公开(公告)号：US07677763B2

公开(公告)日：2010-03-16

申请号：US11541314

申请日：2006-09-29

Applicant: Timothy Chan

Inventor： Timothy Chan

IPC: F21V21/00 ,  F21S4/00 ,  F21V29/00

CPC classification number: H01R33/09 ,  F21K9/00 ,  F21V19/0025 ,  F21V19/042 ,  F21Y2105/10 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K3/107 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10765 ,  Y10S362/80

Abstract: A method and system for attaching LEDs to circuitry which would protect the LEDs from heat damage and allows for individual LEDs to be removed.

Abstract translation: 一种用于将LED附接到电路的方法和系统，其将保护LED免受热损伤并且允许去除各个LED。

公开(公告)号：US20090200914A1

公开(公告)日：2009-08-13

申请号：US11802590

申请日：2007-05-23

Applicant: Gwo-Feng Hwang ,  Yu-Shing Lien

Inventor： Gwo-Feng Hwang ,  Yu-Shing Lien

IPC: H01J5/48 ,  H01J5/50

CPC classification number: H05K3/308 ,  F21K9/00 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10765

Abstract: The present invention relates to a light emitting module, which comprises: a main body; a common terminal, in which one side of the common terminal is exposed to the main body and a weldless coupling structure is disposed on the bottom of the common terminal; at least a control terminal, in which one side of the control terminal is exposed to the main body and a weldless coupling structure is disposed on the bottom of the control terminal; and at least a light emitting device. When assembling the components mentioned above, the common terminal and the control terminal are inserted into a through hole of a printed circuit board (PCB), such that the structure can be inlaid into the through hole and a better contact is obtained by its elasticity. Accordingly, the light emitting module can be fastened on the PCB.

Abstract translation: 本发明涉及发光模块，其包括：主体; 公共端子的一侧暴露于主体的公共端子和在公共端子的底部设置无焊接耦合结构; 至少控制端子，其中控制端子的一侧暴露于主体，并且无焊接耦合结构设置在控制端子的底部; 和至少一个发光器件。 当组装上述组件时，公共端子和控制端子插入到印刷电路板（PCB）的通孔中，使得结构可以嵌入通孔中，并且通过其弹性获得更好的接触。 因此，发光模块可以紧固在PCB上。

公开(公告)号：US20050133928A1

公开(公告)日：2005-06-23

申请号：US10741919

申请日：2003-12-19

Applicant: Gregory Howard ,  Howard Test ,  Tz-Cheng Chiu

Inventor： Gregory Howard ,  Howard Test ,  Tz-Cheng Chiu

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/485 ,  H01L23/498 ,  H05K3/34 ,  H01L23/48 ,  H01L21/44

CPC classification number: H01L23/562 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10704 ,  H05K2201/10765 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013

Abstract: A device comprising a workpiece (401) with a surface (401a) including a center (402) and an array of bond pads (420), further an array of interconnects (405) of uniform height. Each of these interconnects comprises an elongated wire loop, which has both wire ends (440, 450) attached to one of the bond pads, respectively, and its major diameter (460) approximately normal to the workpiece surface. A substantial number of the loops has an orientation approximately normal to the vector (410) from the workpiece center to the respective bond pad; this number includes more than 30% of the loops located along the workpiece perimeter and more than 10% of the total loops. Examples of workpieces are a semiconductor device, an integrated circuit (IC) chip, and a semiconductor device package.

Abstract translation: 一种包括具有包括中心（402）和接合焊盘（420）阵列的表面（401a）的工件（401）的装置，还包括均匀高度的互连阵列（405）。 这些互连件中的每一个包括细长的线环，其具有分别连接到一个接合焊盘的两个线端（440,450）以及其大致垂直于工件表面的大直径（460）。 相当多的环路具有大约垂直于从工件中心到相应接合焊盘的矢量（410）的取向; 这个数字包括沿着工件周边设置的超过30％的循环和超过总循环的10％。 工件的实例是半导体器件，集成电路（IC）芯片和半导体器件封装。

公开(公告)号：US4766520A

公开(公告)日：1988-08-23

申请号：US938416

申请日：1986-12-05

Applicant: Duane Huber ,  James P. Liautaud

Inventor： Duane Huber ,  James P. Liautaud

IPC: H05K3/10 ,  H05K3/20 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K5/0034 ,  H05K3/202 ,  H05K2201/0999 ,  H05K2201/10424 ,  H05K2201/10765 ,  H05K2203/175 ,  H05K3/107

Abstract: An injection molded housing for thick film ignition circuitry used in conjunction with automobile or other vehicle engines includes an integral lead frame for providing electrical connections between the circuitry and engine sensors and ignition components. To provide protection against lead frame failure as a result of vibration and thermal stresses encountered in the engine environment, residual stress cracking caused by varying flexure of the lead frame during the manufacturing process is prevented by utilizing a pre-mold base in which the lead frame is placed prior to subsequent encapsulating of both the lead frame and the pre-molded base. The result is a lead-frame housing construction of greater reliability.

Abstract translation: 用于与汽车或其他车辆发动机结合使用的厚膜点火电路的注模壳体包括用于在电路和发动机传感器和点火部件之间提供电连接的整体引线框架。 为了提供由于在发动机环境中遇到的振动和热应力引起的引线框架故障的保护，通过利用预模底座来防止在制造过程中由引线框架的变形引起的残余应力开裂，其中引线框架 放置在引导框架和预模制基座之后的封装之前。 结果是可靠性更高的引线框架结构。

公开(公告)号：US3747045A

公开(公告)日：1973-07-17

申请号：US3747045D

申请日：1971-04-19

Applicant: SPRAGUE ELECTRIC CO

Inventor： STROSS H

IPC: H01G2/06 ,  H01R12/71 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01G2/06 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10765 ,  H05K2201/10878

Abstract: The lead configuration of an electrical component is such that one of the leads locks into position in an aperture of a wiring board when the unit is inserted therein with nominal pressure. This configuration allows the unit to slide only so far into the aperture before it locks in place, thereby prohibiting the unit from being inserted any further, or from falling out of position if the board were inverted. These units remain locked in an upright position on the wiring board for the purpose of being further secured thereon, as by wave soldering.

Abstract translation: 电气部件的引线构造使得当单元以公称压力插入其中时，引线之一锁定在布线板的孔中的适当位置。 该配置允许单元在锁定到位之前仅滑动到孔中，从而禁止单元进一步插入，或者如果板被倒置则不会脱离位置。 这些单元保持锁定在布线板上的直立位置，以便通过波峰焊接进一步固定在其上。

公开(公告)号：US3601787A

公开(公告)日：1971-08-24

申请号：US3601787D

申请日：1970-06-22

Applicant: GTE AUTOMATIC ELECTRIC LAB INC

Inventor： REIMER WILLIAM A

IPC: H01R4/00 ,  H05K3/34 ,  H05K3/36 ,  H01R5/04

CPC classification number: H01R12/52 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/10765 ,  H05K2201/10984 ,  H05K2203/0415

Abstract: A solder form facilitates replacement of receptacle terminals that extend through blind connecting through-holes of a plurality of circuit boards. A hairpin conductor within the solder form spreads apart when the form is melted to carry solder to a replacement terminal and to the conductive surface of a throughhole.

公开(公告)号：US3437882A

公开(公告)日：1969-04-08

申请号：US3437882D

申请日：1966-01-14

Applicant: TEXAS INSTRUMENTS INC

Inventor： CAYZER JOHN ANTHONY

IPC: H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H02B1/04

CPC classification number: H05K1/14 ,  H01R12/52 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/1053 ,  H05K2201/10765 ,  H05K2201/10946 ,  H05K2201/10962

公开(公告)号：US09750139B2

公开(公告)日：2017-08-29

申请号：US15172744

申请日：2016-06-03

Applicant: CIRCOR AEROSPACE, INC.

Inventor： Brent Salamone

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0269 ,  H05K3/301 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10765

Abstract: A housing, for surface-mount technology (SMT), accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.

公开(公告)号：US20160374214A1

公开(公告)日：2016-12-22

申请号：US15172744

申请日：2016-06-03

Applicant: CIRCOR AEROSPACE, INC.

Inventor： Brent SALAMONE

IPC: H05K5/00 ,  H05K5/02 ,  H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0269 ,  H05K3/301 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10765

Abstract: The present invention provides a housing for surface-mount technology (SMT). In particular, the housing accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.

Abstract translation: 本发明提供了一种用于表面贴装技术（SMT）的外壳。 特别地，壳体接受安装在圆形基板上的任何电子封装。 包括组装的电子封装的外壳形成一个SMT外壳组件。 SMT外壳组件直接放置在印刷电路板（PCB）的表面上。 SMT外壳组件使用标准焊接技术焊接到PCB，建立电子封装和PCB之间的电气连接。

公开(公告)号：US09293400B2

公开(公告)日：2016-03-22

申请号：US14590021

申请日：2015-01-06

Applicant: Infineon Technologies AG

Inventor： Sergey Ananiev

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L23/13 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H05K3/34

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124), and a plurality of terminal pins (122) to connect the electronic chip(s) (124), wherein each of the said terminal pins (122) has an encapsulated section (126), which is encapsulated at least partially by the encapsulation body (138) and has an exposed section (128) that protrudes from the encapsulation body (138), and wherein at least a portion of the exposed sections (128) laterally extends from the encapsulation body (138) up to a reversal point (130) and laterally extends back from the reversal point (130) to the encapsulation body (138), so that a free end (132) of the exposed sections (128) is laterally aligned with or to a corresponding side wall (134) of the encapsulation body (138) or is spaced from the corresponding side wall (134) of the encapsulation body (138) laterally outwardly.