公开(公告)号：US20140139445A1

公开(公告)日：2014-05-22

申请号：US13682692

申请日：2012-11-20

Applicant: JIADONG CHEN ,  Pingping Huang ,  Jianxing Luo ,  Yau-Chen Jiang

Inventor： JIADONG CHEN ,  Pingping Huang ,  Jianxing Luo ,  Yau-Chen Jiang

IPC: G06F3/0488 ,  H01H65/00

CPC classification number: H01H65/00 ,  G06F3/0202 ,  G06F3/041 ,  G06F2203/04103 ,  H01L23/544 ,  H01L2924/0002 ,  H01R12/62 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4638 ,  H05K2201/09918 ,  H05K2201/10053 ,  H05K2201/10128 ,  H05K2203/166 ,  Y10T29/49105 ,  H01L2924/00

Abstract: The present disclosure provides a touch sensing device and a method for fabricating the same. The touch sensing device comprises a touch panel and a flexible printed circuit board, wherein the touch panel comprises a first bonding mark and the flexible printed circuit board has a bonding surface bonded to the touch panel and has a non-bonding surface. The flexible printed circuit board comprises a second bonding mark disposed on the non-bonding surface. The second bonding mark and the first bonding mark have a relationship of contraposition.

Abstract translation: 本公开提供了一种触摸感测装置及其制造方法。 所述触摸感测装置包括触摸面板和柔性印刷电路板，其中所述触摸面板包括第一接合标记，并且所述柔性印刷电路板具有结合到所述触摸面板并具有非接合表面的接合表面。 柔性印刷电路板包括设置在非接合表面上的第二接合标记。 第二接合标记和第一接合标记具有相反的关系。

公开(公告)号：US20140124242A1

公开(公告)日：2014-05-08

申请号：US13885928

申请日：2012-05-16

Applicant: Tatsuya Ito ,  Seiji Mori ,  Takahiro Hayashi ,  Makoto Wakazono ,  Tomohiro Nishida

Inventor： Tatsuya Ito ,  Seiji Mori ,  Takahiro Hayashi ,  Makoto Wakazono ,  Tomohiro Nishida

IPC: H05K1/02

CPC classification number: H05K1/0213 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2201/099 ,  H05K2201/09918 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals.

Abstract translation: 根据本发明的布线基板包括一个或多个绝缘层和一个或多个导电层的层叠体，并且还包括形成在层压体上并彼此间隔开的多个连接端子，每个连接端子形成在外部 与层叠体接触的与接触面相反的第一主表面的周边，以及以连接端子之间的填充方式设置的填充构件。

公开(公告)号：US20140115886A1

公开(公告)日：2014-05-01

申请号：US13662130

申请日：2012-10-26

Applicant: VOLEX PLC ,  APPLIED MICRO CIRCUITS CORPORATION

Inventor： Benoit SEVIGNY

IPC: H05K3/30 ,  B23K26/36

CPC classification number: H05K3/303 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09918 ,  H05K2203/107 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49133 ,  Y10T29/53174

Abstract: A method and system for pre-marking a substrate to provide a visual reference enabling repetitive and accurate component placement on one or more substrates. The method for marking includes determining a first location on a substrate for placing a component relative to a cut outline of the substrate. The method includes placing a fiducial at a second location on the substrate to provide a known dimensional reference to the first location, such that the fiducial and the first location are configured to be in a field-of-view of a component placement machine.

Abstract translation: 一种用于对基底进行预标记以提供可在一个或多个基底上重复和准确地分量放置的视觉参考的方法和系统。 标记的方法包括确定衬底上的第一位置以相对于衬底的切割轮廓放置部件。 该方法包括将基准放置在基板上的第二位置以提供对第一位置的已知尺寸参考，使得基准和第一位置被配置为处于元件放置机器的视野中。

公开(公告)号：US08698009B2

公开(公告)日：2014-04-15

申请号：US13435450

申请日：2012-03-30

Applicant: Kota Noda ,  Tsutomu Yamauchi

Inventor： Kota Noda ,  Tsutomu Yamauchi

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger.

Abstract translation: 一种布线板，具有通过从基板的两个表面形成具有不同形状的孔而形成的贯通孔。 在这样的贯通孔中，形成在基板的第一表面侧的第一开口部的深度比形成在第二表面侧的第二开口部的深度浅，第一开口的直径更大 比第二开口的直径。 即使第一开口部分的重力线和第二开口部分的重力线彼此偏移，可以使插入第一开口部分的内部空间的第二开口部分的区域更大。

公开(公告)号：US20130328994A1

公开(公告)日：2013-12-12

申请号：US13910852

申请日：2013-06-05

Applicant: Tom MARTTILA

Inventor： Tom MARTTILA

IPC: B41J2/045

CPC classification number: B41J2/04505 ,  B23K26/032 ,  B23K26/0846 ,  B41J11/46 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0097 ,  H05K3/046 ,  H05K2201/0355 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0522 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/1545

Abstract: A laser process alignment measuring method applicable to a reel-to-reel manufacturing process including a laser process stage, wherein before at least one laser process stage, marks, patterns or surfaces (4,9) are made with printing ink on the base or carrier material of the web (2), and on which the laser beam used can make a mark (7, 10), for example, by removing or changing the printing ink, whereby at the laser process stage, another mark is plotted with the laser beam on the mark et al. printed with printing ink, and the position of the mark et al. printed with printing ink (4, 9) and the mark plotted with the laser (7, 10) are read optically to measure the alignment of the printing ink stage and the laser process stage.

Abstract translation: 一种适用于包括激光处理台的卷对卷制造过程的激光工艺对准测量方法，其中在至少一个激光加工台，标记，图案或表面（4,9）之前用印刷油墨制成在基座上， 纤维网（2）的载体材料，并且其上使用的激光束可以通过例如去除或改变印刷油墨来形成标记（7,10），由此在激光处理阶段，绘制另一个标记 激光束在标记等 印有印刷油墨，标记等的位置。 用印刷油墨（4,9）印刷并用激光（7,10）绘制的标记被光学读出以测量印刷油墨台和激光加工台的对准。

公开(公告)号：US20130286367A1

公开(公告)日：2013-10-31

申请号：US13929505

申请日：2013-06-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Michael A. Haase ,  Jeffrey H. Tokie ,  Daniel J. Theis ,  Brian K. Nelson

IPC: G03F7/20

CPC classification number: G03F7/70516 ,  G03F7/22 ,  G03F7/70791 ,  G03F9/7003 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0082 ,  H05K2201/09918 ,  H05K2203/1545 ,  H05K2203/163 ,  H05K2203/166

Abstract: A system for making flexible circuit films includes an inelastic conveyor, a web handling apparatus configured to pass a flexible substrate around the inelastic conveyor, an image acquisition apparatus configured to measure positions of a first set of alignment marks on the flexible substrate at a first conveyor location, an exposure apparatus configured to patternwise expose a photosensitive material on the flexible substrate at a second conveyor location, and an image processor configured to receive the measured positions of the first set of alignment marks, and to compare the measured positions with reference positions of the first set of alignment marks. The exposure apparatus is configured to patternwise expose the photosensitive material based on the comparison between the measured positions and the reference positions.

Abstract translation: 一种用于制造柔性电路膜的系统包括非弹性输送机，配置成使柔性基板围绕非弹性输送机通过的幅材处理设备，被配置成在第一输送机上测量柔性基板上的第一组对准标记的位置的图像采集设备 位置，曝光装置被配置为在第二传送器位置以图形方式在柔性基板上曝光感光材料，以及图像处理器，被配置为接收第一组对准标记的测量位置，并将测量位置与参考位置 第一组对齐标记。 曝光装置被配置为基于测量位置和参考位置之间的比较来图案化地曝光感光材料。

公开(公告)号：US20130242516A1

公开(公告)日：2013-09-19

申请号：US13824437

申请日：2010-10-01

Applicant: Meiko Electronics Co., LTD.

Inventor： Yoshio Imamura ,  Tohru Matsumoto ,  Ryoichi Shimizu

IPC: H05K13/00 ,  H05K1/16

CPC classification number: H05K13/00 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L2221/68359 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83132 ,  H05K1/0269 ,  H05K1/16 ,  H05K1/188 ,  H05K2201/09781 ,  H05K2201/09918

Abstract: A thin conductive layer which is to form a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except a plurality of actual connection spots and at least one dummy connection spot on the conductive layer, actual solder pads (6) and a dummy solder pad (7) are formed, with use of solder, on the actual connection spots and the dummy connection spot, respectively, where the conductive layer is exposed, connection terminals (9) of an electric or electronic component (8) are connected to the actual solder pads (6), an insulating base (16) of resin is formed which is laminated directly on or indirectly via the mask layer (3) on the conductive layer and in which the component (8) is embedded, and part of the conductive layer is removed by using the dummy solder pad (7) as a reference, to form the conductor pattern (18).

Abstract translation: 准备形成导体图案（18）的薄导电层，除了导电层上的多个实际连接点和至少一个虚设连接点之外，在导电层上形成掩模层（3），实际焊料 在导电层暴露的实际连接点和虚拟连接点上，使用焊料形成焊盘（6）和虚拟焊盘（7），电或电子的连接端子（9） 组件（8）连接到实际的焊盘（6），形成树脂的绝缘基底（16），其直接层压在导电层上或通过掩模层（3）间接地层叠，其中部件（8） ），并且通过使用虚拟焊盘（7）作为参考来去除导电层的一部分，以形成导体图案（18）。

公开(公告)号：US08525356B2

公开(公告)日：2013-09-03

申请号：US12968405

申请日：2010-12-15

Applicant: Junichi Nakamura ,  Kazuhiro Kobayashi

Inventor： Junichi Nakamura ,  Kazuhiro Kobayashi

IPC: H01L23/544

CPC classification number: H05K3/10 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/544 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/81132 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0269 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4682 ,  H05K2201/09918 ,  H05K2203/025 ,  H05K2203/0361 ,  H05K2203/1152 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess.

Abstract translation: 所公开的布线基板包括绝缘层，形成在绝缘层的表面上的凹部和形成在凹部内部的对准标记，其中对准标记的表面被粗糙化，从绝缘层的表面凹陷， 从凹槽露出。

公开(公告)号：US20130176692A1

公开(公告)日：2013-07-11

申请号：US13822648

申请日：2011-09-14

Applicant: Nikolai Haslebner ,  Markus Leitgeb ,  Michael Gossler ,  Mike Morianz

Inventor： Nikolai Haslebner ,  Markus Leitgeb ,  Michael Gossler ,  Mike Morianz

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K1/0266 ,  H01L2224/2518 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/115 ,  H05K1/14 ,  H05K1/18 ,  H05K1/182 ,  H05K1/189 ,  H05K3/36 ,  H05K3/4638 ,  H05K3/4688 ,  H05K2201/0355 ,  H05K2201/058 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/166 ,  Y10T29/49126

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract translation: 对于用于制造由多个电路板区域组成的电路板的方法，其中各电路板区域包括至少一层由绝缘基底材料制成的层和位于基底材料上的导电图案，下面是 提供：衬底材料，形成在衬底材料中的至少一个对准标记，布置在衬底材料上的第一电路板区域，至少一个额外的电路板区域，其基本上邻接第一电路板区域或至少部分地与第一电路板区域重叠 第一电路板，附加电路板区域相对于对准标记定向，以及多个第一电路板区域和至少一个附加电路板区域的导电图案的连接。 因此，当电路板区域耦合时，可以实现改进的配准和取向。

公开(公告)号：US20130093990A1

公开(公告)日：2013-04-18

申请号：US13376605

申请日：2011-10-27

Applicant: Shyhfeng Chen ,  Cheng-Hung Chen ,  Jinjie Wang

Inventor： Shyhfeng Chen ,  Cheng-Hung Chen ,  Jinjie Wang

IPC: G02F1/1345

CPC classification number: G02F1/13458 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09709 ,  H05K2201/09918

Abstract: A liquid crystal display module is provided, which includes a display panel. The display panel disposes a plurality of panel solder pads. Two ends of each panel solder pad both dispose a wire longitudinally extending. The length of each panel solder pad longitudinally extends along a wire direction. The module further includes a FPC board, which has a plurality of FPC board solder pads. The FPC board solder pads and the panel solder pads are soldered together in a one-to-one corresponding relational manner after being aligned with each other by a machine. Two adjacent panel solder pads are stagger arranged along the wire direction. A distance between one panel solder pad and the corresponding wire of the other panel solder pad along the direction perpendicular to the wire is greater than a minimum of an alignment precision of the machine. A liquid crystal display panel is also provided.

Abstract translation: 提供一种包括显示面板的液晶显示模块。 显示面板配置多个面板焊盘。 每个面板焊盘的两端均布置纵向延伸的导线。 每个面板焊盘的长度沿线方向纵向延伸。 该模块还包括FPC板，其具有多个FPC板焊盘。 FPC板焊盘和面板焊盘在通过机器彼此对准之后以一对一的对应关系方式被焊接在一起。 两个相邻的面板焊盘沿着线方向错开。 一个面板焊盘和另一个面板焊盘的相对应的线沿垂直于导线的方向的距离大于机器的对准精度的最小值。 还提供了一种液晶显示面板。