公开(公告)号：US20090047804A1

公开(公告)日：2009-02-19

申请号：US11958948

申请日：2007-12-18

Applicant: Chin-Chi Kuo ,  Chi-Ming Chin

Inventor： Chin-Chi Kuo ,  Chi-Ming Chin

IPC: H01R12/00

CPC classification number: H01R12/57 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10242 ,  H05K2201/10946 ,  Y02P70/613

Abstract: The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first connecting part, a second connecting part and a sidewall. The first connecting part is bonded onto the first circuit board. The second connecting part has a conductive surface bonded onto the second circuit board. The sidewall has a first end axially extended from a periphery of the second connecting part and a second end being formed as at least a portion of the first connecting part.

Abstract translation: 本发明涉及一种用于电连接第一电路板和第二电路板的表面安装连接器。 表面安装连接器包括第一连接部分，第二连接部分和侧壁。 第一连接部分接合在第一电路板上。 第二连接部分具有接合到第二电路板上的导电表面。 侧壁具有从第二连接部分的周边轴向延伸的第一端部和形成为第一连接部件的至少一部分的第二端部。

公开(公告)号：US20080251281A1

公开(公告)日：2008-10-16

申请号：US11733840

申请日：2007-04-11

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H05K1/03 ,  H01K3/10

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电气结构和成型方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US20070123067A1

公开(公告)日：2007-05-31

申请号：US11657995

申请日：2007-01-25

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

公开(公告)号：US07189079B2

公开(公告)日：2007-03-13

申请号：US11140195

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环被焊接到基板和装置两者，并且在制造期间通过柔性非导电膜保持在适当的位置，其中形成有H形的切口并且插入导电环。 H形切口的内部部分延伸到导电环中，并在制造过程中将环保持在适当位置。 每个环的侧壁的一部分不被焊接，从而确保环的至少一部分保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20060172565A1

公开(公告)日：2006-08-03

申请号：US10906111

申请日：2005-02-03

Applicant: William Bernier ,  David Eichstadt ,  Mukta Farooq ,  John Knickerbocker

Inventor： William Bernier ,  David Eichstadt ,  Mukta Farooq ,  John Knickerbocker

IPC: H01R12/00

CPC classification number: H01L24/13 ,  G01R1/06716 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/114 ,  H01L2224/11505 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K3/06 ,  H05K3/3436 ,  H05K2201/10242 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of forming compliant electrical contacts includes patterning a conductive layer into an array of compliant members. The array of compliant members is then positioned to be in contact with electrical connection pads on an integrated circuit wafer and the compliant members are joined to the pads. Then, the supporting layer that supported the compliant members is removed to leave the compliant members connected to the pads.

Abstract translation: 形成顺应性电触头的方法包括将导电层图案化为顺应构件阵列。 然后将顺应构件阵列定位成与集成电路晶片上的电连接焊盘接触，并且柔性构件连接到焊盘。 然后，移除支撑柔顺构件的支撑层，以使与柔性构件连接的衬垫离开。

公开(公告)号：US20020158722A1

公开(公告)日：2002-10-31

申请号：US10133326

申请日：2002-04-29

Inventor： Kenichi Maruhashi ,  Masaharu Ito ,  Keiichi Ohata ,  Kazuhiro Ikuina ,  Takeya Hashiguchi

IPC: H01P003/08

CPC classification number: H01P5/185 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01P5/187 ,  H01Q13/10 ,  H05K1/0237 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0379 ,  H05K2201/0969 ,  H05K2201/10242 ,  H05K2201/10416 ,  H01L2224/0401

Abstract: A high frequency circuit substrate comprises a first high frequency circuit substrate including at least a first dielectric material layer, a first conductor layer, a second dielectric material layer and a second conductor layer, which are laminated in the named order, the first conductor layer having a first slot formed therein, and the second conductor layer forming a transmission line, the first dielectric material layer having a first opening exposing the first slot at its bottom. The high frequency circuit substrate also comprises a second high frequency circuit substrate including at least a third dielectric material layer, a third conductor layer, a fourth dielectric material layer and a fourth conductor layer, which are laminated in the named order, the third conductor layer having a second slot formed therein, and the fourth conductor layer forming a transmission line, the third dielectric material layer having a second opening exposing the second slot at its bottom. The first high frequency circuit substrate and the first high frequency circuit substrate are bonded to each other in such a manner that the first dielectric material layer and the third dielectric material layer are faced to each other and the first slot and the second slot are electromagnetically coupled, by inserting one side and the other side of a conductor plate having a through hole into the first opening and the second opening, respectively.

Abstract translation: 高频电路基板包括第一高频电路基板，该第一高频电路基板至少包括第一电介质材料层，第一导体层，第二介电材料层和第二导体层，其按顺序层叠，所述第一导体层具有 形成在其中的第一槽，并且所述第二导体层形成传输线，所述第一介电材料层具有在其底部暴露所述第一槽的第一开口。 高频电路基板还包括第二高频电路基板，其包括按照所述顺序层压的至少第三电介质材料层，第三导体层，第四电介质层和第四导体层，第三导体层 具有形成在其中的第二槽，并且所述第四导体层形成传输线，所述第三介电材料层具有在其底部暴露所述第二槽的第二开口。 第一高频电路衬底和第一高频电路衬底彼此接合，使得第一电介质材料层和第三电介质材料层彼此面对，并且第一槽和第二槽电磁耦合 通过将具有通孔的导体板的一侧和另一侧分别插入第一开口和第二开口中。

公开(公告)号：US6045368A

公开(公告)日：2000-04-04

申请号：US88010

申请日：1998-06-01

Applicant: Jonathan Cadenhead ,  Terry Richard Fleegle ,  Michael Carlos Menard

Inventor： Jonathan Cadenhead ,  Terry Richard Fleegle ,  Michael Carlos Menard

IPC: H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01R12/62 ,  H05K3/363 ,  H05K2201/10204 ,  H05K2201/10242 ,  H05K2203/167 ,  H05K3/341 ,  H05K3/4015 ,  Y10S439/931 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: An electrical circuit includes a substrate having at least two alignment pads on the substrate that are accurately aligned with a first set of electrical interconnect pads, and also includes a corresponding number of alignment posts that are cylindrical and have flat bases that are geometrically similar to and smaller than a corresponding shape of each of the at least two alignment pads by a predetermined solder fillet radius. Each of the at least two alignment posts is reflow soldered to one of the at least two alignment pads. An electrical part can be accurately aligned to the substrate using the alignment posts, during attachment of the electrical part.

Abstract translation: 电路包括具有至少两个对准焊盘的衬底，衬底上的至少两个对准焊盘与第一组电互连衬垫精确对准，并且还包括相应数量的对准柱，其为圆柱形并且具有几何等同于 小于所述至少两个对准焊盘中的每一个的相应形状，并通过预定的焊料圆角半径。 所述至少两个对准柱中的每一个被回流焊接到所述至少两个对准焊盘中的一个。 在电气部件的附接期间，可以使用对准柱将电气部件精确地对准到基板。

公开(公告)号：US5959355A

公开(公告)日：1999-09-28

申请号：US954696

申请日：1997-10-20

Applicant: Luc Petit

Inventor： Luc Petit

IPC: H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H05K3/3436 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2924/09701 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K3/321 ,  Y02P70/613

Abstract: A semiconductor package having an array of solder pads and supportive elements that are mechanically and electrically bonded to the solder pads and that do not collapse during the bonding process, wherein the supportive elements are annular.

Abstract translation: 一种半导体封装，其具有焊接焊盘和支撑元件的阵列，所述焊盘和支撑元件机械地和电气地结合到所述焊盘并且在所述接合过程期间不会折叠，其中所述支撑元件是环形的。

公开(公告)号：US5477086A

公开(公告)日：1995-12-19

申请号：US55429

申请日：1993-04-30

Applicant: Michael D. Rostoker ,  Nicholas F. Pasch

Inventor： Michael D. Rostoker ,  Nicholas F. Pasch

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC classification number: H01L24/12 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/4007 ,  H01L2221/68313 ,  H01L2224/13099 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K2201/09745 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/048 ,  H05K3/4015 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12361

Abstract: Positive mechanical alignment is provided between substrates using micro-bump contacts by forming "detented" conductive bump contacts on one substrate having a concave end which receive and align the generally convex contour of bump contacts on the other substrate. Various configurations of concavities and convexities are described. Flux may be disposed in the concave end of the detented bump contact to promote formation of joints between the concave and convex bump contacts. Both bump contacts may be formed of reflowable material, such as solder, or one or the other of the contacts may be formed of a non-reflowable material which may also function as a standoff between the two substrates. Each substrate is provided with a plurality of bump contacts, and one substrate may be provided with a combination of convex and concave bump contacts corresponding to concave and convex bump contacts on the other substrate. The inventive technique is useful for joining die-to-die, die-to-substrate, or package-to-substrate.

Abstract translation: 通过在具有凹端的一个基板上形成“定位”的导电凸块触点，在衬底之间提供正的机械对准，使用微凸块触点，该凹入端接收并对准另一个基板上的凸块触点的大致凸形轮廓。 描述各种凹凸的构造。 通量可以设置在止动凸起接触的凹入端中，以促进凹凸凸点触点之间的接合部的形成。 两个凸起触点可以由可回流材料（例如焊料）形成，或者一个或另一个触点可以由也可用作两个基板之间的间隙的不可回流材料形成。 每个基板设置有多个凸块触点，并且一个基板可以设置有与另一个基板上的凹凸凸点接触对应的凸凸触点的组合。 本发明的技术可用于连接管芯到管芯，管芯到衬底或封装到衬底。

公开(公告)号：US09949373B2

公开(公告)日：2018-04-17

申请号：US15409221

申请日：2017-01-18

Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.

Inventor： Dror Hurwitz ,  Alex Huang

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/03 ,  H05K3/06

CPC classification number: H05K3/007 ,  C25D5/022 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0313 ,  H05K1/115 ,  H05K3/0064 ,  H05K3/064 ,  H05K2201/032 ,  H05K2201/09609 ,  H05K2201/10242 ,  H01L2924/00

Abstract: An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip.