公开(公告)号：US20120111628A1

公开(公告)日：2012-05-10

申请号：US13382698

申请日：2010-06-22

Applicant: Michael Zitzlsperger ,  Stefan Groetsch

Inventor： Michael Zitzlsperger ,  Stefan Groetsch

IPC: H05K7/04

CPC classification number: H05K1/181 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

Abstract translation: 电子设备包括基体，该基体具有顶侧，并且还具有与顶侧相对的下侧。 基体在其下侧具有连接位置。 在基体的顶侧设置有电子部件。 基体具有至少一个具有至少一个检查点的侧面区域，具有第一区域和第二区域。 第二个地区体现为第一个地区的缩进。 第一和第二区域包含不同的材料。

公开(公告)号：US07909666B2

公开(公告)日：2011-03-22

申请号：US12446432

申请日：2007-10-30

Applicant: Yuji Nakamura

Inventor： Yuji Nakamura

IPC: H05K1/00

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R3/00 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0278 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

Abstract: There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.

Abstract translation: 提供了制备由包括基部（11,21），弹性变形部（12,22）和接触部（13,23）的金属板形成的触点（10,20）的步骤 ），并且其中在所述基部的底表面上形成有凹部（15,25），并且多个通孔（16,26,27）形成为布置在所述凹部上方并且平行于所述底部 基部的表面延伸穿过基部，并且将焊料保持在形成在触点上的通孔上。 通过该制造方法制造所需的焊料附着接触件（10a，20a）。 此外，焊料是焊球（90），保持焊料的步骤包括制备焊球的步骤和将焊球压入通孔的步骤。

公开(公告)号：US07845828B2

公开(公告)日：2010-12-07

申请号：US12115515

申请日：2008-05-05

Applicant: Chin-Long Ku

Inventor： Chin-Long Ku

IPC: F21V21/00

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21S2/005 ,  F21V29/70 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10787 ,  H05K2201/1084 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED includes a base and a first and a second electrode leads inserted in the base. The first lead forms a groove in an end thereof, and the second lead forms a tab from an end thereof. The tab of each LED is received in the groove of an adjacent LED to thereby cooperatively define an accommodating space in the groove and above the tab. The accommodating space is used for receiving excess solder when soldering the first and the second leads together.

Abstract translation: LED组件包括衬底和安装在衬底上的多个LED。 每个LED包括基座和插入基座中的第一和第二电极引线。 第一引线在其端部形成凹槽，并且第二引线从其端部形成突片。 每个LED的突片被接收在相邻LED的凹槽中，从而在凹槽中并在凸片上方协同地限定容纳空间。 当将第一和第二引线焊接在一起时，容纳空间用于接收多余的焊料。

公开(公告)号：US20100302745A1

公开(公告)日：2010-12-02

申请号：US12787376

申请日：2010-05-25

Applicant: FU-BIAU HSU ,  CHUN-JUNG KUO

Inventor： FU-BIAU HSU ,  CHUN-JUNG KUO

IPC: H05K1/00 ,  H05K7/18

CPC classification number: H05K3/326 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H05K1/038 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2201/10651 ,  H05K2201/1084 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention discloses a lead frame having stitching-assisting structures, an electronic device having such lead frame, and an apparatus having such electronic device. The apparatus according to the invention also includes a flexible substrate and a plurality of conductive threads. Particularly, the conductive threads are sewn through the flexible substrate and the stitching-assisting structures to fix the electronic device on the flexible substrate, and the conductive threads electrically contact with the stitching-assisting structures of the electronic device.

Abstract translation: 本发明公开了一种具有缝合辅助结构的引线框架，具有该引线框架的电子设备以及具有该电子设备的设备。 根据本发明的装置还包括柔性基板和多个导电线。 特别地，导电线通过柔性基板和缝合辅助结构缝合，以将电子装置固定在柔性基板上，并且导电线与电子装置的缝合辅助结构电接触。

公开(公告)号：US20100032271A1

公开(公告)日：2010-02-11

申请号：US12360184

申请日：2009-01-27

Applicant: Masataka Maehara

Inventor： Masataka Maehara

IPC: H01H21/04

CPC classification number: H01H1/5805 ,  H01H13/04 ,  H01H13/48 ,  H01H2013/525 ,  H01H2207/02 ,  H01H2223/058 ,  H05K1/182 ,  H05K3/3426 ,  H05K2201/10053 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A switch having terminals that provide from side surfaces of a switch housing for mounting on a substrate. Through-holes are provided in the terminals. A main body is installed in a cutaway part of the substrate to form a gap between the housing side surface and the cutaway part. When soldering a solder connection surface of the terminal to the solder mounting surface of the substrate, flux flows out to a substrate end surface through a space formed continuously between each through-hole and the gap, such that there is no penetration of flux into the interior of the switch. As a result, contact operation is made stable. In addition, the solder connection strength is also improved by forming a solder fillet on the interior surface of the through-hole.

Abstract translation: 一种开关，其具有从用于安装在基板上的开关壳体的侧表面提供的端子。 端子上设有通孔。 主体安装在基板的切口部分中，以在壳体侧表面和切除部分之间形成间隙。 当将端子的焊料连接表面焊接到衬底的焊料安装表面时，焊剂通过在每个通孔和间隙之间连续形成的空间流出到衬底端表面，使得焊剂不渗入 内部的开关。 结果，接触操作稳定。 此外，通过在通孔的内表面上形成焊料圆角，焊接连接强度也得到改善。

公开(公告)号：US07654828B1

公开(公告)日：2010-02-02

申请号：US12284206

申请日：2008-09-19

Applicant: Tod M. Harlan ,  Terrance F. Little

Inventor： Tod M. Harlan ,  Terrance F. Little

IPC: H01R12/00

CPC classification number: H05K7/1069 ,  H05K3/3426 ,  H05K2201/10325 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

Abstract: A socket, adapted for electrically connecting a printed circuit board to an IC package, comprises a housing and a plurality of contacts arranged in an angular fashion within the passageways. The housing defines a mating face and a mounting face opposed to the mating face and a number of angular passageways extending from the mating face to the mounting face. Each contact includes a bend portion, a first leg and a second leg extending from two opposed ends of the bend portion. The second leg has an arc contacting portion extending out of the mating face for contacting with the IC package. Firstly a solder ball is disposed on a bottom surface of the bend portion and soldered to the printed circuit board to mount the contact to the printed circuit board. Or secondly the contacts (Mounting end) have no solder balls and solder paste is applied to PCB then connector is placed onto PCB and reflow soldered into place without use of solder balls.

Abstract translation: 适于将印刷电路板电连接到IC封装的插座包括外壳和在通道内以角度方式布置的多个触点。 壳体限定配合面和与配合面相对的安装面以及从配合面延伸到安装面的若干角通道。 每个触点包括从弯曲部分的两个相对的端部延伸的弯曲部分，第一腿部和第二腿部。 第二腿部具有从配合面延伸出来的与IC封装接触的弧接触部分。 首先，将焊球设置在弯曲部分的底表面上并焊接到印刷电路板以将接触件安装到印刷电路板。 或者其次，触点（安装端）没有焊球，焊膏贴在PCB上，然后将连接器放置在PCB上，回流焊接到位，而不使用焊球。

公开(公告)号：US20090135571A1

公开(公告)日：2009-05-28

申请号：US12037289

申请日：2008-02-26

Applicant: Chih-Hung Chiang ,  Kai-Hung Huang

Inventor： Chih-Hung Chiang ,  Kai-Hung Huang

IPC: H05K1/11 ,  H01R12/00

CPC classification number: H01R12/57 ,  H01R12/7082 ,  H01R12/718 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/1084 ,  H05K2201/2036 ,  H05K2203/1178 ,  Y02P70/613

Abstract: The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a sidewall and a receptacle defined within the sidewall for receiving a solder bump therein. The solder bump is partially protruded from the sidewall and bonded onto the second circuit board such that the first circuit board and the second circuit board are electrically connected to each other.

Abstract translation: 本发明涉及一种用于电连接第一电路板和第二电路板的表面安装连接器。 表面安装连接器包括第一端部和第二端部。 第一端部被接合到第一电路板上。 第二端部具有侧壁和限定在侧壁内的容器，用于在其中容纳焊料凸块。 焊料凸起部分地从侧壁突出并且接合到第二电路板上，使得第一电路板和第二电路板彼此电连接。

公开(公告)号：US20080272481A1

公开(公告)日：2008-11-06

申请号：US11800223

申请日：2007-05-04

Applicant: Rajendra Dias ,  Xinyan Zhao

Inventor： Rajendra Dias ,  Xinyan Zhao

IPC: H01L23/48

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/1084 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrically conductive pin comprising a pin stem and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head defines at least one slot therein, the at least one slot being configured to allow gases to escape therethrough from a region at an underside of the pin head.

Abstract translation: 导电销，其包括销杆和连接到销杆的销头。 针头适于安装在微电子衬底的表面上以支撑销杆。 销头在其中限定至少一个狭槽，所述至少一个狭槽被构造成允许气体从销头的下侧的区域从其中排出。

公开(公告)号：US20080157305A1

公开(公告)日：2008-07-03

申请号：US11781420

申请日：2007-07-23

Applicant: Guo-Cheng Liao

Inventor： Guo-Cheng Liao

IPC: H01L23/495

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H01L24/48 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3452 ,  H05K2201/09472 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A chip package structure including a circuit board, a solder mask, and a chip package is provided. The circuit board has at least one contact on its surface. The solder mask covers the circuit board and has at least one first opening for exposing the contact. The chip package is disposed on the circuit board, and includes a chip and a leadframe, which has at least one lead that is electrically connected to the chip. The lead has an insertion portion that corresponds to the contact and inserts into the first opening. A solder bump is filled into the first opening and fastened to the insertion portion, thereby the connection between the lead and the contact of the chip package structure is secured.

Abstract translation: 提供了包括电路板，焊接掩模和芯片封装的芯片封装结构。 电路板在其表面上至少有一个接触。 焊接掩模覆盖电路板，并且具有至少一个用于暴露触点的第一开口。 芯片封装被布置在电路板上，并且包括芯片和引线框架，该芯片和引线框架具有电连接到芯片的至少一个引线。 引线具有对应于接触并插入第一开口的插入部分。 焊料凸块被填充到第一开口中并且紧固到插入部分，从而确保了引线与芯片封装结构的接触之间的连接。

公开(公告)号：US07383977B2

公开(公告)日：2008-06-10

申请号：US10512012

申请日：2003-03-31

Applicant: Gustav Fagrenius ,  Fredrik Palmqvist

Inventor： Gustav Fagrenius ,  Fredrik Palmqvist

IPC: B23K31/00 ,  B23K31/02 ,  H05K9/00

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10984 ,  Y02P70/613 ,  Y10T29/49002

Abstract: A method for providing a PCB (printed circuit board) with a shield can (1) comprising a metal shell with a free rim (5). The method prescribes that the rim (5) of the shield can (1) is provided with an extra amount of solder (8) before the shield can (1) is placed on the PCB. A shield can (1) is also described.

Abstract translation: 一种用于提供具有屏蔽罩的PCB（印刷电路板）的方法（1），其包括具有自由边缘（5）的金属外壳。 该方法规定，在屏蔽罐（1）放置在PCB上之前，屏蔽罩（1）的边缘（5）设置有额外的焊料（8）。 还描述了屏蔽罩（1）。