公开(公告)号：US10222344B2

公开(公告)日：2019-03-05

申请号：US15257925

申请日：2016-09-07

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan Ho

IPC: G01N27/04 ,  G01N27/12 ,  G01N27/27

Abstract: A gas sensor including a first sensing component, a second sensing component and a voltage enhancement circuit is provided. The first sensing component is coupled between a first voltage and a first node, where an impedance value of the first sensing component is proportional to a gas concentration. The second sensing component is coupled between the first node and a second voltage, where an impedance value of the second sensing component is inversely proportional to the gas concentration. The voltage enhancement circuit is coupled to the first node to receive a node voltage provided by the first node, and correspondingly provides a gas sensing voltage.

公开(公告)号：US10161844B2

公开(公告)日：2018-12-25

申请号：US15252245

申请日：2016-08-31

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan Ho ,  Yi-Der Wu

IPC: G01N21/00 ,  G01N15/00

Abstract: A particle sensing device, which senses a particulate matter by using a light beam from a light source, is provided. The particle sensing device includes a columnar array and a light-sensing element. The columnar array is disposed at a downstream side of a traveling path of the light beam. The columnar array has a plurality of columnar objects. A gap is existed between two adjacent columnar objects. The light-sensing element is disposed opposite to the columnar array and at a downstream side of a traveling path of the light beam. Wherein, the traveling path of the light beam is parallel with a length direction of each columnar object. And, the light beam passes through the gap for arriving at the light-sensing element. The particle sensing device can sense the particulate matter satisfactorily and can be simply integrated into various electronic apparatuses.

公开(公告)号：US10101291B2

公开(公告)日：2018-10-16

申请号：US15364177

申请日：2016-11-29

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan Ho

IPC: G01N27/00 ,  G01N27/12 ,  G01N33/00 ,  H04M1/725 ,  H04M1/02 ,  H04M1/21

Abstract: A mobile device having a gas-sensing function including a case body, a backlight module and a gas sensor is provided. The case body has at least one through hole. The backlight module is disposed in the case body. The gas sensor is disposed in the case body. The gas sensor includes a gas-sensing material layer for sensing a gas. The gas-sensing material layer receives a visible light emitted from the backlight module and is activated by the visible light.

公开(公告)号：US20180231481A1

公开(公告)日：2018-08-16

申请号：US15668709

申请日：2017-08-04

Applicant: Winbond Electronics Corp.

Inventor： Ming-Chih Tsai ,  Yu-Hsuan Ho

IPC: G01N27/04 ,  G01N33/00

Abstract: A gas sensor includes a first substrate, at least one first electrode, a sensing structure, at least one second electrode, and a second substrate. The at least one first electrode is located on the first substrate. The sensing structure is located on the at least one first electrode and the first substrate, and the sensing structure includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer having a first conductive type covers the first substrate and the at least one first electrode; the second semiconductor layer having a second conductive type is located on the first semiconductor layer. The at least one second electrode covers the sensing structure. The second substrate covers the at least one second electrode and the sensing structure.

公开(公告)号：US20180195992A1

公开(公告)日：2018-07-12

申请号：US15862634

申请日：2018-01-05

Applicant: Winbond Electronics Corp.

Inventor： Ming-Chih Tsai ,  Yu-Hsuan Ho

IPC: G01N27/12 ,  H01B1/24 ,  C08K3/08 ,  C08K3/04 ,  B05D5/04 ,  B82Y30/00 ,  B81B3/00 ,  C08J7/04

Abstract: A sensor, a composite material and a method of manufacturing the same are provided. The sensor includes a first electrode, a second electrode, and a sensing material layer. The first electrode and the second electrode are separated from each other. The sensing material layer is located between the first electrode and the second electrode and covers the first electrode and the second electrode. The sensing material layer includes the composite material including a conductive polymer and a metal oxide. The conductive polymer has a hydrophilic end. The metal oxide is connected to the hydrophilic end of the conductive polymer. The metal oxide includes a metal oxide precursor.

公开(公告)号：US10001707B2

公开(公告)日：2018-06-19

申请号：US15296335

申请日：2016-10-18

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan Ho

IPC: G03F7/20

CPC classification number: G03F7/2035 ,  G03F7/0037 ,  G03F7/2022 ,  G03F7/2051 ,  G03F7/2053 ,  G03F7/70383 ,  G03F7/70416

Abstract: An exposure method is provided. The exposure method includes coating a photo-curable material on a substrate, and exposing a portion of the photo-curable material by providing a first light source through an optical fiber to form a first photo-cured material. The optical fiber includes a light output end and a cone portion that tapers toward the light output end. The photo-curable material not exposed by the first light source is removed while leaving the first photo-cured material. Exposure equipment for performing the exposure method and a 3-dimensional structure formed thereby are also described.

公开(公告)号：US09955584B2

公开(公告)日：2018-04-24

申请号：US15136999

申请日：2016-04-25

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan Ho

IPC: H05K3/12 ,  H05K3/00 ,  H05K3/10

CPC classification number: G03F7/0002 ,  B82Y30/00 ,  B82Y40/00 ,  H05K3/1275 ,  H05K2203/0108

Abstract: A stamp that is configured to be employed in a printed circuit process, a method of fabricating the stamp, and a printed circuit process are provided, and the stamp includes a main structure, a micro-protrusion structure, and a plurality of nano-conical structures. The micro-protrusion structure is located on the main structure. The nano-conical structures are located on the main structure and surround the micro-protrusion structure.

公开(公告)号：US20170370863A1

公开(公告)日：2017-12-28

申请号：US15257925

申请日：2016-09-07

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan Ho

IPC: G01N27/04

CPC classification number: G01N27/04 ,  G01N27/12 ,  G01N27/27

Abstract: A gas sensor including a first sensing component, a second sensing component and a voltage enhancement circuit is provided. The first sensing component is coupled between a first voltage and a first node, where an impedance value of the first sensing component is proportional to a gas concentration. The second sensing component is coupled between the first node and a second voltage, where an impedance value of the second sensing component is inversely proportional to the gas concentration. The voltage enhancement circuit is coupled to the first node to receive a node voltage provided by the first node, and correspondingly provides a gas sensing voltage.

公开(公告)号：US20170295639A1

公开(公告)日：2017-10-12

申请号：US15253841

申请日：2016-08-31

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan Ho

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/12 ,  H01L21/02 ,  H01L29/786 ,  H01L29/45 ,  H01L21/288 ,  H01L29/66 ,  H05K1/09 ,  H05K3/22

CPC classification number: H05K1/0201 ,  H01L21/02175 ,  H01L21/02186 ,  H01L21/02288 ,  H01L21/288 ,  H01L29/45 ,  H01L29/66742 ,  H01L29/78618 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/097 ,  H05K3/12 ,  H05K3/22 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2203/0783 ,  H05K2203/1194

Abstract: A printed circuit, a thin film transistor and manufacturing methods thereof are provided. The printed circuit includes a plurality of metal nanostructures and a metal oxide layer. The metal oxide layer is disposed on a surface of the metal nanostructures and fills a space at an intersection of the metal nanostructures. The metal oxide layer disposed on the surface of the metal nanostructures has a thickness of 0.1 nm to 10 nm.