公开(公告)号：US20080305425A1

公开(公告)日：2008-12-11

申请号：US12198540

申请日：2008-08-26

Applicant: Akihiko Kamada ,  Norio Sakai ,  Issei Yamamoto

Inventor： Akihiko Kamada ,  Norio Sakai ,  Issei Yamamoto

IPC: G03G13/20

CPC classification number: H05K1/167 ,  G03G9/081 ,  G03G9/0823 ,  G03G9/0833 ,  G03G9/08711 ,  G03G9/09725 ,  G03G9/0975 ,  G03G13/00 ,  G03G13/013 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/207 ,  H05K2203/0143 ,  H05K2203/0517

Abstract: A method for forming circuit patterns having different resistances. The method includes (1) a first step of forming a first toner image using a first toner and a second toner image using a second toner, each by electrophotography, the first toner containing a resistive material, the second toner having a resistance different from that of the first toner; and (2) a second step of transferring and fixing the first toner image and the second toner image to an object to be printed such as a ceramic green sheet, to form a circuit pattern.

Abstract translation: 一种用于形成具有不同电阻的电路图案的方法。 该方法包括：（1）第一步骤，通过电子照相法使用第一调色剂和第二调色剂形成第一调色剂图像，第一调色剂图像使用第二调色剂，第一调色剂含有电阻材料，第二调色剂的电阻不同于 的第一个墨粉; 和（2）将第一调色剂图像和第二调色剂图像转印并固定到诸如陶瓷生片的待印刷对象上的第二步骤，以形成电路图案。

公开(公告)号：US07450395B2

公开(公告)日：2008-11-11

申请号：US12100479

申请日：2008-04-10

Applicant: Norio Sakai

Inventor： Norio Sakai

IPC: H05K7/00

CPC classification number: H01L25/165 ,  H01L23/24 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09427 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between. Circuit components are provided in portions of a surface of the plate-shaped board, the portions being located inward relative to the frame-shaped board. A sealing resin is filled and cured in a cavity, which is defined by the frame-shaped board and the plate-shaped board. Since the center of each of the connection electrodes on the frame-shaped board is inwardly displaced relative to the center of a corresponding one of the connection electrodes on the plate-shaped board by α, a curing contraction stress of the sealing resin is mitigated by a curing contraction stress of the conductive bonding materials. Thus, deformation of the frame-shaped board is suppressed.

Abstract translation: 电路模块包括板状板上的连接电极和框架形板上的连接电极，其间连接有导电接合材料。 电路部件设置在板状板的表面的一部分中，该部分相对于框状板位于内侧。 密封树脂在由框状板和板状板限定的空腔中填充和固化。 由于框架板上的每个连接电极的中心相对于板状板上相应的一个连接电极的中心向内移位，所以密封树脂的固化收缩应力被减轻 导电接合材料的固化收缩应力。 因此，能够抑制框状板的变形。

公开(公告)号：US06844220B2

公开(公告)日：2005-01-18

申请号：US10637632

申请日：2003-08-11

Applicant: Norio Sakai ,  Isao Kato ,  Mitsuyoshi Nishide

Inventor： Norio Sakai ,  Isao Kato ,  Mitsuyoshi Nishide

IPC: H01G4/252 ,  H01L23/04 ,  H01L23/08 ,  H01L23/10 ,  H01L23/498 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01L21/44

CPC classification number: H05K3/403 ,  H01L23/10 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.

Abstract translation: 多层陶瓷电子部件包括形成在电子部件主体的侧面的切口形成的电子部件体，在形成凹口的内侧面的部分形成有通过分割接合通孔导体而形成的接合电极。 安装到电子部件主体上的盖子具有一个腿，盖的腿位于凹口内。 通过将腿连接到接合电极，盖被固定到电子部件主体。 多层陶瓷电子部件包括LGA（焊盘格栅阵列）型外部端子电极。 多层陶瓷电子部件使得可以安装用于覆盖安装部件的盖而不增加电子部件的平面尺寸，而不会减小用于安装待安装部件的面积。

公开(公告)号：US06760227B2

公开(公告)日：2004-07-06

申请号：US10372616

申请日：2003-02-24

Applicant: Norio Sakai ,  Isao Kato

Inventor： Norio Sakai ,  Isao Kato

IPC: H05K100

CPC classification number: H05K3/3405 ,  H01L23/053 ,  H01L23/10 ,  H01L23/49805 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/4061 ,  H05K3/4629 ,  H05K5/0091 ,  H05K2201/09181 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.

Abstract translation: 多层陶瓷电子部件包括在其侧表面上设置有端子电极的层叠陶瓷体和用于覆盖层叠陶瓷体的盖。 接地端子电极设置在与层叠陶瓷体相对的相对侧表面中的凹口中，多个端子电极平行设置在彼此相对的另一侧表面中的每个凹口中。 这些端子电极通过分割端子通孔导体而形成。 盖被设置成覆盖安装在层叠陶瓷体上的元件，并且盖的脚部设置在凹口中并且接合到接地端子电极。

公开(公告)号：US06582541B2

公开(公告)日：2003-06-24

申请号：US10124409

申请日：2002-04-18

Applicant: Mitsuyoshi Nishide ,  Norio Sakai ,  Akira Baba

Inventor： Mitsuyoshi Nishide ,  Norio Sakai ,  Akira Baba

IPC: B32B3126

CPC classification number: H05K3/4688 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24959 ,  Y10T428/25 ,  H01L2924/00

Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

公开(公告)号：US5635670A

公开(公告)日：1997-06-03

申请号：US589534

申请日：1996-01-05

Applicant: Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

Inventor： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC: H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H02G3/08 ,  H01L23/02 ,  H01R29/00 ,  H05K7/00

CPC classification number: H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H05K3/403 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Abstract translation: 为了提供一种可以减少外部电极的布置间距的多层电子部件，在母层叠体中设置填充有导电材料的通孔，该母层叠体通过在分开的位置层叠多个绝缘片而插入导体膜而获得 通过切割。 导电材料限定通过切割母层压板而获得的各个多层电子部件的外部电极。 不需要形成外部电极的特定步骤，并且可以在母体层叠体的状态下有效地测量每个多层电子部件的特性。

公开(公告)号：US5435875A

公开(公告)日：1995-07-25

申请号：US186423

申请日：1994-01-25

Applicant: Tsuyoshi Saitoh ,  Shoichi Kawabata ,  Norio Sakai

Inventor： Tsuyoshi Saitoh ,  Shoichi Kawabata ,  Norio Sakai

IPC: B28B3/02 ,  B32B18/00 ,  H01L21/48 ,  H01L23/057 ,  H01L23/12 ,  H05K3/46 ,  B29C31/04 ,  B32B31/04 ,  B32B31/20

CPC classification number: B32B38/1841 ,  B32B18/00 ,  B32B37/0023 ,  B32B37/10 ,  B32B37/26 ,  H01L21/4807 ,  H01L21/4857 ,  H01L23/057 ,  B32B2315/02 ,  B32B2457/08 ,  C04B2237/32 ,  C04B2237/62 ,  C04B2237/704 ,  H01L2924/0002

Abstract: When a plurality of ceramic green sheets provided with cavity holes are respectively pressed by an elastic member, rigid plates which are sized to be in contact with overall major surfaces of the respective ceramic green sheets and provided with holes equivalent to or slightly smaller than the cavity holes are interposed between the elastic member and the respective ceramic green sheets. Thus, the cavity holes are inhibited from undesired deformation caused by deformation of the elastic member.

Abstract translation: 当设置有空腔孔的多个陶瓷生坯分别被弹性部件按压时，刚性板的尺寸设计成与各个陶瓷生坯的整个主表面接触并且设置有等于或略小于腔的孔 在弹性构件和各个陶瓷生片之间插入孔。 因此，可以防止空腔孔被弹性构件的变形引起的不期望的变形。

公开(公告)号：US5274916A

公开(公告)日：1994-01-04

申请号：US992161

申请日：1992-12-17

Applicant: Shoichi Kawabata ,  Norio Sakai ,  Kenji Minowa

Inventor： Shoichi Kawabata ,  Norio Sakai ,  Kenji Minowa

IPC: H01F27/00 ,  H01G4/12 ,  H01L21/48 ,  H01L23/12 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  B44C1/22

CPC classification number: H05K3/4061 ,  H01L21/481 ,  H01L21/486 ,  H05K1/0306 ,  H05K1/092 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/082 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: A ceramic green sheet is formed on a carrier film; both the ceramic green sheet and the carrier film are cut into prescribed dimensions; a hole to serve as a via hole is provided in the ceramic green sheet while the ceramic green sheet is maintained in the state backed with the carrier film; the hole is filled up with a conductive paste while the ceramic green sheet is in this state; an interconnection pattern is formed on the ceramic green sheet which is still backed up with the carrier film; and the ceramic green sheet is then separated from the carrier film and is then immediately stacked in order on other ceramic green sheets. Thus, it is possible to improve the accuracy in stacking of ceramic green sheets in a method of manufacturing a ceramic multilayer circuit board having portions electrically connected through via holes.

Abstract translation: 在载体膜上形成陶瓷生片; 将陶瓷生片和载体膜切割成规定尺寸; 在陶瓷生片中设置用作通孔的孔，同时陶瓷生片保持在载体膜的状态下; 当陶瓷生坯处于该状态时，用导电膏填充孔; 在陶瓷生片上形成有与载体膜相配合的互连图案; 然后将陶瓷生片与载体膜分离，然后依次堆叠在其它陶瓷生片上。 因此，在具有通过通孔电连接的部分的陶瓷多层电路板的制造方法中，可以提高陶瓷生片的层叠精度。

公开(公告)号：US5261986A

公开(公告)日：1993-11-16

申请号：US799043

申请日：1991-11-26

Applicant: Shoichi Kawabata ,  Hiromichi Wakatsuki ,  Norio Sakai ,  Keiichi Okada

Inventor： Shoichi Kawabata ,  Hiromichi Wakatsuki ,  Norio Sakai ,  Keiichi Okada

IPC: H01G4/12 ,  B28B3/02 ,  B28B11/00 ,  B28B13/04 ,  H01G4/30 ,  H01G4/40 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  C04B37/00

CPC classification number: H05K3/4629 ,  B28B11/003 ,  B28B13/04 ,  B28B3/024 ,  H01G4/308 ,  H01G4/40 ,  H05K3/4638 ,  H05K1/0269 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09781 ,  H05K2203/166 ,  Y10T156/1093

Abstract: A method of fabricating a ceramic laminated electronic component including the steps of preparing a plurality of ceramic green sheets each having electrode pastes in a plurality of regions and having positioning marks printed in positions having a constant positional relationship to the electrode pastes, removing wrinkles in each of the ceramic green sheets to flatten the ceramic green sheet on a suction plate, and transferring the flattened ceramic green sheet to a laminating stage by a suction chuck, laminating the ceramic green sheet on the laminating stage on the basis of the above positioning marks, and preliminarily fixing the ceramic green sheets to each other in the case of the lamination in obtaining a mother ceramic laminated body for the ceramic laminated electronic component.

Abstract translation: 一种制造陶瓷层压电子部件的方法，包括以下步骤：在多个区域中制备多个具有电极浆料的陶瓷生片，并将定位标记印刷在与电极浆料具有恒定位置关系的位置，从而去除每个 的陶瓷生片将吸附板上的陶瓷生片平坦化，并通过吸盘将平坦化的陶瓷生片转移到层压台，基于上述定位标记将陶瓷生片层压在层压台上， 并且在层叠的情况下，预先将陶瓷生片彼此固定，以获得用于陶瓷层叠电子部件的母陶瓷层叠体。

公开(公告)号：US4848106A

公开(公告)日：1989-07-18

申请号：US158240

申请日：1988-02-19

Applicant: Shoichi Hayashi ,  Norio Sakai ,  Hidetoshi Ishihara

Inventor： Shoichi Hayashi ,  Norio Sakai ,  Hidetoshi Ishihara

IPC: B30B9/22 ,  D06F47/06

CPC classification number: D06F47/06 ,  B30B9/22

Abstract: The invention resides in a compression membrane for wringing liquid out of an object to be compressed, characterized in that its marginal portion whose width is of the order of 15%-35% of the width in the radial direction of the membrane body is made smaller in stretchability than the other portion, whereby no tear of the object to be compressed does not tear during the dehydration thereof.

Abstract translation: 本发明涉及一种用于将液体从待压缩物体中拧出的压缩膜，其特征在于，其宽度为膜体径向宽度的15％-35％的边缘部分变小 在拉伸性方面比其他部分的拉伸性好，因此在其脱水过程中，被压缩物体的撕裂不会撕裂。