公开(公告)号：US09981841B2

公开(公告)日：2018-05-29

申请号：US15595711

申请日：2017-05-15

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00309 ,  B81C2203/0118

Abstract: A micro-electromechanical systems (MEMS) device includes a MEMS substrate having a first opening, a second opening, and a membrane layer comprising a first membrane disposed over the first opening and a second membrane disposed over the second opening. The MEMS device also includes a carrier substrate bonded to a first side of the MEMS substrate, the carrier substrate having a first cavity exposing the first membrane and a second cavity exposing the second membrane, and a cap substrate bonded to a second side of the MEMS substrate. The cap substrate has a third cavity connected to the first opening and a fourth cavity connected to the second opening. The first membrane, the first cavity, and the third cavity are part of a pressure sensor. The fourth cavity extends completely through the cap substrate. The second membrane, the second cavity, and the fourth cavity are part of a microphone.

公开(公告)号：US20180141803A1

公开(公告)日：2018-05-24

申请号：US15807811

申请日：2017-11-09

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0006 ,  B81B2201/0235 ,  B81B2207/012 ,  B81C1/00095 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0792

Abstract: A MEMS component including a first substrate having at least one first insulating layer and a first metallic coating on a first side; and including a second substrate having at least one second insulating layer and a second metallic coating on a second side, the second substrate including a micromechanical functional element, which is connected electroconductively to the second metallic layer. The first side and the second side are positioned on each other, the first insulating layer and the second insulating layer being interconnected, and the first metallic coating and the second metallic coating being interconnected. A method for manufacturing a MEMS component is also described.

公开(公告)号：US09975760B2

公开(公告)日：2018-05-22

申请号：US15195061

申请日：2016-06-28

Applicant: Robert Bosch GmbH

Inventor： Mikko VA Suvanto

IPC: H01L29/84 ,  B81B7/00 ,  B81C1/00 ,  H04R1/32

CPC classification number: B81B7/008 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81C1/0023 ,  H01L2224/48137 ,  H04R1/326 ,  H04R2201/003

Abstract: A microelectromechanical system (MEMS) sensor device includes a package housing having a top member, bottom member, and a spacer coupled the top member to the bottom member, defining a cavity. At least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing. A first opening formed on the package housing a control device embedded within the package housing is electrically coupled to the sensor circuit and is controlled to tune the MEMS sensor from a directional mode to an omni-directional mode.

公开(公告)号：US09975759B2

公开(公告)日：2018-05-22

申请号：US15647107

申请日：2017-07-11

Applicant: mCube, Inc.

Inventor： Chien Chen Lee ,  Tzu Feng Chang

IPC: H01L29/66 ,  B81B7/00 ,  B81C1/00 ,  G01P15/08 ,  G01R33/02 ,  G01C19/5783 ,  G01L1/00 ,  B81B3/00 ,  G01L9/00 ,  G01C19/5719

CPC classification number: B81B7/0074 ,  B81B3/0035 ,  B81B3/0062 ,  B81B3/0072 ,  B81B7/0032 ,  B81B7/0045 ,  B81B7/0048 ,  B81B7/0051 ,  B81B7/0054 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/0023 ,  B81C1/00261 ,  B81C1/00269 ,  B81C2203/0792 ,  G01C19/5719 ,  G01C19/5783 ,  G01L1/00 ,  G01L9/0042 ,  G01L19/0069 ,  G01L19/147 ,  G01P15/0802 ,  G01R33/02 ,  H04R2201/003

Abstract: A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

公开(公告)号：US20180111823A1

公开(公告)日：2018-04-26

申请号：US15334619

申请日：2016-10-26

Applicant: Analog Devices, Inc.

Inventor： Thomas Kieran Nunan ,  Li Chen

IPC: B81B7/00 ,  H01L21/768 ,  B81C3/00 ,  H01L23/48

CPC classification number: B81B7/0006 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00238 ,  B81C3/001 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/0792 ,  H01L21/76898 ,  H01L23/481

Abstract: Integrated circuit substrates having through silicon vias (TSVs) are described. The TSVs are vias extending through the silicon substrate in which the integrated circuitry is formed. The TSVs may be formed prior to formation of the integrated circuitry on the integrated circuit substrate, allowing the use of via materials which can be fabricated at relatively small sizes. The integrated circuit substrates may be bonded with a substrate having a microelectromechanical systems (MEMS) device. In some such situations, the circuitry of the integrated circuit substrate may face away from the MEMS substrate since the TSVs may provide electrical connection from the circuitry side of the integrated circuit substrate to the MEMS device.

公开(公告)号：US20180106828A1

公开(公告)日：2018-04-19

申请号：US15785891

申请日：2017-10-17

Applicant: Robert Bosch GmbH

Inventor： Antoine Puygranier ,  Denis Gugel ,  Guenther-Nino-Carlo Ullrich ,  Markus Linck-Lescanne ,  Sebastian Guenther ,  Timm Hoehr

IPC: G01P15/03

CPC classification number: G01P15/03 ,  B81B2201/0235 ,  B81C1/00333 ,  B81C2203/0145 ,  G01P15/0802 ,  G01P2015/0831

Abstract: A micromechanical z-acceleration sensor, including a seismic mass element including a torsion spring; the torsion spring including an anchor element, with the aid of which the torsion spring is connected to a substrate; the torsion spring being connected at both ends to the seismic mass element with the aid of a bar-shaped connecting element designed as normal with respect to the torsion spring in the plane of the seismic mass element.

公开(公告)号：US09919914B2

公开(公告)日：2018-03-20

申请号：US15160884

申请日：2016-05-20

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Wen Cheng ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Hung-Chia Tsai ,  Yi-Chuan Teng

IPC: B81B7/00 ,  B81C1/00 ,  B81B7/02 ,  H01L21/78 ,  H01L23/053 ,  H01L23/31

CPC classification number: B81B7/0006 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/098 ,  B81C1/0023 ,  B81C2203/0154 ,  B81C2203/0714 ,  H01L21/78 ,  H01L23/053 ,  H01L23/31 ,  H01L2924/16152 ,  H01L2924/16235

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

公开(公告)号：US20180074090A1

公开(公告)日：2018-03-15

申请号：US15558807

申请日：2016-03-17

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel

IPC: G01P15/097 ,  G01P15/08 ,  G01P15/125 ,  G01C19/574 ,  G01C19/5712 ,  G01C19/5769 ,  B81B7/00 ,  B81C1/00 ,  G01L9/00

CPC classification number: G01P15/097 ,  B81B7/0061 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00238 ,  B81C1/00309 ,  G01C19/5712 ,  G01C19/574 ,  G01C19/5762 ,  G01C19/5769 ,  G01D21/02 ,  G01L9/0045 ,  G01L9/0073 ,  G01L19/0076 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01R33/028 ,  G01R33/0286

Abstract: A single Micro-Electro-Mechanical System (MEMS) sensor chip is provided, for measuring multiple parameters, referred to as multiple degrees of freedom (DOF). The sensor chip comprises a central MEMS wafer bonded to a top cap wafer and a bottom cap wafer, all three wafer being electrically conductive. The sensor comprises at least two distinct sensors, each patterned in the electrically conductive MEMS wafer and in at least one of the top and bottom cap wafer. Insulated conducting pathways extend from electrical connections on the top or bottom cap wafers, through at least one of the electrically conductive top cap and bottom cap wafers, and through the electrically conductive MEMS wafer, to the sensors, for conducting electrical signals between the sensors and the electrical connections. The two or more distinct sensors are enclosed by the top and bottom cap wafers and by the outer frame of MEMS wafer.

公开(公告)号：US09890037B2

公开(公告)日：2018-02-13

申请号：US15502554

申请日：2015-06-29

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Masatoshi Kanamaru ,  Masahide Hayashi ,  Masashi Yura ,  Heewon Jeong

IPC: B81B7/00 ,  G01C19/574

CPC classification number: B81B7/0064 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/045 ,  B81B2203/0136 ,  B81C99/0045 ,  G01C19/574 ,  G01P15/08 ,  G01P15/125 ,  G01P21/00 ,  H01L29/84

Abstract: For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.

公开(公告)号：US20180038887A1

公开(公告)日：2018-02-08

申请号：US15228229

申请日：2016-08-04

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  William A. Clark ,  Michael Judy

IPC: G01P15/125

CPC classification number: G01P15/125 ,  B81B2201/0235 ,  B81B2203/0127 ,  G01P15/18 ,  G01P2015/084

Abstract: A microelectromechanical systems (MEMS) accelerometer is described. The MEMS accelerometer may comprise a proof mass configured to sense accelerations in a direction parallel the plane of the proof mass, and a plurality of compensation structures. The proof mass may be connected to one or more anchors through springs. The compensation structures may be coupled to the substrate of the MEMS accelerometer through a rigid connection to respective anchors. A compensation structure may comprise at least one compensation electrode forming one or more lateral compensation capacitors. The compensation capacitor(s) may be configured to sense displacement of the anchor to which the compensation structures is connected.