公开(公告)号：US20080139013A1

公开(公告)日：2008-06-12

申请号：US11995339

申请日：2006-04-17

Applicant: Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

Inventor： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC: H01R12/00 ,  H01R43/00

CPC classification number: H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

Abstract translation: 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US07343675B2

公开(公告)日：2008-03-18

申请号：US10987285

申请日：2004-11-12

Applicant: C. W. Sinjin Smith ,  Paul B. Jaynes ,  Charles J. Newton ,  Travis L. Kerby

Inventor： C. W. Sinjin Smith ,  Paul B. Jaynes ,  Charles J. Newton ,  Travis L. Kerby

IPC: H01K3/22

CPC classification number: H05K3/0014 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S156/924 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T156/1189 ,  Y10T428/10 ,  Y10T428/1005

Abstract: A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).

Abstract translation: 公开了一种涉及称为结构电路的多功能结构电路的方法。 该方法可以包括用结构元件（215）热成型液晶聚合物（LCP）电路。 至少一个电路部件可以附接到LCP电路（220）的表面。

公开(公告)号：US20070248829A1

公开(公告)日：2007-10-25

申请号：US11575262

申请日：2005-09-07

Applicant: Goh Iwamoto ,  Hideki Hirotsuru ,  Kazunori Hirahara

Inventor： Goh Iwamoto ,  Hideki Hirotsuru ,  Kazunori Hirahara

IPC: B32B9/00

CPC classification number: H05K1/05 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  H01L23/13 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/09018 ,  Y10T428/12007 ,  Y10T428/249957 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/26 ,  C04B35/565 ,  C04B38/00 ,  C04B41/4521 ,  C04B41/4523 ,  H01L2924/00

Abstract: An aluminum/silicon carbide composite prepared by infiltrating a flat silicon carbide porous body with a metal containing aluminum as the main component, including an aluminum alloy layer made of a metal containing aluminum as the main component on both principal planes, and one principal plane is bonded to a circuit plate and the other principal plane is utilized as a radiation plane. The silicon carbide porous body is formed or machined into a convexly bowed shape, and after infiltration with the metal containing aluminum as the main component, the aluminum alloy layer on the radiation plane is further machined to form the bow shape. The aluminum/silicon carbide composite is suitable as a base plate for a ceramic circuit plate on which semiconductor components are mounted, for which high reliability is required.

Abstract translation: 通过以包含铝作为主要成分的金属浸渍扁平碳化硅多孔体制备的铝/碳化硅复合体，包括由铝构成的金属作为主要成分在两个主平面上的铝合金层和一个主平面， 结合到电路板，另一个主平面用作辐射平面。 碳化硅多孔体形成或加工成凸形状，并且在以含有铝的金属为主要成分的渗透后，辐射面上的铝合金层进一步加工成弓形。 铝/碳化硅复合材料适合作为安装半导体元件的陶瓷电路板的基板，需要高可靠性。

公开(公告)号：US20070221329A1

公开(公告)日：2007-09-27

申请号：US11585287

申请日：2006-10-23

Applicant: Kazuo Sakuma ,  Inetaro Kurosawa ,  Kiyoshi Hyodo

Inventor： Kazuo Sakuma ,  Inetaro Kurosawa ,  Kiyoshi Hyodo

IPC: H01L21/306 ,  B44C1/22

CPC classification number: H05K3/0085 ,  H01L21/6708 ,  H01L21/67706 ,  H01L21/67721 ,  H01L21/6776 ,  H05K1/0393 ,  H05K3/068 ,  H05K2201/09018 ,  H05K2203/0746 ,  H05K2203/1572

Abstract: An apparatus and method are provided for processing an item by distributing a liquid onto a surface of the item. The apparatus includes a conveyor which defines an undulating path which varies in vertical position relative to the direction of movement of the item conveyable along the path. Thus, the path has at least one apex at a location of the path higher than other locations in the direction of movement along the path. A sprayer is operable to spray the liquid onto the surface of the item at a location that is substantially aligned to the apex of the path.

Abstract translation: 提供了一种通过将液体分配到物品的表面上来处理物品的装置和方法。 该设备包括一个输送机，该输送机限定了一个波浪路径，该波纹路径相对于沿该路径可传送的物品的移动方向在垂直位置上变化。 因此，路径在路径的位置处具有比沿着路径的移动方向上的其他位置更高的位置处的至少一个顶点。 喷雾器可操作以在基本上与路径的顶点对准的位置处将液体喷射到物品的表面上。

公开(公告)号：US20070049130A1

公开(公告)日：2007-03-01

申请号：US11510591

申请日：2006-08-28

Applicant: Toshiya Kojima ,  Gentaro Furukawa

Inventor： Toshiya Kojima ,  Gentaro Furukawa

IPC: H01R13/40

CPC classification number: H05K3/06 ,  B41J2/14233 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/18 ,  H05K1/0265 ,  H05K3/041 ,  H05K3/061 ,  H05K3/107 ,  H05K3/244 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09236 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/1527

Abstract: The wiring substrate comprises: a recess section and a projecting section formed on at least one surface of the wiring substrate; and wires formed on both the recess section and the projecting section.

Abstract translation: 布线基板包括：形成在布线基板的至少一个表面上的凹部和突出部; 以及形成在所述凹部和所述突出部两者上的线。

公开(公告)号：US20060104037A1

公开(公告)日：2006-05-18

申请号：US10987285

申请日：2004-11-12

Applicant: C.W. Smith ,  Paul Jaynes ,  Charles Newton ,  Travis Kerby

Inventor： C.W. Smith ,  Paul Jaynes ,  Charles Newton ,  Travis Kerby

IPC: H05K7/00 ,  H05K3/30

CPC classification number: H05K3/0014 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S156/924 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T156/1189 ,  Y10T428/10 ,  Y10T428/1005

Abstract: A method and apparatus relating to a multi-functional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).

Abstract translation: 公开了一种涉及称为结构电路的多功能结构电路的方法和装置。 该方法可以包括用结构元件（215）热成型液晶聚合物（LCP）电路。 至少一个电路部件可以附接到LCP电路（220）的表面。

公开(公告)号：US20050272277A1

公开(公告)日：2005-12-08

申请号：US11203988

申请日：2005-08-16

Applicant: Makoto Toyota ,  Shin Toyoda ,  Hitoshi Yoshida

Inventor： Makoto Toyota ,  Shin Toyoda ,  Hitoshi Yoshida

IPC: G03B15/02 ,  F21S2/00 ,  F21S8/04 ,  F21Y101/02 ,  H01L33/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01R33/00

CPC classification number: H05K1/189 ,  F21K9/00 ,  F21Y2107/10 ,  G01N21/8806 ,  G01N2201/062 ,  H05K3/3447 ,  H05K2201/09018 ,  H05K2201/09263 ,  H05K2201/10106 ,  Y10S385/901

Abstract: A flexible wiring substrate forms a light emitting device array attached to a frustoconical inner circumferential surface that serves as a light emitting device arranging surface of an annual oblique light illumination apparatus. A plurality of arcuate zonal wiring patterns for mounting light emitting devices are provided. Each wiring pattern is in the form of a developed frustoconical shape. The wiring patterns are serpiginously provided continuously directly or by way of connecting wiring patterns to a base film of a predetermined shape.

Abstract translation: 柔性布线基板形成附着于作为年度斜光照明装置的发光元件配置面的截头圆锥内周面的发光元件阵列。 提供了用于安装发光装置的多个弧形区带布线图案。 每个布线图案都是开发的截头圆锥形的形式。 布线图形是直接连续地连接或通过将布线图案连接到预定形状的基底膜上。

公开(公告)号：US06972207B2

公开(公告)日：2005-12-06

申请号：US10806284

申请日：2004-03-23

Applicant: Makoto Toyota ,  Shin Toyoda ,  Hitoshi Yoshida

Inventor： Makoto Toyota ,  Shin Toyoda ,  Hitoshi Yoshida

IPC: G03B15/02 ,  F21S2/00 ,  F21S8/04 ,  F21Y101/02 ,  H01L33/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  G06K9/00 ,  G01

CPC classification number: H05K1/189 ,  F21K9/00 ,  F21Y2107/10 ,  G01N21/8806 ,  G01N2201/062 ,  H05K3/3447 ,  H05K2201/09018 ,  H05K2201/09263 ,  H05K2201/10106 ,  Y10S385/901

Abstract: An annular oblique light illumination apparatus manufactured by using a flexible wiring substrate in which a plurality of arcuate zonal wiring patterns each in the form of a developed frustconical shape as a light emitting device arranging surface when cut along the pattern are serpiginously formed continuously to a base film of a predetermined shape, by setting and soldering light emitting devices to the arcuate zonal wiring patterns, cutting out the arcuate zonal wiring patterns to form light emitting device arrays and fixing the same to the arranging surface, whereby the wiring substrate can be supported reliably without using any special jig conforming the arcuate shape of the wiring patterns for mounting the light emitting devices, thereby improving the soldering operation efficiency, saving the troubles of exchange and handling of jigs and further, avoiding slackening or distortion of the wiring substrate even in a case of applying soldering by a flow soldering apparatus.

Abstract translation: 通过使用柔性布线基板制造的环形斜光照明装置，其中沿着图案切割时，以展开的截头圆锥形状的多个弧形区带布线图案作为发光装置布置表面被连续地形成为基部 通过将发光装置设置并焊接到弧形区带布线图案，切割出弧形的区域布线图案以形成发光装置阵列并将其固定到布置表面，由此可以可靠地支撑布线基板 不使用符合用于安装发光器件的布线图形的弓形形状的任何特殊的夹具，从而提高焊接操作效率，从而节省夹具的更换和处理的麻烦，并且即使在布线基板中也避免了布线基板的松弛或变形 通过流动焊接装置进行焊接的情况。

公开(公告)号：US20050098857A1

公开(公告)日：2005-05-12

申请号：US10983934

申请日：2004-11-08

Applicant: Kazuno Shoji

Inventor： Kazuno Shoji

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/09 ,  H05K3/00 ,  H01L21/302 ,  H01L29/40

CPC classification number: H01L21/302 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2203/1105 ,  H05K2203/1327 ,  H05K2203/302

Abstract: A three-dimensionally formed circuit sheet comprises a resin film and a circuit pattern formed of an electrically conductive paste on the resin film. The electrically conductive paste contains, as a binder, a resin that is three-dimensionally formable. The resin film and the circuit pattern are formed in a three-dimensional shape. A method for manufacturing the three-dimensionally formed circuit sheet is also provided. The method comprises forming a circuit pattern on a resin film using an electrically conductive paste by means of printing, wherein the electrically conductive paste contains a resin that is three-dimensionally formable, and press molding the resin film including the circuit pattern into a three-dimensional shape. Additionally, a three-dimensionally formed circuit component comprising a three-dimensionally formed circuit sheet and a base member and a method for manufacturing the same are disclosed.

Abstract translation: 三维形成的电路板包括树脂膜和由树脂膜上的导电糊形成的电路图案。 作为粘合剂的导电性糊剂含有三维可成形的树脂。 树脂膜和电路图案形成为三维形状。 还提供了一种用于制造三维形成的电路板的方法。 该方法包括使用导电浆料通过印刷在树脂膜上形成电路图案，其中导电浆料含有可立体成型的树脂，并且将包含电路图案的树脂膜压制成三维形状， 尺寸形状。 此外，公开了一种三维形成的电路元件及其制造方法，该电路元件包括三维形成的电路片和基底元件。

公开(公告)号：US06633078B2

公开(公告)日：2003-10-14

申请号：US09979188

申请日：2001-11-20

Applicant: Tsuneo Hamaguchi ,  Kenji Kagata

Inventor： Tsuneo Hamaguchi ,  Kenji Kagata

IPC: H01L2302

CPC classification number: H05K3/3436 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14609 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K2201/09018 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.

Abstract translation: 半导体器件包括形成在布线基板的一个表面上以具有规定高度的突出电极，厚度小于突出电极的高度的半导体芯片，以及厚度大于半导体的厚度的电子部件 并且安装在布线基板的另一个表面上，使得布线基板在一个表面处翘曲成凹陷。 因此，确保半导体芯片和安装板之间的刚性以及间隔。 此外，具有安装在布线基板的两个表面上的逻辑LSI的半导体器件安装在具有插入其中具有规定高度的突出电极的外壳中的安装板上，其中布线基板翘曲以在具有 投影电极