公开(公告)号：US08714778B2

公开(公告)日：2014-05-06

申请号：US13927421

申请日：2013-06-26

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Yu-Sheng Tang ,  Yi-Tsuo Wu

IPC: F21V33/00 ,  F21V9/00 ,  H05B37/02

CPC classification number: H01L33/60 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13091 ,  H05B33/0869 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.

Abstract translation: 本公开的实施例包括LED模块。 提供基板。 光传感器位于基板中。 LED芯片附着在基板上。 LED芯片具有第一面和第二面。 第二面被具有开口的不透明层覆盖。 开口基本上与光传感器对准。 光传感器通过开口接收从LED芯片发出的光输出。

公开(公告)号：US20140103372A1

公开(公告)日：2014-04-17

申请号：US14140973

申请日：2013-12-26

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

IPC: H01L33/50

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L2933/0041

Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。

公开(公告)号：US09970603B2

公开(公告)日：2018-05-15

申请号：US14200069

申请日：2014-03-07

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu ,  Dong Jung Suen

IPC: B60Q1/06 ,  F21K99/00 ,  F21V3/04 ,  F21V7/00 ,  B05D5/06 ,  F21V29/74 ,  F21V29/77 ,  F21K9/20 ,  F21K9/232 ,  F21K9/60 ,  F21K9/66 ,  F21Y101/00 ,  F21Y115/10

CPC classification number: F21K9/60 ,  B05D5/061 ,  B05D5/063 ,  F21K9/20 ,  F21K9/232 ,  F21K9/66 ,  F21V3/049 ,  F21V3/0625 ,  F21V3/10 ,  F21V7/0016 ,  F21V29/74 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2115/10

Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.

公开(公告)号：US09184334B2

公开(公告)日：2015-11-10

申请号：US14451508

申请日：2014-08-05

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Shouli Steve Hsia ,  Chih-Kuang Yu ,  Ken Wen-Chien Fu ,  Hung-Yi Kuo ,  Hung-Chao Kao ,  Ming-Feng Wu ,  Fu-Chih Yang

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/0008 ,  H01L27/15 ,  H01L33/0004 ,  H01L33/005 ,  H01L33/62

Abstract: A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer.

Abstract translation: 发光二极管（LED）结构包括第一掺杂区域，位于第一掺杂区域顶部的电介质层，介电层第一部分顶部的接合焊盘层，以及具有第一LED区域和 第二LED区域。 接合焊盘层电连接到第一掺杂区域。 第一LED区域电连接到接合焊盘层。

公开(公告)号：US09166129B2

公开(公告)日：2015-10-20

申请号：US14584009

申请日：2014-12-29

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Ching-Yi Chen ,  Yu-Sheng Tang ,  Hao-Yu Yang ,  Hsin-Hung Chen ,  Tzu-Wen Shih

IPC: H01L21/00 ,  H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21K99/00 ,  F21V13/02 ,  F21V13/14 ,  H01L33/60

CPC classification number: H01L33/58 ,  F21K9/64 ,  F21V13/02 ,  F21V13/14 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A lens is formed over one or more light-emitting devices disposed over a substrate. The lens includes a trench that circumferentially surrounds the one or more light-emitting devices. The trench is filled with a phosphor-containing material.

Abstract translation: 在设置在基板上的一个或多个发光器件上形成透镜。 透镜包括围绕一个或多个发光器件的沟槽。 沟槽填充有含磷材料。

公开(公告)号：US09148916B2

公开(公告)日：2015-09-29

申请号：US13800958

申请日：2013-03-13

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Ming-Shun Chang ,  Ko-Chih Chiu

IPC: H05B33/08

CPC classification number: H05B33/0812 ,  Y02B20/345

Abstract: The present disclosure involves a device. The device includes a rectifier coupled to receive energy from an alternating current (AC) voltage source. A capacitor is coupled to the rectifier. A plurality of LEDs and a current limiter are coupled in series. The current limiter is configured to limit a current through the LEDs. The plurality of LEDs and the current limiter are collectively coupled to the capacitor in parallel. A current controller is coupled to both the capacitor and the current limiter in series. The current controller is configured to control at least a charging current of the capacitor. The device has a first current path during a first period of operation and a second current path during a second period of operation. The capacitor charges during the first period of operation and discharges during the second period of operation.

Abstract translation: 本公开涉及一种设备。 该装置包括耦合以从交流（AC）电压源接收能量的整流器。 电容器耦合到整流器。 多个LED和限流器串联耦合。 电流限制器配置为限制通过LED的电流。 多个LED和限流器并联连接到电容器。 电流控制器串联耦合到电容器和限流器两者。 电流控制器被配置为至少控制电容器的充电电流。 该设备在第一操作周期期间具有第一电流路径，在第二操作周期期间具有第二电流路径。 电容器在第一次操作期间充电，并在第二次操作期间放电。

公开(公告)号：US09125272B2

公开(公告)日：2015-09-01

申请号：US14524060

申请日：2014-10-27

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsin-Chieh Huang

IPC: H05B33/08 ,  F21V23/04 ,  F21Y101/02

CPC classification number: H05B33/0845 ,  F21V23/0457 ,  F21Y2115/10 ,  H05B33/0851 ,  H05B33/0869

Abstract: A lighting apparatus includes a board, a first light-emitting diode (LED) bank disposed on the board, a second LED bank disposed on the board, a light detector coupled to the first LED bank, and a driver coupled to the light detector and to each of the first and second LED banks. The first LED bank includes a plurality of first LEDs. The second LED bank includes a plurality of second LEDs, and is electrically coupled to the first LED bank. The light detector is configured to detect an output decay of light from each of the first LEDs. The second LEDs in the second LED bank are initially deactivated and are subsequently activated in response to light output decay of the first LEDs.

Abstract translation: 照明装置包括板，布置在板上的第一发光二极管（LED）组，设置在板上的第二LED组，耦合到第一LED组的光检测器和耦合到光检测器的驱动器， 到第一和第二LED组中的每一个。 第一LED组包括多个第一LED。 第二LED组包括多个第二LED，并且电耦合到第一LED组。 光检测器被配置为检测来自每个第一LED的光的输出衰减。 第二LED组中的第二LED最初被去激活，随后响应于第一LED的光输出衰减而被激活。

公开(公告)号：US09105818B2

公开(公告)日：2015-08-11

申请号：US14294537

申请日：2014-06-03

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Ming Lin

IPC: H01L33/50 ,  H01L33/06 ,  H01L33/46

CPC classification number: H01L33/505 ,  H01L33/46 ,  H01L2933/0041

Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.

Abstract translation: 本公开涉及照明装置。 照明装置包括第一掺杂半导体层。 发光层设置在第一掺杂半导体层上。 第二掺杂半导体层设置在发光层上。 第二掺杂半导体层具有与第一掺杂半导体层不同的导电类型。 光转换层设置在第二掺杂半导体层和第一和第二掺杂半导体层和发光层的越侧表面上。 光转换层具有角度轮廓。

公开(公告)号：US09093618B2

公开(公告)日：2015-07-28

申请号：US14305067

申请日：2014-06-16

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

IPC: H01L33/50 ,  H01L33/06 ,  H01L33/46 ,  H01L33/54

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L2933/0041

Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.

Abstract translation: 本公开涉及照明装置。 照明装置包括发光装置。 发光器件包括第一掺杂半导体层。 发光层设置在第一掺杂半导体层上。 第二掺杂半导体层设置在发光层上。 第二掺杂半导体层具有与第一掺杂半导体层不同的导电类型。 光转换层涂覆在发光器件周围。 A透镜容纳发光器件和光转换层。 透镜包括第一子层和第二子层。 第一和第二子层具有不同的特征。

公开(公告)号：US09074738B2

公开(公告)日：2015-07-07

申请号：US14272600

申请日：2014-05-08

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

IPC: F21V9/16 ,  F21V3/00 ,  F21K99/00 ,  F21V29/74 ,  F21Y101/02 ,  F21V3/02 ,  F21V13/02 ,  F21Y113/00 ,  F21V29/507

CPC classification number: F21K9/64 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21V13/02 ,  F21V29/507 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  Y10T29/4913

Abstract: A lamp includes a substrate, a plurality of light-emitting devices located over the substrate, and a cap that is located over the light-emitting devices. The plurality of light-emitting devices include a first subset of light-emitting devices and a second subset of light-emitting devices. Each light-emitting device in the first subset is free of a phosphor coating. Each light-emitting device in the second subset includes a phosphor coating. The cap has both photo-conversion properties and light-scattering properties, and the cap is located over the first subset of the light-emitting devices but exposes the second subset of the light-emitting devices.

Abstract translation: 灯包括衬底，位于衬底上方的多个发光器件和位于发光器件上方的帽。 多个发光器件包括发光器件的第一子集和发光器件的第二子集。 第一子集中的每个发光器件都不含磷光体涂层。 第二子集中的每个发光器件包括磷光体涂层。 盖具有光转换性质和光散射性质，并且帽位于发光器件的第一子集之上，但暴露出发光器件的第二子集。