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    Circuit Module with Thermal Casing Systems
    32.
    发明申请
    Circuit Module with Thermal Casing Systems 失效
    具有热套管系统的电路模块

    公开(公告)号：US20090052124A1

    公开(公告)日：2009-02-26

    申请号：US12263060

    申请日：2008-10-31

    Applicant: James Douglas Wehrly, JR. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

    Inventor： James Douglas Wehrly, JR. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

    IPC: H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

    Abstract translation: 灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。 柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。 衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

    Thin module system and method
    33.
    发明授权
    Thin module system and method 有权
    薄模块系统和方法

    公开(公告)号：US07480152B2

    公开(公告)日：2009-01-20

    申请号：US11005992

    申请日：2004-12-07

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: H05K1/11

    CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

    Abstract: A flexible circuit is populated with integrated circuits. Integrated circuits populated on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In a preferred embodiment, the overall module profile does not, consequently, include the thickness of the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flex circuit may be aligned using tooling holes in the flex circuit and substrate. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs.

    Abstract translation: 灵活的电路装有集成电路。 填充在最靠近基板的柔性电路一侧的集成电路在至少部分地设置在优选实施例中是基板中的窗口，凹穴或切割区域。 在优选实施例中，整个模块轮廓不因此包括衬底的厚度。 其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。 柔性电路可以使用柔性电路和基板中的加工孔对准。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。 其他实施例可能错开或抵消IC。

    Thin module system and method
    35.
    发明授权
    Thin module system and method 有权
    薄模块系统和方法

    公开(公告)号：US07468893B2

    公开(公告)日：2008-12-23

    申请号：US11058979

    申请日：2005-02-16

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: H05K7/00

    CPC classification number: G11C5/04 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572

    Abstract: Modules with larger areas for device mounting but minimized profiles are provided. In preferred embodiments, modules that employ one or more flex circuits have sculpted supportive substrates to selectively accommodate larger or taller profile devices. In several preferred embodiments, higher profile circuits such as AMBs, for example, are disposed in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In other preferred embodiments, both the substrate and the flexible circuitry have openings into which a device of greater profile such as, for example, an AMB or a logic device with or without a resident heat sink are provided with a volume to occupy without adding the full profile of the taller device to the profile of the module itself.

    Abstract translation: 提供了更大面积的模块，用于器件安装，但最小化配置文件。 在优选实施例中，使用一个或多个柔性电路的模块具有雕刻的支撑衬底，以选择性地容纳更大或更高的轮廓设备。 在几个优选实施例中，例如，诸如AMB的更高轮廓的电路被布置在基板中的窗口，凹部或切口区域中。 在其它优选实施例中，衬底和柔性电路都具有开口，其中具有更大轮廓的装置（例如AMB或具有或不具有驻留散热器的逻辑装置）具有容积而不加入 更高的设备的完整配置文件到模块本身的配置文件。

    Light source module
    36.
    发明授权
    Light source module 有权
    光源模块

    公开(公告)号：US07441925B2

    公开(公告)日：2008-10-28

    申请号：US11302164

    申请日：2005-12-14

    Applicant: Shen-Hong Chou ,  Pang-Hsuan Liu

    Inventor： Shen-Hong Chou ,  Pang-Hsuan Liu

    IPC: F21V29/00

    CPC classification number: H05K1/182 ,  F21K9/00 ,  F21V29/74 ,  F21V29/763 ,  H05K1/0203 ,  H05K2201/10106 ,  H05K2201/1056 ,  Y10S362/80

    Abstract: A method for assembling light emitting diode units and a substrate in a light source module and a structure thereof are provided. The light emitting diode unit is made of a light emitting diode and a carrier. Every light emitting diode has a flanged profile in the bottom to form a leaned plane, and a corresponding hole is formed on the substrate. Hence, when the light emitting diodes are pressed on the surface of a radiator by the substrate to make a closer contact, the light emitting diodes will be able to bear the pressure by the flanged design.

    Abstract translation: 提供了一种用于组装光源模块中的发光二极管单元和基板的方法及其结构。 发光二极管单元由发光二极管和载体构成。 每个发光二极管在底部具有带凸缘的轮廓以形成倾斜的平面，并且在基底上形成相应的孔。 因此，当通过基板将发光二极管按压在散热器的表面上以进行更紧密的接触时，发光二极管将能够通过带凸缘的设计承受压力。

    High Capacity Thin Module System and Method
    39.
    发明申请
    High Capacity Thin Module System and Method 有权
    高容量薄模块系统和方法

    公开(公告)号：US20080030972A1

    公开(公告)日：2008-02-07

    申请号：US11869687

    申请日：2007-10-09

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: H05K1/11

    CPC classification number: G11C5/04 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

    Abstract: Multiple DIMM circuits or ins tantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.

    Abstract translation: 多个DIMM电路或插图在单个模块中呈现。 在一些实施例中，存储器集成电路（优选CSP）和伴随的AMB或伴随的存储器寄存器被布置在柔性电路的每一侧的两个场中的两个等级中。 柔性电路具有沿着一侧设置的扩展触点。 柔性电路围绕支撑衬底或板设置，以在构造的模块的每一侧上放置一个完整的DIMM电路或实例化。 在替代但也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在优选实施例中在基板中的窗口，凹部或切口区域中。 其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。 其他实施例可能错开或偏移IC或包括更多数量的IC。

    HIGH DENSITY MEMORY MODULE USING STACKED PRINTED CIRCUIT BOARDS
    40.
    发明申请
    HIGH DENSITY MEMORY MODULE USING STACKED PRINTED CIRCUIT BOARDS 有权
    使用堆叠印刷电路板的高密度存储器模块

    公开(公告)号：US20080007921A1

    公开(公告)日：2008-01-10

    申请号：US11775125

    申请日：2007-07-09

    Applicant: Robert Pauley ,  Jayesh Bhakta ,  William Gervasi ,  Chi Chen ,  Jose Delvalle

    Inventor： Robert Pauley ,  Jayesh Bhakta ,  William Gervasi ,  Chi Chen ,  Jose Delvalle

    IPC: H05K7/20 ,  H05K3/00

    CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

    Abstract: A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and the electrical contacts.

    Abstract translation: 模块可电连接到计算机系统。 模块包括至少一个多层结构，其具有可电连接到计算机系统的多个电触点。 该模块还包括耦合到至少一个多层结构的第一印刷电路板。 第一印刷电路板具有安装在第一表面上的第一表面和第一多个部件。 第一组多个组件与电触点电连通。 该模块还包括耦合到至少一个多层结构的第二印刷电路板。 第二印刷电路板具有安装在第二表面上的第二表面和第二多个部件。 第二组件与电触点电连通。 第二印刷电路板的第二表面面向第一印刷电路板的第一表面。 模块还包括位于第一多个部件和第二多个部件之间的至少一个导热层。 所述至少一个导热层与所述第一多个部件，所述第二多个部件和所述电触点热连通。

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