature. Most preferably, the conductive particles comprise solder coated copper particles. The conductive particles are present in an amount of about 30 to about 90 wt. % of the total weight of the conductive particles and the dielectric material.

Abstract translation: 一种可压缩插入件，其包括插入片，所述插入片具有填充有形成多个导电部位的导电粒子的基本均匀悬浮液的电介质材料的多个孔。 优选地，内插器上的导电位置的数量大于电子部件上的接触焊盘的数量，使得不需要电子部件之间的插入器的精确对准。 插入片的孔径将导电粒子限制在电介质材料内，使得在电子部件之间的插入件压缩期间，在x和y方向上形成z轴传导路径而不会短路。 优选地，插入片包括聚酰亚胺。 优选地，电介质材料包括聚酰亚胺 - 硅氧烷。 优选地，导电颗粒的直径为约2至约20μm，并且包括选自铜，金，银，镍，钯，铂及其合金的材料。 颗粒也可以涂覆有另外的导电材料，例如具有较低熔融温度的焊料。 最优选地，导电颗粒包括焊料涂覆的铜颗粒。 导电颗粒的存在量为约30至约90wt。 导电颗粒和电介质材料的总重量的百分比。

公开(公告)号：US5853622A

公开(公告)日：1998-12-29

申请号：US704467

申请日：1996-08-28

Applicant: Catherine Gallagher ,  Goran Matijasevic ,  M. Albert Capote

Inventor： Catherine Gallagher ,  Goran Matijasevic ,  M. Albert Capote

IPC: B23K35/02 ,  B23K35/36 ,  H01B1/22 ,  H01L23/498 ,  H01L23/538 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  C21B3/02

CPC classification number: B22F3/1035 ,  B23K35/0222 ,  B23K35/36 ,  H01B1/22 ,  H01L23/49827 ,  H01L23/49883 ,  H01L23/5384 ,  H05K3/321 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K3/3489 ,  H05K3/4069 ,  H05K3/4623

Abstract: An inventive method for electrical and thermal electronic component attachment is disclosed. The combination of transient liquid phase sintering (TLPS) and a permanent adhesive flux binder provides the advantages of both conventional soldering technology and conductive adhesives. This hybrid approach delivers electrical and thermal conduction through sintered metal joints and mechanical properties based on a tailorable polymer matrix. These transient liquid phase sintering conductive adhesives can utilize conventional dispensing, placement, and processing equipment. During the reflow process, metal powders in the composition undergo interparticle sintering as well as alloying to the contact pads. This process produces a strong mechanical, thermal, and electrical interconnect which ensures good conductivity that is also resistant to humidity and temperature cycling.

Abstract translation: 公开了用于电气和热电子部件附接的创新方法。 瞬态液相烧结（TLPS）和永久粘合剂粘合剂的组合提供了常规焊接技术和导电粘合剂的优点。 这种混合方法通过烧结金属接头和基于可裁剪聚合物基体的机械性能提供电和热传导。 这些瞬态液相烧结导电粘合剂可以利用常规的分配，放置和加工设备。 在回流工艺期间，组合物中的金属粉末经过颗粒间烧结以及与接触焊盘的合金化。 该过程产生强大的机械，热和电互连，确保良好的导电性，同时也耐湿度和温度循环。

公开(公告)号：US5770305A

公开(公告)日：1998-06-23

申请号：US534445

申请日：1995-09-27

Applicant: Shinji Terasaka

Inventor： Shinji Terasaka

IPC: G02F1/1345 ,  H01B1/22 ,  H01B5/00 ,  H01B5/16 ,  H01R11/01 ,  H05K3/32 ,  H05K3/38 ,  B32B5/16

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01L2224/29499 ,  H01L2224/83101 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  Y10S428/901 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/2998 ,  Y10T428/31511

Abstract: In an anisotropic conductive film, ultraresilient alloy particles, playing the role of conductive particles, are dispersed in a resin. With this configuration, the ACF reduces line defects to occur on a liquid crystal display panel and attributable thereto to one-tenth.

Abstract translation: 在各向异性导电膜中，发挥导电粒子的作用的超微细合金粒子分散在树脂中。 采用这种结构，ACF减少了在液晶显示面板上发生的线缺陷，并将其归因于十分之一。

公开(公告)号：US5538789A

公开(公告)日：1996-07-23

申请号：US188658

申请日：1994-01-26

Applicant: Miguel A. Capote ,  Michael G. Todd

Inventor： Miguel A. Capote ,  Michael G. Todd

IPC: B23K35/02 ,  B23K35/36 ,  H01B1/22 ,  H01L23/498 ,  H01L23/538 ,  H05K1/09 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H01B1/02

CPC classification number: H01L23/49883 ,  B23K35/0222 ,  B23K35/36 ,  H01B1/22 ,  H01L23/49827 ,  H01L23/5384 ,  H05K1/095 ,  H05K3/321 ,  H01L2224/293 ,  H01L2924/01079 ,  H01L2924/01087 ,  H05K1/181 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K3/3489 ,  H05K3/4069 ,  H05K3/4623 ,  Y10S428/901 ,  Y10T428/2804 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31681

Abstract: Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180.degree. and about 245.degree. C., or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.

公开(公告)号：US5531020A

公开(公告)日：1996-07-02

申请号：US112225

申请日：1993-08-27

Applicant: David Durand ,  Roger A. Iannetta, Jr.

Inventor： David Durand ,  Roger A. Iannetta, Jr.

IPC: C09J163/00 ,  H01B1/22 ,  H01L21/48 ,  H01L21/60 ,  H01R4/04 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L24/83 ,  C09J163/00 ,  H01B1/22 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/81 ,  H01R4/04 ,  H05K3/1258 ,  H05K3/321 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H05K1/095 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/28 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith is disclosed. First, three dimensional, essentially square channels interspersed with lands are formed within a dielectric material on a substrate. The channels are then filled in one pass with a curable polymeric material containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components are place to engage the conductive material. The curable material is then cured after placing the electronic component(s).

Abstract translation: 公开了一种制造具有组装的至少一个电子电路部件的平面的地下电子电路的方法。 首先，在衬底上的电介质材料内形成散布有焊盘的三维，基本上为方形的通道。 然后将通道用含有导电金属填料的可固化聚合物材料一次填充，使得由该导电材料形成的电路迹线的上表面基本上与焊盘的上表面相同。 电路元件是与导电材料接合的地方。 然后在放置电子部件之后固化可固化材料。

公开(公告)号：US5463190A

公开(公告)日：1995-10-31

申请号：US223413

申请日：1994-04-04

Applicant: Robert T. Carson ,  Arnold W. Hogrefe ,  Frank J. Juskey, Jr.

Inventor： Robert T. Carson ,  Arnold W. Hogrefe ,  Frank J. Juskey, Jr.

IPC: H01R4/04 ,  H05K3/32 ,  H05K1/00

CPC classification number: H01R4/04 ,  H05K3/321 ,  H01L2224/293 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2203/0425

Abstract: A conductive adhesive (120) for electrically and mechanically bonding circuit terminals (105) includes a polymer (121) having a predetermined curing temperature range, a first conductive particulate material (125) suspendable in the polymer (121) for providing substantially uniform conductivity throughout the conductive adhesive (120), and a second conductive particulate material (130) suspendable in the polymer (121) for metallurgically bonding together particles of the first particulate material (125). The first conductive particulate material (125) provides substantially uniform conductivity throughout the conductive adhesive (120) and includes metallic particles having a melting point above the curing temperature of the polymer. The second conductive particulate material (130) welds together particles of the first particulate material (125) and includes metallic particles having a melting point within the curing temperature range of the polymer (121).

Abstract translation: 用于电气和机械地结合电路端子（105）的导电粘合剂（120）包括具有预定固化温度范围的聚合物（121），可悬挂在聚合物（121）中的第一导电颗粒材料（125），用于提供基本均匀的电导率 导电粘合剂（120）和可悬挂在聚合物（121）中的第二导电颗粒材料（130），用于将第一颗粒材料（125）的颗粒冶金结合在一起。 第一导电颗粒材料（125）在整个导电粘合剂（120）中提供基本均匀的导电性，并且包括具有高于聚合物固化温度的熔点的金属颗粒。 第二导电颗粒材料（130）将第一颗粒材料（125）的颗粒焊接在一起并且包括熔点在聚合物（121）的固化温度范围内的金属颗粒。

公开(公告)号：US5376403A

公开(公告)日：1994-12-27

申请号：US769892

申请日：1991-10-01

Applicant: Miguel A. Capote ,  Michael G. Todd ,  Nicholas J. Manesis ,  Hugh P. Craig

Inventor： Miguel A. Capote ,  Michael G. Todd ,  Nicholas J. Manesis ,  Hugh P. Craig

IPC: B23K35/22 ,  B23K35/02 ,  B23K35/36 ,  B23K35/363 ,  C08K3/02 ,  C08K3/08 ,  C08K5/00 ,  C08L101/00 ,  H01B1/00 ,  H01B1/22 ,  H01L23/498 ,  H01L23/538 ,  H05K1/09 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  B05D5/12

CPC classification number: B22F3/1035 ,  B23K35/0222 ,  B23K35/36 ,  H01B1/22 ,  H01L23/49827 ,  H01L23/49883 ,  H01L23/5384 ,  H05K1/095 ,  H05K3/321 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01087 ,  H05K1/181 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K3/1216 ,  H05K3/3489 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4664

Abstract: Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits: the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder.

Abstract translation: 导电粘合剂组合物及其制备和使用方法，其中焊剂粉末，具有助熔性能的化学保护的交联剂和反应性单体或聚合物是主要组分。 根据预期的最终用途，组合物包含以下三种或更多种：相对较高的熔融金属粉末; 焊粉; 也用作助熔剂的活性交联剂; 树脂; 和反应性单体或聚合物。 所述组合物可用作改进的导电粘合剂，例如用于将电气组件附接到电路：包含金属粉末的组合物理想地适用于在印刷电路上产生导电路径。 用于形成导电路径的组合物可以首先以电路的所需图案施加到基底，然后加热以使其固化。 在加热过程中，交联剂和任选的反应性单体或聚合物在混合物内的作用使金属熔化，使金属粉末和焊料粉末之间发生烧结。