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公开(公告)号：US11649161B2
公开(公告)日：2023-05-16
申请号：US17385084
申请日：2021-07-26
Applicant: Knowles Electronics, LLC
Inventor： Vahid Naderyan , Mohammad Mohammadi , Xin Song
CPC classification number: B81B3/007 , H04R7/04 , B81B2201/0257 , B81B2203/0127 , B81B2203/0361 , B81B2203/04 , B81B2207/012 , B81B2207/056 , H04R2201/003
Abstract: A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.
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公开(公告)号：US20190241429A1
公开(公告)日：2019-08-08
申请号：US16315632
申请日：2017-07-10
Applicant: Robert Bosch GmbH
Inventor： Mikko VA Suvanto
CPC classification number: B81C1/0023 , B81B7/0032 , B81B7/02 , B81B2201/0257 , B81C2203/0792
Abstract: A MEMS sensor device package comprises a sensor assembly comprising a sensor device and a sensor circuit communicating coupled to the sensor device, The MEMS sensor device package further comprises an assembly package housing having a top member and a bottom member attached to the top member for encapsulating the sensor assembly. A hybrid galvanic connection system is provided to couple the sensor device to the sensor circuit.
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公开(公告)号：US20190238998A1
公开(公告)日：2019-08-01
申请号：US16236400
申请日：2018-12-29
Inventor： Jinyu Zhang
CPC classification number: H04R19/04 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , H04R1/04 , H04R7/04 , H04R2201/003
Abstract: A microphone is provided, including a base having a chamber; and a capacitor system fixed to the base. The capacitor system includes a backplate fixed to the base and a diaphragm located in the chamber. The backplate and the diaphragm form a capacitor structure. The diaphragm is fixed to the backplate and partitions the chamber into a front chamber and a back chamber. The backplate is provided with a sound receiving hole in communication with the front chamber. The base or the backplate is provided with a vent hole for communicating the back chamber with the outside. The microphone provided by the present disclosure has the advantages of high reliability.
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公开(公告)号：US10343898B1
公开(公告)日：2019-07-09
申请号：US16025074
申请日：2018-07-02
Applicant: Fortemedia, Inc.
Inventor： Jien-Ming Chen , Nai-Hao Kuo , Wen-Shan Lin , Hsin-Li Lee
CPC classification number: B81B7/02 , B81B2201/0257 , B81B2203/0127 , H04R7/08 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.
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公开(公告)号：US20190185317A1
公开(公告)日：2019-06-20
申请号：US16206861
申请日：2018-11-30
Applicant: INVENSENSE, INC.
Inventor： Jongwoo Shin , Houri Johari-Galle , Bongsang Kim , Joseph Seeger , Dongyang Kang
CPC classification number: B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0292 , B81C1/00523 , B81C2203/0785
Abstract: A device comprising a micro-electro-mechanical system (MEMS) substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor (CMOS) substrate is presented herein. The MEMS substrate comprises defined protrusions of respective distinct heights from a surface of the MEMS substrate, and the MEMS substrate is bonded to the CMOS substrate. In an aspect, the defined protrusions can be formed from the MEMS substrate. In another aspect, the defined protrusions can be deposited on, or attached to, the MEMS substrate. In yet another aspect, the MEMS substrate comprises monocrystalline silicon and/or polysilicon. In yet even another aspect, the defined protrusions comprise respective electrodes of sensors of the device.
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Patent Agency Ranking
公开(公告)号：US20190152770A1
公开(公告)日：2019-05-23
申请号：US16255292
申请日：2019-01-23
Applicant: Amkor Technology, Inc.
Inventor： YungWoo Lee , ByungJun Kim , DongHyun Bang , EunNaRa Cho , Adrian Arcedera , JaeUng Lee
IPC: B81B7/00
CPC classification number: B81B7/0061 , B81B2201/0257 , B81B2207/012 , H01L2224/48137 , H01L2224/73265 , H01L2924/15151
Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
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公开(公告)号：US20180332390A1
公开(公告)日：2018-11-15
申请号：US16030617
申请日：2018-07-09
Applicant: INVENSENSE, INC.
Inventor： Kieran Harney , Adrianus Maria Lafort , Brian Moss , Dion Ivo De Roo
CPC classification number: H04R3/00 , B81B3/0013 , B81B7/008 , B81B2201/0257 , H02M3/07 , H03F3/183 , H03F3/45071 , H03F2200/03 , H04R3/04 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.
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公开(公告)号：US10057690B2
公开(公告)日：2018-08-21
申请号：US14955341
申请日：2015-12-01
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo
CPC classification number: H04R19/04 , B81B2201/0257 , H04R1/025 , H04R17/005 , H04R17/02 , H04R31/00 , H04R31/006 , H04R2201/003 , H04R2499/13
Abstract: A detachable microphone includes: a body part made of a flexible polymer; a capacitance part positioned in the body part and including a support interposed between a first capacitive electrode and a second capacitive electrode; and a piezoelectric part positioned on the capacitance part and positioned in the body part, and including a piezoelectric body interposed between a first piezoelectric electrode and a second piezoelectric electrode.
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公开(公告)号：US10057689B2
公开(公告)日：2018-08-21
申请号：US15304058
申请日：2014-08-26
Applicant: GOERTEK INC.
Inventor： Quanbo Zou
CPC classification number: H04R19/005 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , B81C1/00158 , H04R7/14 , H04R19/02 , H04R2201/003
Abstract: The present invention provides a silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate, wherein the MEMS acoustoelectric chip comprises a corrugated diaphragm on a silicon substrate; and one side surface of the MEMS acoustoelectric chip is metalized, and the metalized side surface of the MEMS acoustoelectric chip is connected with the PCB substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths on MEMS acoustoelectric chip, which is led out to a first PCB metal path as one electrode. A second PCB metal path below the MEMS chip forms another electrode of the electrostatic actuator. The silicon speaker provided by the present invention lowers manufacturing costs of the speaker, and allows the diaphragm to generate high and repeatable/reliable sound pressure upon large displacements so as to improve the sounding effects of the speaker.
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公开(公告)号：US20180234774A1
公开(公告)日：2018-08-16
申请号：US15897946
申请日：2018-02-15
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Gerhard Metzger-Brueckl , Johann Strasser , Carsten Ahrens
CPC classification number: H04R19/04 , B81B3/001 , B81B3/0021 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , B81B2203/0163 , B81B2203/04 , B81C1/00182 , H04R19/005 , H04R31/003 , H04R2201/003
Abstract: A microelectromechanical microphone includes a reference electrode, a first membrane arranged on a first side of the reference electrode and displaceable by sound to be detected, and a second membrane arranged on a second side of the reference electrode, said second side being situated opposite the first side of the reference electrode, and displaceable by sound to be detected. A region of one from the first and second membranes that is displaceable by sound relative to the reference electrode, independently of said region's position relative to the reference electrode, can comprise a planar section and also an undulatory section adjoining the planar section and arranged in a region of overlap one of the first membrane or the second membrane with the other one of the first membrane and or the second membrane.
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