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    RADIATION-ASSISTED NANOPARTICLE PRINTING
    41.
    发明申请
    RADIATION-ASSISTED NANOPARTICLE PRINTING 审中-公开
    辐射辅助纳米复合印刷

    公开(公告)号：US20110027499A1

    公开(公告)日：2011-02-03

    申请号：US12512975

    申请日：2009-07-30

    Applicant: Heiko Wolf ,  Tobias Kraus ,  Andrea Decker

    Inventor： Heiko Wolf ,  Tobias Kraus ,  Andrea Decker

    IPC: B05D3/06

    CPC classification number: B41M5/398 ,  H05K3/1275 ,  H05K3/207 ,  H05K2201/0257 ,  H05K2203/0113 ,  H05K2203/102 ,  H05K2203/107

    Abstract: A method of nanoparticle printing including: contacting a printing plate with a target substrate, while the printing plate is contacting the target substrate, illuminating nanoparticies on the printing plate with intense flashes of LASER light, or subjecting the nanoparticles to microwave radiation, such that energy is selectively transferred into the particles, increasing a local temperature of the particles which causes an increased interaction of the particles with the target substrate and produces a strong junction and removes the particles from the printing plate; and peeling off the printing plate from the target substrate.

    Abstract translation: 一种纳米颗粒印刷方法，包括：使印版与目标基材接触，同时印版与目标基材接触，用强烈闪光的激光照射印刷板上的纳米颗粒，或使纳米颗粒进行微波辐射，使得能量 选择性地转移到颗粒中，增加颗粒的局部温度，引起颗粒与靶基质的相互作用增加，并产生强连接并从印刷板上除去颗粒; 并从印刷基板上剥离印刷板。

    Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method
    42.
    发明授权
    Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method 有权
    用于形成细铜粒微粒烧结产品的细形状导体的方法以及通过应用所述方法形成铜精细布线和薄铜膜的工艺

    公开(公告)号：US07820232B2

    公开(公告)日：2010-10-26

    申请号：US10556871

    申请日：2004-05-13

    Applicant: Daisuke Itoh ,  Akihito Izumitani ,  Noriaki Hata ,  Yorishige Matsuba

    Inventor： Daisuke Itoh ,  Akihito Izumitani ,  Noriaki Hata ,  Yorishige Matsuba

    IPC: C23C26/00 ,  B05D3/02

    CPC classification number: H05K3/1283 ,  H01B1/22 ,  H05K3/102 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/122

    Abstract: The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 μm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C. or lower under an atmosphere containing a vapor and a gas of a compound having reducibility to reduce the oxide film by a reduction reaction which used the compound having reducibility as a reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and sintering the resultant copper fine particles with each other to form a layer of the sintered product.

    Abstract translation: 本发明提供一种形成具有优异导电性的细微型导电体的铜微粒烧结体型的方法，该方法包括以下步骤：利用含有表面氧化膜的铜微粒的分散体 在比较低的温度下进行包含在图案中的表面氧化膜层或氧化铜微粒的铜微粒的还原处理，并烘烤得到的铜微粒。 具体来说，该过程执行过程; 将其上具有表面氧化膜层的铜微粒或平均粒径为10μm以下的氧化铜微粒分散在基板上; 然后进行一系列的热处理步骤，在含有还原性的化合物的气体和气体的气氛下，在350℃或更低的温度下加热涂层中的颗粒，以通过还原反应来还原氧化膜 其使用具有还原性的化合物作为还原剂，随后重复进行短时间的氧化处理与再还原处理的热处理，并将所得铜微粒彼此烧结以形成烧结产品层。

    Method for producing conductor structures and applications thereof
    43.
    发明授权
    Method for producing conductor structures and applications thereof 失效
    导体结构的制造方法及其应用

    公开(公告)号：US07759160B2

    公开(公告)日：2010-07-20

    申请号：US12155669

    申请日：2008-06-06

    Applicant: Tomi Mattila ,  Ari Alastalo ,  Mark Allen ,  Heikki Seppä

    Inventor： Tomi Mattila ,  Ari Alastalo ,  Mark Allen ,  Heikki Seppä

    IPC: H01L21/44

    CPC classification number: H05K3/105 ,  B81C1/00031 ,  H01L2924/0002 ,  H05K1/095 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/105 ,  Y10S977/762 ,  Y10S977/773 ,  Y10T29/49156 ,  H01L2924/00

    Abstract: This publication discloses a method for forming electrically conducting structures on a substrate. According to the method nanoparticles containing conducting or semiconducting material are applied on the substrate in a dense formation and a voltage is applied over the nanoparticles so as to at least locally increase the conductivity of the formation. According to the invention, the voltage is high enough to cause melting of the nanoparticles in a breakthrough-like manner. With the aid of the invention, small-linewidth structures can be created without high-precision lithography.

    Abstract translation: 该出版物公开了一种在衬底上形成导电结构的方法。 根据该方法，将含有导电或半导体材料的纳米颗粒以密集地层施加在基底上，并且在纳米颗粒上施加电压，以便至少局部地增加地层的导电性。 根据本发明，电压足够高以使纳米颗粒以类似突破的方式熔化。 借助于本发明，可以在没有高精度光刻的情况下创建小线宽结构。

    LEAD SOLDER-FREE ELECTRONICS
    46.
    发明申请
    LEAD SOLDER-FREE ELECTRONICS 有权
    无铅焊接电子

    公开(公告)号：US20100065616A1

    公开(公告)日：2010-03-18

    申请号：US12512315

    申请日：2009-07-30

    Applicant: Alfred A. ZINN

    Inventor： Alfred A. ZINN

    IPC: B23K37/00 ,  H05K1/09 ,  B05D5/12 ,  B22F1/00 ,  C09K3/00

    CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

    Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

    Abstract translation: 组合物可以具有直径为20纳米或更小并具有小于约220℃的熔化温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

    Lead-free solder paste
    47.
    发明申请
    Lead-free solder paste 有权
    无铅锡膏

    公开(公告)号：US20090301606A1

    公开(公告)日：2009-12-10

    申请号：US11920962

    申请日：2006-05-24

    Applicant: Minoru Ueshima

    Inventor： Minoru Ueshima

    IPC: B23K35/22

    CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/262 ,  B23K35/362 ,  H05K2201/0215 ,  H05K2201/0257

    Abstract: In a conventional Sn—Zn based lead-free solder, Zn crystallized to a large size of several tens of micrometers, and it was difficult to suppress the formation of coarse crystallizates and to increase the bonding strength without changing the soldering temperature. There were alloys which improved strength by the addition of a minute amount of a Group 1B metal, but the alloys had an increased melting temperature so that reflow could not be performed with the same temperature profile as for Sn—Pb, so the alloys had advantages and disadvantages.By using a solder paste formed by mixing an ethanol solution containing nanoparticles having a particle diameter of 5-300 nm and containing at least one of Ag, Au, and Cu with a flux and solder powder for an Sn—Zn based lead-free solder paste, the formation of an alloy of Au, Au, or Cu with Zn occurs during soldering, thereby forming fine clusters in the resulting liquid phase of molten solder, and a fine solder structure is obtained following melting.

    Abstract translation: 在常规的Sn-Zn基无铅焊料中，Zn结晶到几十微米的大尺寸，并且难以抑制粗结晶的形成，并且在不改变焊接温度的情况下提高接合强度。 存在通过添加少量1B族金属来提高强度的合金，但是合金具有增加的熔融温度，使得不能以与Sn-Pb相同的温度分布进行回流，因此合金具有优点 和缺点。 通过使用通过将含有粒径为5-300nm并含有Ag，Au和Cu中的至少一种的纳米颗粒的乙醇溶液与用于Sn-Zn基无铅焊料的助焊剂和焊料粉末混合而形成的焊膏 在焊接中发生Au，Au或Cu与Zn的合金的形成，从而在熔融焊料的液相中形成微细的簇，熔融后得到细小的焊料结构。

    METHOD FOR PRODUCING CONDUCTIVE COATING FILM
    49.
    发明申请
    METHOD FOR PRODUCING CONDUCTIVE COATING FILM 有权
    生产导电涂膜的方法

    公开(公告)号：US20090258241A1

    公开(公告)日：2009-10-15

    申请号：US12298847

    申请日：2007-04-26

    Applicant: Kinya Shiraishi ,  Kaori Sakaguchi

    Inventor： Kinya Shiraishi ,  Kaori Sakaguchi

    IPC: B05D3/06 ,  H01B1/20 ,  B32B15/04

    CPC classification number: H05K3/386 ,  C09D11/30 ,  H01B5/14 ,  H05K3/102 ,  H05K3/12 ,  H05K2201/0257 ,  H05K2203/121 ,  H05K2203/122 ,  Y10T428/31678

    Abstract: A conductive coating film is formed on a substrate by bringing a conductive material covered with a protective material into contact with a material having anion exchange ability, through such a process wherein an anion exchange layer containing a material having anion exchange ability is formed on a substrate and then a layer containing a conductive material covered with a protective material is formed on the anion exchange layer, or alternatively through such a process wherein a layer containing a conductive material covered with a protective material is formed on a substrate and then an anion exchange layer containing a material having anion exchange ability is formed on the layer containing a conductive material. The anion exchange layer and the layer containing a conductive material may be formed by coating, printing or the like. By using this method, a conductive coating film having excellent adhesion to a substrate can be formed on an ordinary paper substrate, plastic substrate and glass substrate at low temperature in short time.

    Abstract translation: 通过使覆盖有保护材料的导电材料与具有阴离子交换能力的材料接触来形成导电涂膜，通过这样的方法，其中在基板上形成含有具有阴离子交换能力的阴离子交换层 然后在阴离子交换层上形成包含被保护材料覆盖的导电材料的层，或者通过这样一种方法，其中在衬底上形成包含被保护材料覆盖的导电材料的层，然后形成阴离子交换层 含有具有阴离子交换能力的材料形成在含有导电材料的层上。 阴离子交换层和含有导电材料的层可以通过涂布，印刷等形成。 通过使用该方法，可以在普通的纸基材，塑料基板和玻璃基板上在短时间内在低温下形成对基板具有优异粘附性的导电性涂膜。

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