公开(公告)号：US10065269B2

公开(公告)日：2018-09-04

申请号：US15167268

申请日：2016-05-27

Applicant: Ronald Peter Whitfield

Inventor： Ronald Peter Whitfield ,  Omer Leon Hageniers

IPC: B05B5/00 ,  B05C19/00 ,  B05B7/16 ,  B05C11/00 ,  C23C14/00 ,  B23K26/34 ,  B05B7/22 ,  C23C24/10 ,  B23K35/02 ,  B23K26/32 ,  B23K26/144 ,  C23C4/123 ,  C23C4/137 ,  B23K26/06 ,  B23K103/00

Abstract: A laser cladding device for applying a coating to a part comprising a laser which can generate laser light, which is adapted to heat the coating and the part, a main body defining a laser light channel adapted to transmit the laser light to the part, a coating channel adapted to transmit the coating to the part, and a vacuum channel and a nozzle having an exit. The nozzle comprises a delivery port at one end of the laser light channel, a coating port at one end of the coating channel, and a vacuum port at one end of the vacuum channel, wherein the vacuum port is positioned generally adjacent the delivery port In operation the vacuum port draws a vacuum, pulling the coating towards the part.

公开(公告)号：US10047441B2

公开(公告)日：2018-08-14

申请号：US15794416

申请日：2017-10-26

Applicant: SCREEN Semiconductor Solutions Co., Ltd.

Inventor： Masahiko Harumoto ,  Tadashi Miyagi ,  Yukihiko Inagaki ,  Koji Kaneyama

IPC: G03D5/00 ,  C23C16/56 ,  H01J37/02 ,  B05C11/00 ,  H01L21/033 ,  G03F7/32 ,  G03F7/20 ,  C23C16/02 ,  G03F7/30 ,  G03F7/16 ,  G03F7/00 ,  H01L21/67

Abstract: An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.

公开(公告)号：US09991410B2

公开(公告)日：2018-06-05

申请号：US14345629

申请日：2012-09-28

Applicant: Neturen Co., LTD.

Inventor： Yoshiki Seto ,  Kunihiro Kobayashi ,  Nobumoto Ishiki ,  Hisaaki Watanabe

IPC: B05C11/00 ,  H01L31/18 ,  C23C2/00 ,  C23C2/02 ,  C23C2/38 ,  B32B15/01 ,  C22C9/00 ,  C22C13/00 ,  C23C18/16 ,  H01B1/02

CPC classification number: H01L31/18 ,  B32B15/01 ,  C22C9/00 ,  C22C13/00 ,  C23C2/003 ,  C23C2/02 ,  C23C2/38 ,  C23C18/1628 ,  C23C18/1632 ,  H01B1/026

Abstract: A method of manufacturing a lead wire for a solar cell includes heating a wire material by a direct resistance heating or by an induction heating to reduce a 0.2% proof stress of the wire material while conveying the wire material and plating the wire material that is in a heated condition obtained by the direct resistance heating or by the induction heating while further conveying the wire material. An apparatus is configured to implement the method, and includes a plating bath, a conveyor mechanism configured to convey the wire material, a heater configured to heat the wire material, and a controller configured to control the conveyor mechanism and the heater.

公开(公告)号：US09937512B2

公开(公告)日：2018-04-10

申请号：US13367844

申请日：2012-02-07

Applicant: John R. Pease

Inventor： John R. Pease

IPC: C23C4/12 ,  B05B7/22 ,  B05C11/00 ,  B05B12/08 ,  H01H1/42 ,  B05B12/12 ,  C23C4/134 ,  B05C11/10 ,  C23C16/52 ,  C23C14/54 ,  B05B7/20

CPC classification number: B05B12/085 ,  B05B7/20 ,  B05B7/22 ,  B05B12/12 ,  B05C11/1013 ,  C23C4/12 ,  C23C4/134 ,  C23C14/54 ,  C23C16/52 ,  H01H1/42

Abstract: The present disclosure sets forth an automated apparatus and method for applying gas plasma coatings to aircraft engine parts. The process and apparatus employ a plurality of sensors which continually monitor various process parameters associated with the coating process. If any of the measured parameters fall out of tolerance, the coating process is interrupted to allow a user to fix the source of the problem, where upon the process is reengaged. Moreover, the process and apparatus employ a pause resume circuit which uses predetermined durations for pausing and resuming the coating process.

公开(公告)号：US20180071771A1

公开(公告)日：2018-03-15

申请号：US15676256

申请日：2017-08-14

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Itsuki KAJINO ,  Miyoshi UENO ,  Mikio MASUICHI ,  Hiroyuki UENO ,  Kazuhiro SHOJI

IPC: B05C11/00 ,  B05D1/28 ,  B05C1/02 ,  B41F16/00

CPC classification number: B05C11/00 ,  B05C1/025 ,  B05D1/28 ,  B41F16/00 ,  B41F16/0073 ,  H01L21/00 ,  H01L21/67092 ,  H01L21/6838

Abstract: A first movable body is provided movably in a separation direction and a first engaging member is provided for each suction unit. When the first movable body is moved in the separation direction, the plurality of first engaging members are respectively engaged with the first movable body in the same sequence as an array sequence of the suction units. Thereafter, the suction units are moved in the separation direction together with the first movable body.

公开(公告)号：US09833055B2

公开(公告)日：2017-12-05

申请号：US14696555

申请日：2015-04-27

Applicant: HCT ASIA LTD.

Inventor： Timothy Thorpe

IPC: B05C11/00 ,  A45D40/26 ,  A61M35/00 ,  B05B11/00 ,  B65D83/14 ,  A45D34/04

CPC classification number: A45D40/26 ,  A45D34/04 ,  A45D2200/051 ,  A45D2200/055 ,  A45D2200/056 ,  A45D2200/152 ,  A45D2200/155 ,  A61M35/003 ,  B05B11/0089 ,  B05B11/30 ,  B65D83/14 ,  B65D83/285 ,  B65D83/30

Abstract: A dispenser includes a thermal storage tip and a housing having a reservoir for containing a product, such as a cosmetics product or a medicinal product. The thermal storage tip comprises a material that is capable of storing and retaining thermal energy during application of the product.

公开(公告)号：US09808824B2

公开(公告)日：2017-11-07

申请号：US14850635

申请日：2015-09-10

Applicant: Heikki Vatanen ,  Timo Nurmiainen

Inventor： Heikki Vatanen ,  Timo Nurmiainen

IPC: B05C5/00 ,  B05C3/00 ,  B05C11/00 ,  B05C11/10 ,  D21H23/48

CPC classification number: B05C5/005 ,  B05C11/1039 ,  D21H23/48

Abstract: An arrangement in a curtain coater for starting and stopping coating of a web, having a reservoir and a connected surface extending over the web toward the curtain to collect the coating as the coater moves over the web to start coating the web. A cover plate that swing around a cross-direction shaft connected to the cover plate. In one embodiment the shaft also moves in the machine direction. The cover plate is used to protect an leading edge of the collecting surface from being covered with coating and pivots to be cleaned with fluid which may be supply from the shaft. The cover plate is arranged so the fluid drain off the cover plate onto the collecting surface or reservoir. When clean, the cover plate is repositioned to protect an leading edge of the collecting surface during the next start or stop operation of coating the web.

公开(公告)号：US09778565B2

公开(公告)日：2017-10-03

申请号：US15400081

申请日：2017-01-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Sato

IPC: B05C9/10 ,  B05C11/00 ,  B29C59/00 ,  G03F7/00 ,  B05C9/12 ,  B05D3/06 ,  B05D3/12 ,  B05C11/10 ,  H01L21/66 ,  H01L21/3105

CPC classification number: G03F7/0002 ,  B05C9/10 ,  B05C9/12 ,  B05C11/00 ,  B05C11/1021 ,  B05D3/067 ,  B05D3/12 ,  B29C59/002 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/3105 ,  H01L22/20

Abstract: The imprint apparatus of the present invention includes a holding unit configured to hold a mold; a particle inspection unit configured to inspect whether or not particle is present on an imprint area, in which the resin pattern is formed, of the substrate; a dispenser configured to apply an uncured resin to the imprint area; a movable unit configured to move the imprint area with respect to the holding unit; and a controller. The movable unit is capable of moving the imprint area to each of an inspection position by means of the inspection unit, an application position by means of the dispenser, and a contacting position by means of the holding unit. Also, the controller causes the inspection unit to perform inspection of the imprint area in association with the movement of the imprint area by means of the movable unit.

公开(公告)号：US09711384B2

公开(公告)日：2017-07-18

申请号：US14490641

申请日：2014-09-18

Applicant: TPK Touch Solutions Inc.

Inventor： Jun-Yao Huang ,  Ying-Che Chen ,  Po-Pin Hung ,  Yi-Tseng Chiang

IPC: B05B3/18 ,  B05C5/02 ,  B05C5/00 ,  B05C11/10 ,  B29C47/16 ,  H01L21/67 ,  B05D1/26 ,  B05C9/02 ,  B05C11/00

CPC classification number: H01L21/6715 ,  B05B3/18 ,  B05C5/005 ,  B05C5/0254 ,  B05C5/0266 ,  B05C9/02 ,  B05C11/00 ,  B05C11/1036 ,  B05D1/26 ,  B29C47/16

Abstract: A coating device for coating a coating liquid onto a substrate includes: a coating head having a coating-liquid outlet, adapted to move with respect to the substrate along a first axial direction and capable of coating the substrate with coating liquid through the coating-liquid outlet; and adjustment unit connected to the coating head and including a movable pad disposed proximal to the coating-liquid outlet and adapted to move along a second axial direction for adjusting the size of the opening of the coating-liquid outlet; and a drive assembly connected to the adjustment unit for controlling the adjustment unit to move along the second axial direction. Additionally a coating method is provided.

公开(公告)号：US09700901B2

公开(公告)日：2017-07-11

申请号：US14563803

申请日：2014-12-08

Applicant: The Regents of the University of Michigan

Inventor： Stephen R. Forrest ,  Gregory McGraw

IPC: B23K1/19 ,  B05B1/00 ,  C23C14/12 ,  C23C14/04 ,  C23C14/22 ,  B05C11/00 ,  B23K1/00 ,  B32B37/12 ,  B32B37/18 ,  H01L51/00 ,  B23K101/00

CPC classification number: B05B1/00 ,  B05C11/00 ,  B23K1/0008 ,  B23K2101/00 ,  B32B37/1284 ,  B32B37/18 ,  C23C14/04 ,  C23C14/12 ,  C23C14/228 ,  H01L51/0005

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.