公开(公告)号：US09089714B2

公开(公告)日：2015-07-28

申请号：US12549831

申请日：2009-08-28

Applicant: David Robinson

Inventor： David Robinson

IPC: A61N1/05 ,  A61N1/375 ,  H05K3/10 ,  A61N1/36 ,  A61N1/372

CPC classification number: A61N1/375 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/37229 ,  H05K3/103 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/0308 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2203/1189 ,  Y10T29/4913

Abstract: An active implantable medical device (AIMD) comprising an implantable electronics module and a tissue interface. At least one of the electronics module and the tissue interface comprises an electrically non-conductive, biocompatible and needle-piercable base having one or more biocompatible electrically conductive strands of conductive filaments stitched to the base. As used herein, stitching a conductive filament to a base refers to sewing, embroidering or otherwise securing the filament to the base through the use of hand or machine needlework.

Abstract translation: 一种包括可植入电子模块和组织界面的主动植入式医疗装置（AIMD）。 电子模块和组织界面中的至少一个包括具有一个或多个与基底缝合的导电丝的一个或多个生物相容的导电股线的非导电，生物相容性和针刺的基底。 如本文所使用的，将导电丝缝合到基部是指通过使用手或机针刺将缝线，刺绣或以其他方式将灯丝固定到基座。

公开(公告)号：US20100262214A1

公开(公告)日：2010-10-14

申请号：US12549831

申请日：2009-08-28

Applicant: David Robinson

Inventor： David Robinson

IPC: A61N1/05 ,  D05B97/00 ,  H05K3/30

CPC classification number: A61N1/375 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/37229 ,  H05K3/103 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/0308 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2203/1189 ,  Y10T29/4913

Abstract: An active implantable medical device (AIMD) comprising an implantable electronics module and a tissue interface. At least one of the electronics module and the tissue interface comprises an electrically non-conductive, biocompatible and needle-piercable base having one or more biocompatible electrically conductive strands of conductive filaments stitched to the base. As used herein, stitching a conductive filament to a base refers to sewing, embroidering or otherwise securing the filament to the base through the use of hand or machine needlework.

Abstract translation: 一种包括可植入电子模块和组织界面的主动植入式医疗装置（AIMD）。 电子模块和组织界面中的至少一个包括具有一个或多个与基底缝合的导电丝的一个或多个生物相容的导电股线的非导电，生物相容性和针刺的基底。 如本文所使用的，将导电丝缝合到基部是指通过使用手或机针刺将缝线，刺绣或以其他方式将灯丝固定到基座。

公开(公告)号：US07795693B2

公开(公告)日：2010-09-14

申请号：US12083916

申请日：2006-10-13

Applicant: Heinz Kaufmann ,  Tobias Melz ,  Ralf Sindelar

Inventor： Heinz Kaufmann ,  Tobias Melz ,  Ralf Sindelar

IPC: H01L29/00

CPC classification number: B81B3/0072 ,  B81B2201/042 ,  H01L27/20 ,  H01L41/0825 ,  H05K1/0271 ,  H05K2201/0308 ,  H05K2201/10083 ,  H05K2201/10151

Abstract: The description is of a flat substrate with an electrically conductive structure integrated inside the flat substrate or applied to a surface of the flat substrate and/or with a technically improved surface.The invention is characterised in that at least one sensor is integrated inside the flat substrate or applied to a surface of the flat substrate, which generates sensor signals according to deformations occurring inside the flat substrate, at least one actuator is integrated inside the flat substrate or applied to the surface of the flat substrate, which enables the flat substrate to mechanically deform when activated, and a signal unit connected to the at least one sensor and to the at least one actuator is provided, which, on the basis of the sensor signals, generates actuator signals for activating the actuator, so that deformations occurring inside the flat substrate are reduced.

Abstract translation: 描述是具有整体在平坦基板内部或施加到平坦基板的表面和/或技术上改进的表面的导电结构的平坦基板。 本发明的特征在于，至少一个传感器集成在平面基板的内部或应用于平面基板的表面，该平面基板的表面根据在平坦基板内部发生的变形产生传感器信号，至少一个致动器集成在平面基板的内部或 施加到平坦基板的表面，这使得平面基板能够在被激活时机械地变形，并且提供连接到至少一个传感器和至少一个致动器的信号单元，其基于传感器信号 产生用于启动致动器的致动器信号，使得在平坦基板内发生的变形减小。

公开(公告)号：US20070152016A1

公开(公告)日：2007-07-05

申请号：US11323218

申请日：2005-12-30

Applicant: Heeman Choe ,  Daewoong Suh

Inventor： Heeman Choe ,  Daewoong Suh

IPC: B23K35/14

CPC classification number: B23K35/025 ,  B23K35/22 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0116 ,  H05K2201/0308 ,  Y02P70/613 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479

Abstract: A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.

Abstract translation: 在集成电路封装的基板上形成发泡焊料或纳米多孔焊料。 泡沫焊料表现出低的模量，抗冲击和动态载荷下的开裂。 泡沫焊料用作集成电路器件和外部结构之间的通信的焊料凸块。

公开(公告)号：US06875931B2

公开(公告)日：2005-04-05

申请号：US10198792

申请日：2002-07-18

Applicant: Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar ,  Tom E. Pearson

Inventor： Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar ,  Tom E. Pearson

IPC: H05K3/30 ,  H05K3/34 ,  H05R12/04 ,  H05K1/11

CPC classification number: H05K3/303 ,  H01L2224/81141 ,  H01L2924/15151 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/0308 ,  H05K2201/09072 ,  H05K2201/10598 ,  Y02P70/613

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-expandable member and a retainer member. Being formed from a heat-expandable material, the heat-expandable member is coupled with the retainer member and is disposed about a periphery thereof. The retainer member is configured to be coupled with a component and, when the component is assembled onto a double-sided printed circuit board, to be received by an opening formed in the double-sided printed circuit board. The heat-expandable member is configured to expand during assembly of the component, engaging an inner surface that defines the opening. Thereby, the component is retained and supported when the double-sided printed circuit board is subsequently inverted, populated, and reflowed.

Abstract translation: 一种用于在随后位于双面印刷电路板的相对侧上的其它部件的回流期间在双面印刷电路板的一侧上保持组装的部件的装置及其制造和使用方法。 保持器包括热膨胀构件和保持构件。 由可热膨胀材料形成的热膨胀构件与保持构件联接并围绕其周围设置。 保持构件被构造成与部件联接，并且当组件组装到双面印刷电路板上时，保持构件被形成在双面印刷电路板中的开口接收。 热膨胀构件构造成在组件的组装期间膨胀，与限定开口的内表面接合。 因此，当双面印刷电路板随后被倒置，填充和回流时，该部件被保持和支撑。

公开(公告)号：US20040248434A1

公开(公告)日：2004-12-09

申请号：US10860579

申请日：2004-06-04

Applicant: FUJI PHOTO FILM CO., LTD.

Inventor： Yuichi Fujimura

IPC: H01R012/00

CPC classification number: H05K1/028 ,  H01R4/01 ,  H01R12/59 ,  H05K2201/0308 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: In a flexible print circuit having a plurality of signal wires, core wires formed from a shape memory material are provided on the two end portions thereof in the direction of width, and are caused to memorize a wiring completion shape within an electronic instrument in advance. In a wire harness having a plurality of signal wires, core wires formed from a shape memory alloy are disposed on the two sides of the planar signal wire array, or positioned along the central axis of the signal wires which are bundled into circular form. A guide frame for guiding a wire harness having a plurality of signal wires are caused to memorize in advance a shape which removes the wire harness from the movement range of a movable component within the electronic instrument.

Abstract translation: 在具有多条信号线的柔性印刷电路中，由形状记忆材料形成的芯线在其宽度方向的两端部设置，并预先在电子仪器内记忆布线完成形状。 在具有多个信号线的线束中，由形状记忆合金形成的芯线设置在平面信号线阵列的两侧，或沿着捆扎成圆形的信号线的中心轴定位。 引导引导具有多条信号线的线束的引导框架，预先记录从电子仪器内的可动部件的移动范围除去线束的形状。

公开(公告)号：US20030216066A1

公开(公告)日：2003-11-20

申请号：US10152144

申请日：2002-05-20

Inventor： George Arrigotti ,  Raiyomand Aspandiar ,  Christopher D. Combs ,  Tom E. Pearson

IPC: H05K001/00

CPC classification number: H05K3/306 ,  H01R4/01 ,  H01R12/7035 ,  H05K2201/0308 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2203/306

Abstract: The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.

Abstract translation: 本发明涉及用于最小化载体基底和与其连接的部件之间的开放电连接的装置和方法，其由于暴露于将部件固定到基板而遇到的增加的热分布而由于在基板中的下垂而发生。 零插入力热活化固定销在升温过程中膨​​胀或弯曲，在印刷电路板上产生向上的力。 该向上的力抵抗向下的下垂力，并使载体基板保持与所连接部件的共面关系。

公开(公告)号：US20020076979A1

公开(公告)日：2002-06-20

申请号：US09557251

申请日：2000-04-24

Inventor： Hideaki Terauchi ,  Fumio Aoki ,  Kazuhiko Ota ,  Yasuhiro Teshima

IPC: H01R013/60

CPC classification number: H01R12/7058 ,  H01R12/7023 ,  H01R12/7047 ,  H01R12/707 ,  H01R12/716 ,  H05K3/303 ,  H05K3/306 ,  H05K7/12 ,  H05K2201/0308 ,  H05K2201/10189 ,  H05K2201/10598 ,  Y02P70/613 ,  Y10S439/943 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is removed from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.

Abstract translation: 公开了一种表面安装连接器的方法，其能够使连接器自动安装，同时保持焊接部分的可靠性，而不需要额外提供专用设备。 连接器形成为在一部分处较厚并且在相对于轴线C1的另一部分处薄。 将连接器表面安装在印刷电路板上时，将钩构件插入到通过印刷电路板预先形成的通孔中。 然后，在印刷电路板上进行回流处理，由此焊接包括引线引脚的芯片的端子。 将印刷电路板从回流炉中取出并冷却，由此钩构件向钩部侧弯曲。 这使得钩挂部分与印刷电路板的下侧接合，由此连接器牢固地固定到印刷电路板上。

公开(公告)号：US6081998A

公开(公告)日：2000-07-04

申请号：US57660

申请日：1998-04-09

Applicant: Hideaki Terauchi ,  Fumio Aoki ,  Kazuhiko Ota ,  Yasuhiro Teshima

Inventor： Hideaki Terauchi ,  Fumio Aoki ,  Kazuhiko Ota ,  Yasuhiro Teshima

IPC: H01R12/55 ,  H01R13/60 ,  H05K3/30 ,  H05K7/12 ,  A01R9/00

CPC classification number: H01R12/7058 ,  H01R12/7023 ,  H01R12/707 ,  H05K3/303 ,  H05K7/12 ,  H01R12/7047 ,  H01R12/716 ,  H05K2201/0308 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K3/306 ,  Y02P70/613 ,  Y10S439/943 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C.sub.1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is reroved from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.

Abstract translation: 公开了一种表面安装连接器的方法，其能够使连接器自动安装，同时保持焊接部分的可靠性，而不需要额外提供专用设备。 连接器形成为在一部分处较厚并且在相对于轴线C1的另一部分处薄。 将连接器表面安装在印刷电路板上时，将钩构件插入到通过印刷电路板预先形成的通孔中。 然后，在印刷电路板上进行回流处理，由此焊接包括引线引脚的芯片的端子。 将印刷电路板从回流炉中取出并冷却，由此钩构件向钩部侧弯曲。 这使得钩挂部分与印刷电路板的下侧接合，由此连接器牢固地固定到印刷电路板上。

公开(公告)号：US20240117795A1

公开(公告)日：2024-04-11

申请号：US18378087

申请日：2023-10-09

Applicant: Stardust Holdings, LLC d/b/a/ XTERRA Space

Inventor： Alex Weston Kuehn

IPC: F03G7/06 ,  H05K1/18

CPC classification number: F03G7/06145 ,  H05K1/181 ,  H05K2201/0308 ,  H05K2201/10537

Abstract: This disclosure relates generally to a reusable actuating device utilizing multiple integrated planar shape memory alloy elements integrated with independent driver circuits and at least one return spring integrated onto a single multi-layer PCB with a novel layout to create an electrically and mechanically redundant integrated actuator solution uniquely suited for use in low-profile devices that can be utilized by themselves or as an initiator in a staged device to release higher loads. The apparatus of the invention is particularly useful for spacecraft and other vehicular actuation devices.