公开(公告)号：US07847390B2

公开(公告)日：2010-12-07

申请号：US12145795

申请日：2008-06-25

Applicant: Mituharu Tabata

Inventor： Mituharu Tabata

IPC: H01L23/52 ,  H01L23/48

CPC classification number: H05K3/325 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K2201/0311 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device includes: a semiconductor module case; a metal terminal externally extending from within the case; a semiconductor element disposed within the case and electrically connected to the metal terminal; and a printed wiring board having a wiring pattern formed on a surface thereof, the printed wiring board being connected to the semiconductor element through the metal terminal; wherein the external portion of the metal terminal includes a joining portion and a resilient portion, the joining portion being in surface contact with an external surface of the case, the resilient portion facing and being spaced from the joining portion; wherein the printed wiring board is inserted between the joining portion and the resilient portion; and wherein the wiring pattern on the printed wiring board is pressure-welded to the joining portion.

Abstract translation: 半导体器件包括：半导体模块壳体; 从外壳延伸的金属端子; 半导体元件，其设置在所述壳体内并电连接到所述金属端子; 以及印刷电路板，其表面形成有布线图案，印刷布线板通过金属端子与半导体元件连接; 其中所述金属端子的外部包括接合部分和弹性部分，所述接合部分与所述壳体的外表面表面接触，所述弹性部分面向并与所述接合部分间隔开; 其中所述印刷线路板插入在所述接合部分和所述弹性部分之间; 并且其中印刷线路板上的布线图案被压焊在接合部分上。

公开(公告)号：US20100261359A1

公开(公告)日：2010-10-14

申请号：US12752127

申请日：2010-04-01

Applicant: MING-CHIH CHAN ,  XIAO-QIN JIANG

Inventor： MING-CHIH CHAN ,  XIAO-QIN JIANG

IPC: H01R12/00

CPC classification number: H05K9/0035 ,  H05K3/341 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/1084 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electro-magnetic interference device attached to a surface of an object by soldering is disclosed. The device comprises a base comprising a surface defining at least one recessed portion. The at least one recessed portion comprises a side wall. An angle between the side wall and the surface of the base is equal to or greater than 90 degrees.

Abstract translation: 公开了一种通过焊接附着到物体表面的电磁干扰装置。 该装置包括基部，该基部包括限定至少一个凹部的表面。 所述至少一个凹部包括侧壁。 侧壁与基座表面之间的角度等于或大于90度。

公开(公告)号：US20100219536A1

公开(公告)日：2010-09-02

申请号：US12734192

申请日：2008-10-16

Applicant: Toshio Kazama ,  Shigeki Ishikawa

Inventor： Toshio Kazama ,  Shigeki Ishikawa

IPC: H01L23/48 ,  H01B5/00 ,  H05K1/11

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01R12/714 ,  H01R13/2407 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction.

Abstract translation: 提供了可以实现与接触目标的稳定接触的连接端子，半导体封装，布线板，连接器和微控制器。 为了实现该目的并通过与接触目标物理接触来建立与接触靶的电连接，提供了多个导电端子形成部件，每个导体端子形成部件具有端部，该端子部分延伸成带状， 其表面的至少一部分形成曲面。 每个端子部分被构造为使得其一部分层压在厚度方向上的至少一个端子部分的一部分上。 所有端子部分可以在厚度方向的各个尖端部分层叠。

公开(公告)号：US20100165562A1

公开(公告)日：2010-07-01

申请号：US12160769

申请日：2007-01-12

Applicant: Para Kanagasabai Segaram

Inventor： Para Kanagasabai Segaram

IPC: G06F1/16

CPC classification number: H05K1/144 ,  G06F1/185 ,  G11C5/02 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/105 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10386 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/048 ,  H05K2203/1572 ,  H05K2203/167 ,  H01L2924/00

Abstract: A sub system for a computing device comprising a plurality of chips mounted on a foldable substrate wherein the foldable substrate and the chips are layered by folding the substrate whereby the chips are disposed in at least one stacked configuration and wherein the sub system is adapted to be received on a host board. In addition, removable connections using resilient and nanostructure based members.

Abstract translation: 一种用于计算设备的子系统，包括安装在可折叠基板上的多个芯片，其中通过折叠基板来折叠可折叠基板和芯片，由此芯片以至少一个堆叠配置布置，并且其中子系统适于 在主机板上接收。 此外，使用弹性和纳米结构的成员的可移除连接。

公开(公告)号：US07637751B1

公开(公告)日：2009-12-29

申请号：US12456211

申请日：2009-06-12

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01R13/2442 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

公开(公告)号：US07625220B2

公开(公告)日：2009-12-01

申请号：US11408566

申请日：2006-04-21

Applicant: Larry E. Dittmann ,  John D. Williams ,  William B. Long

Inventor： Larry E. Dittmann ,  John D. Williams ,  William B. Long

IPC: H01R12/00

CPC classification number: H05K1/118 ,  H01R12/526 ,  H01R13/2407 ,  H05K3/202 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10378 ,  H05K2203/1572 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A Flat Flex Connector (FFC) has connector flanges embedded in its insulated electrical traces. The flanges engage electrical circuits in a camera module such as a CMOS or CCD and are clamped into electrical engagement. The opposite end of the FFC makes electrical contact with another electrical device such as a semiconductor circuit. The assembly allows electrical connection of two or more devices in a confined space in which the electrical device are not easily aligned for electrical contact.

Abstract translation: 扁平柔性连接器（FFC）在其绝缘电线中嵌入了连接法兰。 这些凸缘与摄像机模块（例如CMOS或CCD）中的电路接合，并被夹紧成电接合。 FFC的另一端与诸如半导体电路的另一电气装置电接触。 该组件允许两个或多个设备在密闭空间中的电连接，其中电气设备不容易对准以进行电接触。

公开(公告)号：US07566228B2

公开(公告)日：2009-07-28

申请号：US11768382

申请日：2007-06-26

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01R13/2442 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

Abstract translation: 所公开的实施例涉及使用刮削技术形成电接触。 电触点包括已经从下面的金属体滑开的弹簧结构，但是弹簧保持与金属体结合，该金属体为弹簧结构提供基座。 电接触件的刮刀弹簧部分可包括悬臂状弹簧，线圈状弹簧或任何其它合适类型的弹簧。 这种弹簧接点可用于在集成电路器件和电路板（或其他衬底）之间形成电连接。 描述和要求保护其他实施例。

公开(公告)号：US20090146277A1

公开(公告)日：2009-06-11

申请号：US12145795

申请日：2008-06-25

Applicant: Mituharu TABATA

Inventor： Mituharu TABATA

IPC: H01L23/495

CPC classification number: H05K3/325 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K2201/0311 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device includes: a semiconductor module case; a metal terminal externally extending from within the case; a semiconductor element disposed within the case and electrically connected to the metal terminal; and a printed wiring board having a wiring pattern formed on a surface thereof, the printed wiring board being connected to the semiconductor element through the metal terminal; wherein the external portion of the metal terminal includes a joining portion and a resilient portion, the joining portion being in surface contact with an external surface of the case, the resilient portion facing and being spaced from the joining portion; wherein the printed wiring board is inserted between the joining portion and the resilient portion; and wherein the wiring pattern on the printed wiring board is pressure-welded to the joining portion.

Abstract translation: 半导体器件包括：半导体模块壳体; 从外壳延伸的金属端子; 半导体元件，其设置在所述壳体内并电连接到所述金属端子; 以及印刷电路板，其表面形成有布线图案，印刷布线板通过金属端子与半导体元件连接; 其中所述金属端子的外部包括接合部分和弹性部分，所述接合部分与所述壳体的外表面表面接触，所述弹性部分面向并与所述接合部分间隔开; 其中所述印刷线路板插入在所述接合部分和所述弹性部分之间; 并且其中印刷线路板上的布线图案被压焊在接合部分上。

公开(公告)号：US20090093136A1

公开(公告)日：2009-04-09

申请号：US12234581

申请日：2008-09-19

Applicant: Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

Inventor： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC: H05K1/00 ,  H01R43/20

CPC classification number: G06F1/1632 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01R12/57 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53209 ,  H01L2224/85 ,  H01L2924/00014

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

Abstract translation: 双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。 每个EUSB装置101包括PCBA，PCBA具有布置在PCB的上侧上的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展用途接触弹簧。 使用单次成型工艺来形成上PCB表面上的上壳体部分，其包括在相邻接触垫之间延伸的肋，以及形成在无源部件上的下模制壳体部分和设置在下PCB表面上的IC管芯 。 使用SMT方法安装无源部件，并使用COB方法安装IC管芯。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。

公开(公告)号：US20090081889A1

公开(公告)日：2009-03-26

申请号：US11903962

申请日：2007-09-25

Applicant: Chandrashekhar Ramaswamy ,  Thomas G. Ruttan ,  Mark D. Summers

Inventor： Chandrashekhar Ramaswamy ,  Thomas G. Ruttan ,  Mark D. Summers

IPC: H01R12/00

CPC classification number: H01R13/2442 ,  H01R12/714 ,  H05K3/326 ,  H05K3/4015 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611

Abstract: In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts and pads, enabling reduced loading forces to adapt the semiconductor device to the circuit board. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，本发明包括具有集成触点以与半导体器件的相应焊盘配合的电路板。 集成接触中的至少一些具有不同的尺寸，以实现相应的集成触点和焊盘之间的不同接触电阻，从而能够减少负载力以使半导体器件适应电路板。 描述和要求保护其他实施例。