公开(公告)号：US08094458B2

公开(公告)日：2012-01-10

申请号：US12383468

申请日：2009-03-23

Applicant: Courtney R. Furnival

Inventor： Courtney R. Furnival

IPC: H05K1/18 ,  H01F5/00

CPC classification number: H05K1/165 ,  H01F27/266 ,  H01F27/2804 ,  H01F2027/065 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/645 ,  H01L2224/48227 ,  H01L2224/49171 ,  H05K1/0298 ,  H05K2201/10416 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a laterally extending top plate, wherein the bottom plate is fully embedded within the PCB substrate and the two or more posts extend in the PCB substrate from the bottom plate toward the upper surface of the PCB substrate. The top plate contacts an end of each of the two or more posts along the top surface of the PCB substrate.

Abstract translation: 可用于诸如BGA和LGA的半导体封装中的印刷电路板（PCB）基板具有顶表面和底表面。 磁性部件包括横向延伸的底板，两个或更多个垂直延伸的支柱和横向延伸的顶板，其中底板完全嵌入在PCB基板内，并且两个或更多个柱在PCB基板中从底板延伸 朝向PCB基板的上表面。 顶板沿着PCB基板的顶表面接触两个或更多个柱中的每一个的端部。

公开(公告)号：US08071998B2

公开(公告)日：2011-12-06

申请号：US12325661

申请日：2008-12-01

Applicant: Kuei-Fang Chen

Inventor： Kuei-Fang Chen

IPC: H01L33/00

CPC classification number: F21V29/51 ,  F21K9/00 ,  F21V29/505 ,  F21V29/763 ,  F21V29/773 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: A light emitting assembly includes: a heat sink having a base wall and at least one mesa protruding from the base wall; and at least one light emitting package unit having at least one light emitting package bonded to the mesa so as to transfer heat generated from the light emitting package to the base wall through the mesa. A circuit board includes a substrate that is formed with at least one through-hole, and is provided with a conductive contact unit that is formed on the substrate. The heat sink is attached to the substrate such that the mesa protrudes from the base wall into and through the through-hole in the substrate so as to be bonded to the light emitting package.

Abstract translation: 发光组件包括：散热器，具有底壁和从底壁突出的至少一个台面; 以及至少一个具有至少一个发光封装的发光封装单元，其结合到所述台面以便将从所述发光封装产生的热量通过所述台面传递到所述基壁。 电路板包括形成有至少一个通孔的基板，并且设置有形成在基板上的导电接触单元。 散热器附接到基板，使得台面从基壁突出到基板中并穿过基板中的通孔，以便结合到发光封装。

公开(公告)号：US20110294440A1

公开(公告)日：2011-12-01

申请号：US12672624

申请日：2008-09-09

Applicant: Tooru Ishino

Inventor： Tooru Ishino

IPC: H05K7/20 ,  H04B1/38 ,  H05K13/04 ,  H04B1/04

CPC classification number: H05K1/0204 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10969 ,  Y10T29/49117

Abstract: A high power amplifier that has a high heat dissipation effect and is produced at low cost, a wireless transmitter and a wireless transceiver with the high power amplifier and a method for mounting a high power amplifier are provided. The high power amplifier comprises a transistor with lead wires extending from both side surfaces of a mold provided on a heat dissipation member to the outside, a double-sided wiring board of which the heat dissipation member is inserted in an opening of the double-sided wiring board and a wiring pattern on one surface of the double-sided wiring board is electrically connected to the lead wires, and a case for accommodating the double-sided wiring board. Further, the high power amplifier comprises a plate of which one main surface is in contact with an inner wall of the case and the other main surface is connected to the heat dissipation member and a wiring pattern on the other main surface of the double-sided wiring board.

Abstract translation: 提供了具有高散热效果并以低成本生产的高功率放大器，具有高功率放大器的无线发射器和无线收发器以及用于安装高功率放大器的方法。 高功率放大器包括：具有从设置在散热构件上的模具的两个侧表面延伸到外部的导线的晶体管，其中散热构件插入到双面的开口中的双面布线板 布线板和双面布线板的一个表面上的布线图形电连接到引线，以及用于容纳双面布线板的壳体。 此外，高功率放大器包括一个主表面与壳体的内壁接触的板，另一个主表面连接到散热构件，并且在双面的另一个主表面上的布线图案 接线板

公开(公告)号：US20110180841A1

公开(公告)日：2011-07-28

申请号：US13121374

申请日：2008-09-28

Applicant: Yi-Hui Chang ,  Ching-Chien Hao

Inventor： Yi-Hui Chang ,  Ching-Chien Hao

IPC: H01L33/64

CPC classification number: H01L33/64 ,  F21K9/00 ,  F21V19/003 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: The present invention relates to an alternating current driven light emitting diode module. The alternating current driven light emitting diode module includes an alternating current driven light emitting diode chip, a first thermal conduction plate, and a ceramic substrate. The first thermal conduction plate is arranged on the ceramic substrate. The alternating current driven light emitting diode chip is arranged on the first thermal conduction plate. The alternating current driven light emitting diode module has better heat dissipating property and better insulation property.

Abstract translation: 本发明涉及交流驱动发光二极管模块。 交流驱动发光二极管模块包括交流驱动发光二极管芯片，第一导热板和陶瓷基板。 第一导热板设置在陶瓷基板上。 交流驱动发光二极管芯片设置在第一导热板上。 交流驱动发光二极管模块具有更好的散热性能和更好的绝缘性能。

公开(公告)号：US07903425B2

公开(公告)日：2011-03-08

申请号：US11475532

申请日：2006-06-27

Applicant: Daniel Justin Hebel ,  Clifford Allen Gaw ,  Brinda Kumar Ramaiya ,  James Stephen Rutledge

Inventor： Daniel Justin Hebel ,  Clifford Allen Gaw ,  Brinda Kumar Ramaiya ,  James Stephen Rutledge

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0204 ,  H05K2201/09054 ,  H05K2201/10416 ,  H05K2201/1056 ,  H05K2201/10689

Abstract: Heat from the core of a semiconductor chip package mounted on a printed circuit board assembled into a computer system is dissipated to both sides of the printed circuit board. A pair of integrated heat spreaders are disposed at opposite sides of the core, and two heat sinks are positioned at opposite sides of the package. Each of the heat sinks is positioned in thermal communication with one of the heat spreaders to dissipated heat from the core.

Abstract translation: 安装在组装到计算机系统中的印刷电路板上的半导体芯片封装的芯体的热量散发到印刷电路板的两侧。 一对集成的散热器设置在芯的相对侧，并且两个散热器位于封装的相对侧。 每个散热器定位成与一个散热器热连通以从芯部散热。

公开(公告)号：US20100302789A1

公开(公告)日：2010-12-02

申请号：US12473468

申请日：2009-05-28

Applicant: Qing LI ,  Binhai Yu ,  Junzheng Li ,  Lifang Liang ,  Xunli Xia

Inventor： Qing LI ,  Binhai Yu ,  Junzheng Li ,  Lifang Liang ,  Xunli Xia

IPC: F21V29/00 ,  H01J9/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  F21S2/005 ,  F21V23/005 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21V31/04 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/64 ,  H01L2224/48091 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is an LED light source module, comprising a PCB board with electrically conductive pathways, for example wire lines, and at least one through hole; at least one semiconductor light-emitting device; electronic components forming a driving circuit; a metal housing with a groove; and at least one heat sink; wherein the semiconductor light-emitting device is electrically connected to the PCB board, electronic components are disposed on the PCB board, the PCB board is disposed in the groove of the metal housing, the heat sink is disposed in the through hole and connected to the PCB board, the semiconductor light-emitting device is disposed on the upper surface of the heat sink and the bottom of the heat sink is welded with the metal housing.

Abstract translation: 提供了一种LED光源模块，其包括具有导电路径的PCB板，例如导线，以及至少一个通孔; 至少一个半导体发光器件; 形成驱动电路的电子部件; 带槽的金属外壳; 和至少一个散热器; 其特征在于，所述半导体发光元件与所述PCB板电连接，电子部件配置在所述PCB板上，所述PCB板设置在所述金属外壳的所述槽内，所述散热器设置在所述通孔内， PCB板，半导体发光器件设置在散热器的上表面上，并且散热器的底部与金属外壳焊接。

公开(公告)号：US20100264798A1

公开(公告)日：2010-10-21

申请号：US12495683

申请日：2009-06-30

Applicant: QING-HAI RUAN

Inventor： QING-HAI RUAN

IPC: H01J7/24

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V29/74 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: A light emitting diode lamp includes a light emitting diode and a circuit board having a circuit layer and a heat conductive layer. The circuit layer includes at least one mounting area having a first electrode, a second electrode and a heat conductive section spaced from each other. A heat conductive pole is provided corresponding to the heat conductive section. Two opposite ends of the heat conductive pole are thermally attached to the light emitting diode and the heat conductive layer of the circuit board, respectively. A spacing between the heat conductive section and each of the first electrode and the second electrode ranges from 0.7 millimeter to 1.45 millimeters.

Abstract translation: 发光二极管灯包括发光二极管和具有电路层和导热层的电路板。 电路层包括具有第一电极，第二电极和彼此间隔开的导热部分的至少一个安装区域。 对应于导热部分设置导热极。 导热柱的两个相对端分别热连接到电路板的发光二极管和导热层。 导热部分与第一电极和第二电极中的每一个之间的间隔为0.7毫米至1.45毫米。

公开(公告)号：US20100127814A1

公开(公告)日：2010-05-27

申请号：US12639886

申请日：2009-12-16

Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

IPC: H01F27/28

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/266 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 磁性构件嵌入在所述支撑面板中的一个或多个空腔中。 由多个电镀通孔导体提供多层电路与磁性构件周围的多个绕组之间的电连接。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层，来提供该镀铜的有机层的附着力。

公开(公告)号：US20100046231A1

公开(公告)日：2010-02-25

申请号：US12529486

申请日：2008-02-29

Applicant: David M. Medinis

Inventor： David M. Medinis

IPC: F21V29/00

CPC classification number: F21V29/56 ,  F21V29/70 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0272 ,  H05K3/0061 ,  H05K2201/064 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: The invention relates to a LED cooling system that effects cooling of the LED's during use, and helps the LED's have a longer operating function, and uses less electricity for the LED's to operate. The use of cooling also provides a steadier light and has greater efficiency.

Abstract translation: 本发明涉及一种在使用过程中实现LED的冷却的LED冷却系统，并且有助于LED具有更长的操作功能，并且为LED操作使用更少的电力。 冷却的使用也提供了更稳定的光线并且具有更高的效率。

公开(公告)号：US20100046201A1

公开(公告)日：2010-02-25

申请号：US12333302

申请日：2008-12-11

Applicant: Cheng WANG ,  Jin-Shu HUANG

Inventor： Cheng WANG ,  Jin-Shu HUANG

IPC: G09F13/00 ,  F21V21/00

CPC classification number: H05K1/0204 ,  H01L2224/32188 ,  H01L2224/48091 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00014

Abstract: An electronic assembly includes a thermally-conductive substrate, a circuit board device and a plurality of light emitting diode (LED) devices. The circuit board device is disposed on the thermally-conductive substrate. The LED devices are disposed on the thermally-conductive substrate. The LED device includes a plurality of electrical connection portions and at least one thermal connection portion. The electrical connection portions are electrically connected to the circuit board device. The thermal connection portion is thermally connected to the thermally-conductive substrate. The connection locations of the circuit board device connected to the electrical connection portions and the connection location of the thermally-conductive substrate connected to the thermal connection portion are at a same plane. In addition, a backlight module applying the electronic assembly is also provided.

Abstract translation: 电子组件包括导热基板，电路板装置和多个发光二极管（LED）装置。 电路板装置设置在导热基板上。 LED装置设置在导热基板上。 LED装置包括多个电连接部分和至少一个热连接部分。 电连接部电连接到电路板装置。 热连接部分热连接到导热基板。 连接到电连接部分的电路板装置的连接位置和连接到热连接部分的导热基板的连接位置在同一平面。 此外，还提供了应用电子组件的背光模块。