Abstract:
The printed wiring board has a conductor of signal line 41 and two conductive lines 42 on one face of the first insulating layer 10 covered by a second insulating layer 20, while having a ground layer of the ground 30 potential on the opposite face thereof, when the dielectric tangent A of the second insulating layer (insulating layer A) 20 is larger than the dielectric tangent B of the first insulating layer (insulating layer B) 10, Relational Expression 1: (relative permittivity B)·(width (W41) of signal line(s) 41)/(thickness (T10) of first insulating layer (insulating layer B) 10)>(relative permittivity A)·{(thickness (T41) of signal line(s) 41)/(distance (S1) between signal line(s) 41 and one conductive line 42a)+(thickness (T41) of signal line(s) 41)/(distance (S2) between signal line(s) 41 and other conductive line 42b)+(thickness (T41) of signal lines 41)/(distance (S3) between pair of signal lines (41a and 41b)·2} is satisfied.
Abstract:
An electrical probe assembly includes a flexible circuit. A plurality of electrically conductive regions is on a first side of the flexible circuit. The flexible circuit is arranged about an axis formed by rolling the flexible circuit such that the electrically conductive regions form a plurality of isolated electrically conductive bands.
Abstract:
It is impossible to make a wiring board for noise suppression thinner, therefore, a wiring board according to an exemplary aspect of the invention includes a first wiring layer, an intermediate layer, and a second wiring layer; wherein the second wiring layer, the intermediate layer, and the first wiring layer are stacked in this order; the first wiring layer comprises a first wiring and a second wiring separated from the first wiring; the intermediate layer comprises a first via and a second via; the second wiring layer comprises a third wiring and a non-wiring portion where wirings are not formed; the first wiring is separated from the third wiring; the first via and the second via electrically connect the second wiring to the third wiring respectively; the non-wiring portion is located at a portion corresponding to an area between the first via and the second via; and the first wiring and the second wiring cross over the non-wiring portion.
Abstract:
A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.
Abstract:
An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, first and second resistors, first and second vias, and a pair of micro-strips. When a signal transmitted by the circuit board is received by the input pins, a first part of the signal is directly outputted from the output pins, a second part of the signal is reflected by the first resistor and transmitted back to the output pins to be outputted, and a third part of the signal is reflected by the second resistor and transmitted back to the output pins to be outputted, such that the output of the equalizer applies two stages of compensation.
Abstract:
A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
Abstract:
A network cable jack includes a printed circuit board (PCB) for balancing both inductive and capacitive coupling. Using a PCB allows compact trace paths to be formed without significantly increasing manufacturing costs. By including on each trace path two distinct inductance zones separated by a neutral zone, significant gains in degrees of freedom are achieved for designing PCB trace patterns in which a pair of inductive coupling zones jointly offset the inductive coupling caused by a specification plug and the jack contacts, both in magnitude and phase angle. Further, using distinct inductance zones offers more freedom regarding the placement of capacitive plates for use in capacitance balancing as well as the placement of terminals and insulation displacement contacts. Although the magnitude of a capacitive coupling is determined by the length of the capacitor plates parallel to current carrying traces, the approach allows capacitive and inductive coupling to be balanced independently.
Abstract:
It is an object of this invention to provide an FPC capable of improving tamper resistance. An FPC (1) of this invention includes: a signal line pattern (2) for inputting a communication signal; and signal protective line patterns (3, 4) provided to be opposed to an upper surface and a lower surface of the signal line pattern and having the same width as a width of the signal line pattern (2) or a larger width than the width of the signal line pattern (2). The signal protective line patterns are provided along the signal line pattern within a region that requires tamper resistance.
Abstract:
A FPCB includes a signal layer, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. At least one high speed signal transmission line is formed on the signal layer. The ground layer has a copper-removed area corresponding to the transmission line. Two ground lines are symmetrically disposed at two opposite sides of the signal transmission line and substantially parallel to the signal transmission line, each ground line and the signal transmission line is spaced at a first predetermined distance. Each ground line and the signal transmission line are spaced at a first predetermined distance.
Abstract:
A printed circuit board includes a signal layer having a pair of differential transmission lines thereon. An eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines are variable according to a distance between the pair of differential transmission lines. The eye width and the eye height of the eye diagram are at minimum values when the distance between the pair of differential transmission lines is at a first distance. The eye width and the eye height meet requirements of the pair of differential transmission lines for the eye diagram when the distance between the pair of differential transmission lines is set at a second distance, the second distance is less than the first distance.