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    Electrically conductive cement
    41.
    发明授权
    Electrically conductive cement 失效
    导电水泥

    公开(公告)号：US5183593A

    公开(公告)日：1993-02-02

    申请号：US533682

    申请日：1990-06-04

    Applicant: David Durand ,  David P. Vieau ,  Tai S. Wei ,  Ang-Ling Chu

    Inventor： David Durand ,  David P. Vieau ,  Tai S. Wei ,  Ang-Ling Chu

    IPC: C08K3/08 ,  C08G59/00 ,  C08K3/02 ,  C08K7/00 ,  C08K9/02 ,  C08L63/00 ,  C08L75/00 ,  C08L75/04 ,  C08L83/04 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32

    CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023

    Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

    Abstract translation: 用于粘合导电配合表面的导电胶粘剂在高湿度条件下提供基本稳定的导电特性; 包括提供超过约6.8％（体积）的体积收缩率的载体和包含附聚物，颗粒，粉末，薄片，涂覆的镍颗粒和涂覆的玻璃球的导电填料，其具有保持稳定的电气的尺寸和表面特性 通过与电气部件引线形成防潮接触来进行接触。 具有大于约6.8％（vol）的未固化状态和固化状态之间的体积收缩率的载体似乎会影响填料颗粒的压实，导致颗粒被强制与要连接的表面增强的电接触并提供一种 测量颗粒本身之间的压实度以增强颗粒到颗粒的传导。 在固化期间聚合物载体的收缩使内部颗粒在足够的压力下被压缩以促使颗粒彼此接合，并且使颗粒渗透可能存在于组分引线上的非导电氧化物。

    Electrical conductor
    42.
    发明授权
    Electrical conductor 失效
    电导体

    公开(公告)号：US4487811A

    公开(公告)日：1984-12-11

    申请号：US461809

    申请日：1983-01-28

    Applicant: Charles W. Eichelberger ,  Robert J. Wojnarowski

    Inventor： Charles W. Eichelberger ,  Robert J. Wojnarowski

    IPC: H05K1/09 ,  H05K3/24 ,  B22F7/04 ,  H05K3/12 ,  H05K3/18

    CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K2201/0125 ,  Y10T428/12014

    Abstract: A low-cost conductor, e.g. a printed circuit, is prepared by applying a mixture of a metallic powder and polymer on a substrate and curing the polymer, followed by an augmentation replacement reaction being effected to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal on the surface exceeds that of the original metal powder at that surface. This procedure produces a contiguous layer of conducting metal on the substrate. The conductors thus formed can easily be soldered without leaching using conventional tin-lead solders.

    Abstract translation: 低成本导体，例如 通过将金属粉末和聚合物的混合物施加到基底上并固化聚合物来制备印刷电路，然后进行增强置换反应以用更贵金属代替一些金属粉末，使得 表面上沉积金属的总体积超过了该表面的原始金属粉末的总体积。 该过程在衬底上产生连续的导电金属层。 这样形成的导体可以容易地被焊接而不用常规的锡铅焊料浸出。

    LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUDED FILM FOR STRETCH TREATMENT, LCP STRETCHED FILM, HEAT-SHRINKABLE LCP STRETCHED FILM, INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
    44.
    发明公开
    LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUDED FILM FOR STRETCH TREATMENT, LCP STRETCHED FILM, HEAT-SHRINKABLE LCP STRETCHED FILM, INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE 审中-公开

    公开(公告)号：US20240032191A1

    公开(公告)日：2024-01-25

    申请号：US18375800

    申请日：2023-10-02

    Applicant: Denka Company Limited

    Inventor： Yusuke MASUDA ,  Naoki OGAWA

    IPC: H05K1/03

    CPC classification number: H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0125 ,  H05K2201/0129

    Abstract: The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 μm or more and 300 μm or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200° C. as measured by a TMA method according to JIS K7197 are each within a range of −30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate:



    (A) a degree of orientation α1(%) of a film surface S1 exposed and a degree of orientation α2(%) of a film surface S2 located at a depth of 5 μm from the film surface S1 satisfy a relationship of −4.0≤[(α2−α1)/α1]×100≤0.0;
    (B) a hardness H1 at a point of a depth of 1 μm located at a position of 1 μm from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy −10.0≤100×(H2−H1)/H1≤0.0.

    Technique for compensating for substrate shrinkage during manufacture of an electronic assembly
    47.
    发明授权
    Technique for compensating for substrate shrinkage during manufacture of an electronic assembly 失效
    用于在电子组件的制造期间补偿基板收缩的技术

    公开(公告)号：US07439083B2

    公开(公告)日：2008-10-21

    申请号：US11105927

    申请日：2005-04-14

    Applicant: M. Ray Fairchild ,  Jerome L. Badgett

    Inventor： M. Ray Fairchild ,  Jerome L. Badgett

    IPC: H01L21/66 ,  H01L23/58

    CPC classification number: H05K1/0266 ,  H05K1/0306 ,  H05K3/0002 ,  H05K3/0005 ,  H05K3/1225 ,  H05K3/1291 ,  H05K3/3484 ,  H05K2201/0125 ,  H05K2203/056 ,  H05K2203/1126

    Abstract: Substrate shrinkage that occurs during manufacture of an electronic assembly is compensated for by the incorporation of a horizontal line, having a plurality of vertical graduations, across a horizontal portion of a substrate and a vertical line, having a plurality of horizontal graduations, across a vertical portion of the substrate. The substrate is then cured and an amount of substrate shrinkage is determined, based upon a location change in the graduations of the horizontal and vertical lines. In this manner, solder can be properly provided on solder pads of the substrate responsive to the amount of substrate shrinkage. As such, electronic components can be properly mounted to the solder pads of the substrate.

    Abstract translation: 在电子组件的制造过程中发生的基板收缩通过结合具有多个垂直刻度的水平线横跨衬底的水平部分和具有多个水平刻度的垂直线跨越垂直线 部分基板。 然后基于水平和垂直线的刻度中的位置变化来固化基底并且确定基底收缩量。 以这种方式，可以根据衬底收缩量适当地在衬底的焊盘上提供焊料。 因此，可以将电子部件适当地安装到基板的焊盘。

    Technique for compensating for substrate shrinkage during manufacture of an electronic assembly
    49.
    发明申请
    Technique for compensating for substrate shrinkage during manufacture of an electronic assembly 失效
    用于在电子组件的制造期间补偿基板收缩的技术

    公开(公告)号：US20060234424A1

    公开(公告)日：2006-10-19

    申请号：US11105927

    申请日：2005-04-14

    Applicant: M. Fairchild ,  Jerome Badgett

    Inventor： M. Fairchild ,  Jerome Badgett

    IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/495

    CPC classification number: H05K1/0266 ,  H05K1/0306 ,  H05K3/0002 ,  H05K3/0005 ,  H05K3/1225 ,  H05K3/1291 ,  H05K3/3484 ,  H05K2201/0125 ,  H05K2203/056 ,  H05K2203/1126

    Abstract: Substrate shrinkage that occurs during manufacture of an electronic assembly is compensated for by the incorporation of a horizontal line, having a plurality of vertical graduations, across a horizontal portion of a substrate and a vertical line, having a plurality of horizontal graduations, across a vertical portion of the substrate. The substrate is then cured and an amount of substrate shrinkage is determined, based upon a location change in the graduations of the horizontal and vertical lines. In this manner, solder can be properly provided on solder pads of the substrate responsive to the amount of substrate shrinkage. As such, electronic components can be properly mounted to the solder pads of the substrate.

    Abstract translation: 在电子组件的制造过程中发生的基板收缩通过结合具有多个垂直刻度的水平线横跨衬底的水平部分和具有多个水平刻度的垂直线跨越垂直线 部分基板。 然后基于水平和垂直线的刻度中的位置变化来固化基底并且确定基底收缩量。 以这种方式，可以根据衬底收缩量适当地在衬底的焊盘上提供焊料。 因此，可以将电子部件适当地安装到基板的焊盘。

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